Abstract: A semiconductor memory device includes a memory cell array, a repair control circuit and a refresh control circuit. The memory cell array includes a plurality of memory cells and a plurality of redundancy memory cells. The repair control circuit receives a repair command and performs a repair operation on a first defective memory cell among the plurality of memory cells during a repair mode. The semiconductor memory device may operate in a repair mode in response to the repair command. The refresh control circuit performs a refresh operation on non-defective ones of the plurality of memory cells during the repair mode.

Abstract: A method for estimating a battery consumption state of a mobile communication terminal is provided. The method includes building a database with battery characteristic information changing according to at least one of a temperature and an aging characteristic of a battery supplying power to the mobile communication terminal, and estimating a power consumption of the mobile communication terminal and a battery drain rate based on the battery characteristic information and displaying estimated information.

Abstract: An exemplary content engine includes a content gateway configured to analyze and route content requests to a content server. The content server can be a cache server or a mobile content server. The cache server can be configured to receive and store cacheable web content from a controller that is configured to receive the cacheable web content from at least one cacheable web content provider, such as a web server, and route the content to the cache server. The mobile content server can be configured to receive, from the controller, and store the digital media content. The controller can be further configured to receive the digital media content from at least one external content server and route the content to the mobile content server. The content gateway can be further configured to receive non-cacheable web content from at least one non-cacheable web content provider.

Abstract: The present invention provides a composition for developing a photoresist containing a carboxyl group (—COOH) and a method of developing a photoresist using the composition. The composition includes: a first solution including a salt containing a monovalent cationic component; and a second solution including a salt containing a bivalent cationic component. The composition for photoresist development is advantageous in that the developing depth of a photoresist can be controlled, and the developed surface of a photoresist is flat, thereby enabling the photoresist to be developed to realize precise three-dimensional packaging.

Abstract: A method for forming bumps and a substrate including the bumps. The method includes: coating a solder resist on a substrate and electrodes formed on the substrate: performing laser etching treatment on the solder resist to form openings for forming bumps; printing a composition for forming bumps in the openings for forming bumps; and performing a reflowing process. Accordingly, the method can decrease the number of processes and realize a fine bump pitch of 90 ?m or less at the time of forming bumps. Further, the method can also decrease the number of times that alignment is performed, due to the decrease in the number of processes.

Abstract: Provided are a thin film structure capable of remarkably reducing the defect density of gallium nitride (GaN), and a method of fabricating the same. The thin film structure includes a supporting substrate including sapphire, and an epilayer disposed on the supporting substrate and including gallium nitride (GaN). An upper part of the supporting substrate facing the epilayer includes a layer of sapphire into which silicon (Si) is diffused or ion-implanted through a top surface of the supporting substrate.

Abstract: Disclosed is a touch screen panel, including: a glass substrate including an active area and a non-active area; enhancement layers formed on upper and lower surfaces of the glass substrate; sensing patterns disposed on a surface of one of the enhancement layers in the active area; and sensing lines disposed in the non-active area, and electrically connected with the sensing patterns. Here, a side surface of the glass substrate may include a plurality of blunt areas depressed in a shape of a curved surface.

Abstract: A glass-reinforcing composition and method of using the same, the composition including 1 weight % to 20 weight % of hydrofluoric acid, 0.1 weight % to 5 weight % of ammonium fluoride, 1 weight % to 20 weight % of an inorganic acid, an organic acid, or 1 weight % to 10 weight % of an organic acid salt, and a remainder of water.

Abstract: Disclosed herein are an embedded board and a method of manufacturing the same. According to a preferred embodiment of the present invention, the embedded board includes: an outer layer insulating layer; an electronic device disposed inside the outer layer insulating layer; an outer layer circuit layer formed to protrude from one surface of the outer layer insulating layer; a first via formed on the outer layer insulating layer and electrically connecting the electronic device to the outer layer circuit layer; and a build up layer formed on the other surface of the outer layer insulating layer and including a build up insulating layer and a build up circuit layer.

Abstract: Disclosed herein is a method for manufacturing a printed circuit board. The method for manufacturing a printed circuit board includes: preparing a base substrate having first connection pads and second connection pads; forming a solder resist layer on the base substrate, the solder resist layer having a first opening for exposing the first connection pads; forming a first surface treatment layer on the first connection pads; forming a protective film on the solder resist layer; forming a second opening for exposing the second connection pads in the protective film and the solder resist layer; and forming a second surface treatment layer on the second connection pads.

Abstract: A semiconductor memory device includes a memory cell array, a repair control circuit and a refresh control circuit. The memory cell array includes a plurality of memory cells and a plurality of redundancy memory cells. The repair control circuit receives a repair command and performs a repair operation on a first defective memory cell among the plurality of memory cells during a repair mode. The semiconductor memory device may operate in a repair mode in response to the repair command. The refresh control circuit performs a refresh operation on non-defective ones of the plurality of memory cells during the repair mode.

