Patents by Inventor Bo Lee

Bo Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9235129
    Abstract: The present invention provides a composition for developing a photoresist containing a carboxyl group (—COOH) and a method of developing a photoresist using the composition. The composition includes: a first solution including a salt containing a monovalent cationic component; and a second solution including a salt containing a bivalent cationic component. The composition for photoresist development is advantageous in that the developing depth of a photoresist can be controlled, and the developed surface of a photoresist is flat, thereby enabling the photoresist to be developed to realize precise three-dimensional packaging.
    Type: Grant
    Filed: February 4, 2014
    Date of Patent: January 12, 2016
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Chang Bo Lee, Chang Sup Ryu, Dae Jo Hong, Hyo Seung Nam
  • Publication number: 20150373856
    Abstract: A method for forming bumps and a substrate including the bumps. The method includes: coating a solder resist on a substrate and electrodes formed on the substrate: performing laser etching treatment on the solder resist to form openings for forming bumps; printing a composition for forming bumps in the openings for forming bumps; and performing a reflowing process. Accordingly, the method can decrease the number of processes and realize a fine bump pitch of 90 ?m or less at the time of forming bumps. Further, the method can also decrease the number of times that alignment is performed, due to the decrease in the number of processes.
    Type: Application
    Filed: September 1, 2015
    Publication date: December 24, 2015
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Cheol Ho CHOI, Chang Bo LEE, Chang Sup RYU
  • Publication number: 20150325658
    Abstract: Provided are a thin film structure capable of remarkably reducing the defect density of gallium nitride (GaN), and a method of fabricating the same. The thin film structure includes a supporting substrate including sapphire, and an epilayer disposed on the supporting substrate and including gallium nitride (GaN). An upper part of the supporting substrate facing the epilayer includes a layer of sapphire into which silicon (Si) is diffused or ion-implanted through a top surface of the supporting substrate.
    Type: Application
    Filed: February 18, 2014
    Publication date: November 12, 2015
    Inventors: Heung Nam HAN, Sung Bo LEE
  • Publication number: 20150277605
    Abstract: Disclosed is a touch screen panel, including: a glass substrate including an active area and a non-active area; enhancement layers formed on upper and lower surfaces of the glass substrate; sensing patterns disposed on a surface of one of the enhancement layers in the active area; and sensing lines disposed in the non-active area, and electrically connected with the sensing patterns. Here, a side surface of the glass substrate may include a plurality of blunt areas depressed in a shape of a curved surface.
    Type: Application
    Filed: February 13, 2015
    Publication date: October 1, 2015
    Inventors: Soo-Min AN, Young-Jin YOON, Soo-Guy RHO, Sang-Duck PARK, Kang-Bin YI, Jung-Bo LEE, Sang-Hun CHO, Gi-Yong NAM, Young-Joon CHIN, Sang-Tae KIM, Yong-Seok CHOI
  • Publication number: 20150274583
    Abstract: A glass-reinforcing composition and method of using the same, the composition including 1 weight % to 20 weight % of hydrofluoric acid, 0.1 weight % to 5 weight % of ammonium fluoride, 1 weight % to 20 weight % of an inorganic acid, an organic acid, or 1 weight % to 10 weight % of an organic acid salt, and a remainder of water.
    Type: Application
    Filed: September 8, 2014
    Publication date: October 1, 2015
    Inventors: Soo Min AN, Young-Jin Yoon, Gi Yong Nam, Soo Guy Rho, Sang-Duck Park, Kang Bin Yi, Jung Bo Lee, Sang Hun Cho, Sang-Tae Kim, Young-Jun Jin, Yong Seok Choi
  • Publication number: 20150250050
    Abstract: Disclosed herein are an embedded board and a method of manufacturing the same. According to a preferred embodiment of the present invention, the embedded board includes: an outer layer insulating layer; an electronic device disposed inside the outer layer insulating layer; an outer layer circuit layer formed to protrude from one surface of the outer layer insulating layer; a first via formed on the outer layer insulating layer and electrically connecting the electronic device to the outer layer circuit layer; and a build up layer formed on the other surface of the outer layer insulating layer and including a build up insulating layer and a build up circuit layer.
    Type: Application
    Filed: July 23, 2014
    Publication date: September 3, 2015
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Chang Bo LEE, Do Wan Kim, Soon Jin Cho
  • Patent number: 9107329
    Abstract: Disclosed herein is a method for manufacturing a printed circuit board. The method for manufacturing a printed circuit board includes: preparing a base substrate having first connection pads and second connection pads; forming a solder resist layer on the base substrate, the solder resist layer having a first opening for exposing the first connection pads; forming a first surface treatment layer on the first connection pads; forming a protective film on the solder resist layer; forming a second opening for exposing the second connection pads in the protective film and the solder resist layer; and forming a second surface treatment layer on the second connection pads.
