Patents by Inventor Bo Lee

Bo Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140341428
    Abstract: An apparatus and a method for recognizing a human body in a hybrid manner are provided. The method includes calculating body information used for recognizing a human body from an input image, detecting a region of the human body in a learning-based human body recognition manner by using the calculated body information, and tracing a movement of the detected region of the human body in a modeling-based human body recognition manner. Thereby, it is possible to quickly perform more accurate and precise recognition of the human body.
    Type: Application
    Filed: May 20, 2014
    Publication date: November 20, 2014
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Jin-Wuk CHOI, Ho-Yub Jung, Jung-Seop Kim, Nam-Su Ha, Dong-Wook Kwon, Kyung-Il Kim, Min-Ho Kim, Gi-Sang Lee, Sang-Bo Lee, Jin-Kyung Lee, Young-Gu Jin
  • Patent number: 8892081
    Abstract: A multimedia communications system for broadcast distribution of multimedia content to mobile terminals over a cellular network is disclosed. The disclosed system accesses content providers, receives corresponding content information associated with provider content, and broadcasts content information to user terminals. The user terminals include software and/or hardware for receiving the content information and enabling a user to subscribe to one or more content items. Once a subscription is in place for one or more content items, corresponding content IDs are sent to and stored at the terminal. The system facilitates broadcast of the content. Content IDs stored in the terminal and broadcasted content IDs are compared. Only the content associated with the matching content IDs is then downloaded to the user terminal for storage and/or presentation. Content associated with unmatched content IDs is prevented from being received.
    Type: Grant
    Filed: May 2, 2013
    Date of Patent: November 18, 2014
    Assignee: AT&T Mobility II LLC
    Inventors: Bo Lee, Yonghui Tong
  • Publication number: 20140223257
    Abstract: A semiconductor memory device that may correct error data using an error correction circuit is disclosed. The semiconductor memory device may include a DRAM cell array, a parity generator, a nonvolatile memory cell array and an error correction circuit. The parity generator is configured to generate a first set of parity bits having at least one bit based on input data. The nonvolatile memory cell array may store the input data and the first set of parity bits corresponding to the input data, and to output first data corresponding to the input data, and a second set of parity bits corresponding to the first set of parity bits. The error correction circuit is configured to generate second data as corrected data based on the first data.
    Type: Application
    Filed: January 28, 2014
    Publication date: August 7, 2014
    Inventors: Chi-Sung OH, Chul-Sung PARK, Sang-Bo LEE, Dong-Hyun SOHN
  • Publication number: 20140183726
    Abstract: The present invention relates to a package substrate, a method for manufacturing the same, and a package on package substrate. In accordance with an embodiment of the present invention, a package substrate including: an inner insulating layer; a circuit pattern layer formed on the inner insulating layer; an outer insulating layer formed on the inner insulating layer to protect the circuit pattern layer and expose portions of external and internal patterns of the circuit pattern layer; a mixed pattern layer consisting of post bumps and outermost layer patterns formed on the portions of the internal and external patterns exposed by the outer insulating layer; and a resist layer formed on the outer insulating layer to protect the outermost layer patterns of the mixed pattern layer and expose the outermost layer patterns by an open region.
    Type: Application
    Filed: November 6, 2013
    Publication date: July 3, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Chang Bo LEE, Cheol ho CHOI, Chang Sup RYU
  • Publication number: 20140119603
    Abstract: A method of recognizing motion of an object may include periodically obtaining depth data of a first resolution and two-dimensional data of a second resolution with respect to a scene using an image capturing device, wherein the second resolution is higher than the first resolution; determining a motion tracking region by recognizing a target object in the scene based on the depth data, such that the motion tracking region corresponds to a portion of a frame and the portion includes the target object; periodically obtaining tracking region data of the second resolution corresponding to the motion tracking region; and/or analyzing the motion of the target object based on the tracking region data.