Abstract: Embodiments of the invention provide a method for manufacturing a substrate for a package, in which the method includes forming a solder resist layer on an uncoated substrate having electrode pads formed thereon to cover the electrode pads, and exposing some regions by dividing the solder resist layer into regions including a first region covering some or all of the electrode pads and a second region formed out of the first region and exposing some of the regions. The method further includes developing the solder resist layer including an exposed region and an unexposed region with high energy light, so that a remaining height of the first region is lower than that of the second region and at least upper surfaces of the electrode pads in the first region are exposed.

Abstract: A steel plate structure and a steel plate concrete wall are disclosed. A steel plate structure, which includes: a pair of steel plates, which are separated to provide a predetermined space; a structural member, which is positioned in the predetermined space, and which is structurally rigidly joined to one side of the steel plate in the direction of gravity; and a strut, which maintains a separation distance between the pair of steel plates, can be utilized to reduce the overall thickness of a steel plate concrete wall for efficient use of space, and to reduce the thickness of the steel plates for better welding properties and larger unit module sizes. Also, the axial forces or lateral forces applied on the steel plate concrete wall may be effectively resisted.

Abstract: A solder resist opening structure that exposes an electrode pad through a solder resist opening. The solder resist opening has a bottom diameter of about 80 ?m or less with a first tolerance less than about 2.5 ?m, the bottom diameter being smaller than a diameter of the electrode pad; an inverted trapezoidal cross section with a top diameter larger than the bottom diameter; and a diameter difference between the top diameter and the bottom diameter of about 10 ?m or more with a second tolerance less than about 2.

Abstract: The present invention relates to a method for forming solder resist and a substrate for a package. The method for forming solder resist including: forming a first solder resist inner region by primarily coating, exposing, and developing a solder resist on a substrate on which an outer PoP pad and an inner chip pad are formed, and removing the solder resist's outer portion on the substrate's outer region and curing the solder resist's inner portion on the substrate's inner region; forming a plugged SR region which does not expose the substrate; changing a surface roughness by performing a desmear process on a surface of the first solder resist inner region in which the plugged SR region is formed; and forming a second solder resist SMD region which covers an edge of the PoP pad, exposing, and developing the solder resist on the substrate after the desmear process is provided.

Abstract: A method that incorporates the subject disclosure may include, for example, transmitting movement information for the mobile communication device to a cellular network, receiving a request from a first communication device of a plurality of communication devices to access the cellular network through the mobile communication device, where the plurality of communication devices are coupled to the plurality of communication devices via a wireless local area network and wherein the mobile communication device is coupled to the cellular network, and providing access to the cellular network for the first communication device responsive to the cellular network determining that the mobile communication device has a required network capability based on the movement information and according to the request. Other embodiments are disclosed.

Abstract: A method that incorporates the subject disclosure may include, for example, identifying, by a network device comprising a processor, a bearer path through a communication network for carrying internet protocol packets associated with a calling session between a first mobile device and a second mobile device and activating, by the network device, a bridging bearer path at a nearest network element to generate a direct tunnel for carrying the internet protocol packets associated with the calling session and to modify the bearer path to a shortest bearer path, where the nearest network element comprises a network element that is communicatively coupled to both the first mobile device and the second mobile device and that is closest to the first mobile device and the second mobile device. Other embodiments are disclosed.

Abstract: A semiconductor package substrate may include a first semiconductor chip, a second semiconductor chip, plugs and interconnection terminals. The second semiconductor chip may be arranged on an upper surface of the first semiconductor chip. The first and second semiconductor chips may have corresponding first regions and corresponding second regions. Conductive plugs may be built only in a first region of the first semiconductor chip. Circuitry of the second semiconductor chip may only be electrically connected to the first semiconductor chip through the conductive connectors corresponding to the first regions of the first and second semiconductor chips.

Abstract: A multimedia communications system for broadcast distribution of multimedia content to mobile terminals over a cellular network is disclosed. The disclosed system accesses content providers, receives corresponding content information associated with provider content, and broadcasts content information to user terminals. The user terminals include software and/or hardware for receiving the content information and enabling a user to subscribe to one or more content items. Once a subscription is in place for one or more content items, corresponding content IDs are sent to and stored at the terminal. The system facilitates broadcast of the content. Content IDs stored in the terminal and broadcasted content IDs are compared. Only the content associated with the matching content IDs is then downloaded to the user terminal for storage and/or presentation. Content associated with unmatched content IDs is prevented from being received.

Abstract: A printed circuit board and a manufacturing method thereof. The manufacturing method of the printed circuit board includes: coating a first solder resist on an upper surface of a substrate having a circuit pattern formed thereon; removing the first solder resist in the remaining portion except a first specific area by performing primary development after exposing the substrate coated with the first solder resist; coating a second solder resist, which has different properties from the first solder resist, on the upper surface of the substrate having the first solder resist remaining in the first specific area; and removing the second solder resist in the remaining portion except a second specific area by performing secondary development after exposing the substrate coated with the second solder resist.