    Type: Grant
    Filed: September 14, 2011
    Date of Patent: August 11, 2015
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Chang Bo Lee, Dae Jo Hong, Cheol Ho Choi
  • Publication number: 20150221361
    Abstract: A semiconductor memory device includes a memory cell array, a repair control circuit and a refresh control circuit. The memory cell array includes a plurality of memory cells and a plurality of redundancy memory cells. The repair control circuit receives a repair command and performs a repair operation on a first defective memory cell among the plurality of memory cells during a repair mode. The semiconductor memory device may operate in a repair mode in response to the repair command. The refresh control circuit performs a refresh operation on non-defective ones of the plurality of memory cells during the repair mode.
    Type: Application
    Filed: October 1, 2014
    Publication date: August 6, 2015
    Inventors: Yun-Young Lee, Kyo-Min Sohn, Sang-Joon Hwang, Sung-Min Seo, Sang-Bo Lee, Nak-Won Heo
  • Publication number: 20150198888
    Abstract: Embodiments of the invention provide a method for manufacturing a substrate for a package, in which the method includes forming a solder resist layer on an uncoated substrate having electrode pads formed thereon to cover the electrode pads, and exposing some regions by dividing the solder resist layer into regions including a first region covering some or all of the electrode pads and a second region formed out of the first region and exposing some of the regions. The method further includes developing the solder resist layer including an exposed region and an unexposed region with high energy light, so that a remaining height of the first region is lower than that of the second region and at least upper surfaces of the electrode pads in the first region are exposed.
    Type: Application
    Filed: January 12, 2015
    Publication date: July 16, 2015
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Chang Bo LEE, Dae Jo HONG, Myeong Ho HONG
  • Publication number: 20150159372
    Abstract: A steel plate structure and a steel plate concrete wall are disclosed. A steel plate structure, which includes: a pair of steel plates, which are separated to provide a predetermined space; a structural member, which is positioned in the predetermined space, and which is structurally rigidly joined to one side of the steel plate in the direction of gravity; and a strut, which maintains a separation distance between the pair of steel plates, can be utilized to reduce the overall thickness of a steel plate concrete wall for efficient use of space, and to reduce the thickness of the steel plates for better welding properties and larger unit module sizes. Also, the axial forces or lateral forces applied on the steel plate concrete wall may be effectively resisted.
    Type: Application
    Filed: February 12, 2015
    Publication date: June 11, 2015
    Inventors: Han-Woo Lee, Jong-Bo Lee, Jong-Hak Kim, Ung-Kwon Lee, Tae-Youp Mun, Won-Sang Sun, Jin-Woo Lee, Tae-Young Kim
  • Publication number: 20150156860
    Abstract: A solder resist opening structure that exposes an electrode pad through a solder resist opening. The solder resist opening has a bottom diameter of about 80 ?m or less with a first tolerance less than about 2.5 ?m, the bottom diameter being smaller than a diameter of the electrode pad; an inverted trapezoidal cross section with a top diameter larger than the bottom diameter; and a diameter difference between the top diameter and the bottom diameter of about 10 ?m or more with a second tolerance less than about 2.
    Type: Application
    Filed: May 15, 2014
    Publication date: June 4, 2015
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Chang Bo LEE, Dae Jo HONG, Hyo Seung NAM
  • Patent number: 9040838
    Abstract: The present invention relates to a method for forming solder resist and a substrate for a package. The method for forming solder resist including: forming a first solder resist inner region by primarily coating, exposing, and developing a solder resist on a substrate on which an outer PoP pad and an inner chip pad are formed, and removing the solder resist's outer portion on the substrate's outer region and curing the solder resist's inner portion on the substrate's inner region; forming a plugged SR region which does not expose the substrate; changing a surface roughness by performing a desmear process on a surface of the first solder resist inner region in which the plugged SR region is formed; and forming a second solder resist SMD region which covers an edge of the PoP pad, exposing, and developing the solder resist on the substrate after the desmear process is provided.
    Type: Grant
    Filed: August 27, 2013
    Date of Patent: May 26, 2015
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Chang Bo Lee, Chang Sup Ryu, Hyo Bin Park, Cheol Ho Choi
  • Publication number: 20150138963
    Abstract: A method that incorporates the subject disclosure may include, for example, transmitting movement information for the mobile communication device to a cellular network, receiving a request from a first communication device of a plurality of communication devices to access the cellular network through the mobile communication device, where the plurality of communication devices are coupled to the plurality of communication devices via a wireless local area network and wherein the mobile communication device is coupled to the cellular network, and providing access to the cellular network for the first communication device responsive to the cellular network determining that the mobile communication device has a required network capability based on the movement information and according to the request. Other embodiments are disclosed.
    Type: Application
    Filed: November 20, 2013
    Publication date: May 21, 2015
    Applicant: AT & T Mobility II LLC
    Inventors: Bo Lee, Arthur Brisebois, Adrianne Luu
  • Publication number: 20150138987
    Abstract: A method that incorporates the subject disclosure may include, for example, identifying, by a network device comprising a processor, a bearer path through a communication network for carrying internet protocol packets associated with a calling session between a first mobile device and a second mobile device and activating, by the network device, a bridging bearer path at a nearest network element to generate a direct tunnel for carrying the internet protocol packets associated with the calling session and to modify the bearer path to a shortest bearer path, where the nearest network element comprises a network element that is communicatively coupled to both the first mobile device and the second mobile device and that is closest to the first mobile device and the second mobile device. Other embodiments are disclosed.