    Type: Application
    Filed: October 28, 2013
    Publication date: May 1, 2014
    Inventors: Young-Gu JIN, Jung-Seop KIM, Dong-Wook KWON, Kyung-Il KIM, Min Ho KIM, Gi-Sang LEE, Sang-Bo LEE, Jin-Kyung LEE, Jin-Wuk CHOI
  • Publication number: 20140118252
    Abstract: A cursor displaying method that re-sizes a cursor displayed in a display field while repositioning the cursor in response to a detected user gesture.
    Type: Application
    Filed: October 24, 2013
    Publication date: May 1, 2014
    Inventors: MIN HO KIM, DONG WOOK KWON, KYUNG IL KIM, GI SANG LEE, SANG BO LEE, JIN KYUNG LEE, YOUNG GU JIN, JIN WUK CHOI
  • Publication number: 20140111423
    Abstract: A mobile system may comprise a three-dimensional (3D) image sensor on a first surface of the mobile system configured to perform a first sensing to detect proximity of a subject and a second sensing to recognize a gesture of the subject by acquiring distance information for the subject; and/or a display device on the first surface of the mobile system to display results of the first sensing and the second sensing. A mobile system may comprise a light source unit; a plurality of depth pixels; and/or a plurality of color pixels. The light source unit, the plurality of depth pixels, or the plurality of color pixels may be activated based on an operation mode of the mobile system.
    Type: Application
    Filed: October 23, 2013
    Publication date: April 24, 2014
    Inventors: Yoon-Dong PARK, Won-Joo KIM, Young-Gu JIN, Dong-Wook KWON, Kyung-Il KIM, Min-Ho KIM, Gi-Sang LEE, Sang-Bo LEE, Jin-Kyung LEE, Jin-Wuk CHOI
  • Publication number: 20140104391
    Abstract: An image capture method performed by a depth sensor includes; emitting a first source signal having a first amplitude towards a scene, and thereafter emitting a second source signal having a second amplitude different from the first amplitude towards the scene, capturing a first image in response to the first source signal and capturing a second image in response to the second source signal, and interpolating the first and second images to generate a final image.
    Type: Application
    Filed: October 11, 2013
    Publication date: April 17, 2014
    Inventors: KYUNG IL KIM, DONG WOOK KWON, MIN-HO KIM, GI-SANG LEE, SANG BO LEE, JIN KYUNG LEE, YOUNG GU JIN, JIN WUK CHOI
  • Publication number: 20140096084
    Abstract: A method for controlling a user interface of an apparatus to enable intuitive manipulation for an object included in an image is provided. An object with deeper depth in a rear image of the apparatus may become selectable when the user holds a user input means close to the apparatus, while an object with shallower depth in the rear image may become selectable when the user draws the user input means away from the apparatus, thereby allowing the user to intuitively select an object in the rear image.
    Type: Application
    Filed: September 30, 2013
    Publication date: April 3, 2014
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Dong-Wook Kwon, Min-Ho Kim, Kyung-ll Kim, Gi-Sang Lee, Sang-Bo Lee, Jin-Kyung Lee, Young-Gu Jin, Jin-Wuk Choi
  • Publication number: 20140078311
    Abstract: Methods, systems, and devices for guiding a subject back within the recognizable visual range of a multimedia system are described. According to one of the described methods, when it is determined that the target has left the recognizable range of the multimedia system, sensor information is acquired from a portable electronic device (or controller) the user has been using to control the multimedia system, and the acquired sensor information is used to determine where the user is, relative to the recognizable range. In one example, the user is asked to make a gesture with the portable electronic device, and the sensor information concerning that gesture is used to determine the user's relative location. In another example, the sensor information recorded at the time the user left the recognizable range is used to determine the user's relative location.
    Type: Application
    Filed: September 18, 2013
    Publication date: March 20, 2014
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Jin-Wuk CHOI, Dong-Wook KWON, Jung-Seop KIM, Kyung-II KIM, Min-Ho KIM, Gi-Sang LEE, Sang-Bo LEE, Jin-Kyung LEE, Sun-Tae JUNG, Young-Gu JIN
  • Publication number: 20140062864
    Abstract: A method and apparatus for extracting three-dimensional distance information from a recognition target is provided, which enables a gesture input from a user to be correctly recognized using distance information from the recognition target, and at the same time makes it possible to efficiently save power required for detection of the gesture input. The method includes determining if a recognition target exists within a predetermined range; when the recognition target exists within the predetermined range, generating a 3D image for the recognition target; and calculating a distance to the recognition target by using the 3D image.
    Type: Application
    Filed: August 28, 2013
    Publication date: March 6, 2014
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Jin-Kyung LEE, Dong-Wook Kwon, Kyung-Il Kim, Min-Ho Kim, Gi-Sang Lee, Sang-Bo Lee, Young-Gu Jin, Jin-Wuk Choi
  • Publication number: 20140054073
    Abstract: The present invention relates to a method for forming solder resist and a substrate for a package. The method for forming solder resist including: forming a first solder resist inner region by primarily coating, exposing, and developing a solder resist on a substrate on which an outer PoP pad and an inner chip pad are formed, and removing the solder resist's outer portion on the substrate's outer region and curing the solder resist's inner portion on the substrate's inner region; forming a plugged SR region which does not expose the substrate; changing a surface roughness by performing a desmear process on a surface of the first solder resist inner region in which the plugged SR region is formed; and forming a second solder resist SMD region which covers an edge of the PoP pad, exposing, and developing the solder resist on the substrate after the desmear process is provided.
    Type: Application
    Filed: August 27, 2013
    Publication date: February 27, 2014
    Applicant: Samsung Electro-Mechannics Co., Ltd
    Inventors: Chang Bo LEE, Chang Sup RYU, Hyo Bin PARK, Cheol Ho CHOI
  • Publication number: 20140041911
    Abstract: Disclosed herein is a flat dam formed in a package region of an insulation layer provided on a board to limit movement of an underfill and made of the hydrophobic material including any one of or at least two of perfluorooctyl acrylate (PFAC), polypropylene, polytetrafluoroethylene (PTFE), and fluorine compound.
    Type: Application
    Filed: March 18, 2013
    Publication date: February 13, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Chang Bo Lee, Chang Sup Ryu, Young Gwan Ko, Cheol Ho Choi
  • Publication number: 20140037862
    Abstract: Disclosed herein is a method for manufacturing a printed circuit board for forming a solder resist of an outermost layer having a step structure by performing laser machining or exposing and developing processes.
    Type: Application
    Filed: November 7, 2012
    Publication date: February 6, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Chang Bo Lee, Do Wan Kim, Cheol Ho Choi, Chang Sup Ryu
  • Publication number: 20130329478
    Abstract: A semiconductor memory device having a 3D stacked structure includes: a first semiconductor area with a stacked structure of a first layer having first data and a second layer having second data; a first line for delivering an access signal for accessing the first semiconductor area; and a second line for outputting the first and/or second data from the first semiconductor area, wherein access timings of accessing the first and second layers are controlled so that a first time delay from the delivery of the access signal to the first layer to the output of the first data is substantially identical to a second time delay from the delivery of the access signal to the second layer to the output of the second data, thereby compensating for skew according to an inter-layer timing delay and thus performing a normal operation. Accordingly, the advantage of high-integration according to a stacked structure can be maximized by satisfying data input/output within a predetermined standard.
    Type: Application
    Filed: July 9, 2013
    Publication date: December 12, 2013
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Hak-Soo Yu, Sang-Bo LEE, Hong-Sun HWANG, Dong-Hyun SOHN
  • Publication number: 20130237144
    Abstract: A multimedia communications system for broadcast distribution of multimedia content to mobile terminals over a cellular network is disclosed. The disclosed system accesses content providers, receives corresponding content information associated with provider content, and broadcasts content information to user terminals. The user terminals include software and/or hardware for receiving the content information and enabling a user to subscribe to one or more content items. Once a subscription is in place for one or more content items, corresponding content IDs are sent to and stored at the terminal. The system facilitates broadcast of the content. Content IDs stored in the terminal and broadcasted content IDs are compared. Only the content associated with the matching content IDs is then downloaded to the user terminal for storage and/or presentation. Content associated with unmatched content IDs is prevented from being received.