    Type: Application
    Filed: November 20, 2013
    Publication date: May 21, 2015
    Applicant: AT & T Mobility II LLC
    Inventors: Bo Lee, Arthur Brisebois, Adrianne Luu
  • Patent number: 9000572
    Abstract: A semiconductor package substrate may include a first semiconductor chip, a second semiconductor chip, plugs and interconnection terminals. The second semiconductor chip may be arranged on an upper surface of the first semiconductor chip. The first and second semiconductor chips may have corresponding first regions and corresponding second regions. Conductive plugs may be built only in a first region of the first semiconductor chip. Circuitry of the second semiconductor chip may only be electrically connected to the first semiconductor chip through the conductive connectors corresponding to the first regions of the first and second semiconductor chips.
    Type: Grant
    Filed: August 6, 2012
    Date of Patent: April 7, 2015
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hoon Lee, Sang-Bo Lee
  • Publication number: 20150053456
    Abstract: A printed circuit board and a manufacturing method thereof. The manufacturing method of the printed circuit board includes: coating a first solder resist on an upper surface of a substrate having a circuit pattern formed thereon; removing the first solder resist in the remaining portion except a first specific area by performing primary development after exposing the substrate coated with the first solder resist; coating a second solder resist, which has different properties from the first solder resist, on the upper surface of the substrate having the first solder resist remaining in the first specific area; and removing the second solder resist in the remaining portion except a second specific area by performing secondary development after exposing the substrate coated with the second solder resist.
    Type: Application
    Filed: December 19, 2013
    Publication date: February 26, 2015
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: CHANG BO LEE, MYEONG HO HONG, DAE JO HONG, YOUNG KYU LIM
  • Publication number: 20150055544
    Abstract: A multimedia communications system for broadcast distribution of multimedia content to mobile terminals over a cellular network is disclosed. The disclosed system accesses content providers, receives corresponding content information associated with provider content, and broadcasts content information to user terminals. The user terminals include software and/or hardware for receiving the content information and enabling a user to subscribe to one or more content items. Once a subscription is in place for one or more content items, corresponding content IDs are sent to and stored at the terminal. The system facilitates broadcast of the content. Content IDs stored in the terminal and broadcasted content IDs are compared. Only the content associated with the matching content IDs is then downloaded to the user terminal for storage and/or presentation. Content associated with unmatched content IDs is prevented from being received.
    Type: Application
    Filed: October 29, 2014
    Publication date: February 26, 2015
    Inventors: Bo Lee, Yonghui Tong
  • Patent number: 8917564
    Abstract: A semiconductor memory device having a 3D stacked structure includes: a first semiconductor area with a stacked structure of a first layer having first data and a second layer having second data; a first line for delivering an access signal for accessing the first semiconductor area; and a second line for outputting the first and/or second data from the first semiconductor area, wherein access timings of accessing the first and second layers are controlled so that a first time delay from the delivery of the access signal to the first layer to the output of the first data is substantially identical to a second time delay from the delivery of the access signal to the second layer to the output of the second data, thereby compensating for skew according to an inter-layer timing delay and thus performing a normal operation. Accordingly, the advantage of high-integration according to a stacked structure can be maximized by satisfying data input/output within a predetermined standard.
    Type: Grant
    Filed: July 9, 2013
    Date of Patent: December 23, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hak-Soo Yu, Sang-Bo Lee, Hong-Sun Hwang, Dong-Hyun Sohn
  • Publication number: 20140370446
    Abstract: The present invention provides a composition for developing a photoresist containing a carboxyl group (—COOH) and a method of developing a photoresist using the composition. The composition includes: a first solution including a salt containing a monovalent cationic component; and a second solution including a salt containing a bivalent cationic component. The composition for photoresist development is advantageous in that the developing depth of a photoresist can be controlled, and the developed surface of a photoresist is flat, thereby enabling the photoresist to be developed to realize precise three-dimensional packaging.
    Type: Application
    Filed: February 4, 2014
    Publication date: December 18, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Chang Bo Lee, Chang Sup Ryu, Dae Jo Hong, Hyo Seung Nam
  • Publication number: 20140355830
    Abstract: A method and an apparatus for controlling a display in order to secure an appropriate viewing distance between a digital device and a user who is viewing the digital device is provided. Accordingly, the method determines whether an object exists within a hazardous viewing distance using a 3D camera function provided in the digital device. If it is determined that an object exists within the hazardous viewing distance, the digital device detects a face or eyes from 2D images photographed by the camera. Next, the direction of the face is determined on the basis of the detected results, and it is determined whether a user is viewing a display screen of the digital device based on the determination. If it is determined that a user is viewing a display screen of a digital device, the digital device generates a warning that the user is positioned within a hazardous viewing distance.
    Type: Application
    Filed: June 2, 2014
    Publication date: December 4, 2014
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Jeong-Hoon PARK, Dong-Wook Kwon, Kyung-Il Kim, Min-Ho Kim, Gi-Sang Lee, Sang-Bo Lee, Jin-Kyung Lee, Young-Gu Jin, Jin-Wuk Choi