    Type: Application
    Filed: May 2, 2013
    Publication date: September 12, 2013
    Applicant: AT&T Mobility II LLC
    Inventors: Bo Lee, Yonghui Tong
  • Patent number: 8488399
    Abstract: A semiconductor memory device having a 3D stacked structure includes: a first semiconductor area with a stacked structure of a first layer having first data and a second layer having second data; a first line for delivering an access signal for accessing the first semiconductor area; and a second line for outputting the first and/or second data from the first semiconductor area, wherein access timings of accessing the first and second layers are controlled so that a first time delay from the delivery of the access signal to the first layer to the output of the first data is substantially identical to a second time delay from the delivery of the access signal to the second layer to the output of the second data, thereby compensating for skew according to an inter-layer timing delay and thus performing a normal operation. Accordingly, the advantage of high-integration according to a stacked structure can be maximized by satisfying data input/output within a predetermined standard.
    Type: Grant
    Filed: May 16, 2011
    Date of Patent: July 16, 2013
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hak-Soo Yu, Sang-Bo Lee, Hong-Sun Hwang, Dong-Hyun Sohn
  • Publication number: 20130175238
    Abstract: This invention relates to an etching solution including hydrogen peroxide, sulfuric acid, chlorine ions, benzotriazole and pyrazole, and to a method of manufacturing a printed wiring substrate wherein the surface of the metal wiring of the printed wiring substrate is treated with an alkali solution, roughened using the etching solution and then subjected to anti-rust treatment, thus forming porous surface irregularities and micro anchors even with a small etching amount of the metal (Cu) to thereby obtain a high force of adhesion between the metal and an insulating material.
    Type: Application
    Filed: May 17, 2012
    Publication date: July 11, 2013
    Applicants: Samyoung Pure Chemicals Co., Ltd., SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Dae Jo HONG, Chang Bo LEE, Cheol Ho CHOI, Chang Sup RYU, Sung Pyo HONG, Jong Hoon JEON, Akira HOSOMI, Hiroshi TAKAMIYA
  • Patent number: 8447284
    Abstract: A multimedia communications system for broadcast distribution of multimedia content to mobile terminals over a cellular network is disclosed. The disclosed system accesses content providers, receives corresponding content information associated with provider content, and broadcasts content information to user terminals. The user terminals include software and/or hardware for receiving the content information and enabling a user to subscribe to one or more content items. Once a subscription is in place for one or more content items, corresponding content IDs are sent to and stored at the terminal. The system facilitates broadcast of the content. Content IDs stored in the terminal and broadcasted content IDs are compared. Only the content associated with the matching content IDs is then downloaded to the user terminal for storage and/or presentation. Content associated with unmatched content IDs is prevented from being received.
    Type: Grant
    Filed: June 9, 2006
    Date of Patent: May 21, 2013
    Assignee: AT&T Mobility II LLC
    Inventors: Bo Lee, Yonghui Tong
  • Publication number: 20130037964
    Abstract: A semiconductor package substrate may include a first semiconductor chip, a second semiconductor chip, plugs and interconnection terminals. The second semiconductor chip may be arranged on an upper surface of the first semiconductor chip. The first and second semiconductor chips may have corresponding first regions and corresponding second regions. Conductive plugs may be built only in a first region of the first semiconductor chip. Circuitry of the second semiconductor chip may only be electrically connected to the first semiconductor chip through the conductive connectors corresponding to the first regions of the first and second semiconductor chips.
    Type: Application
    Filed: August 6, 2012
    Publication date: February 14, 2013
    Inventors: Hoon Lee, Sang-Bo Lee