Patents by Inventor Brian Kim

Brian Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060159403
    Abstract: A transceiver assembly includes a frame section, a rigid circuit board, a flex circuit, and a controller chip. The frame section includes an optoelectronic device containing a set of photoactive components, a signal processing chip for providing drive signals to the set of photoactive components, and a flex circuit layer. The rigid circuit board includes a first rigid printed circuit board layer, a second rigid printed circuit board layer, and a flex circuit layer. The flex circuit also forms the flex circuit layers in the rigid circuit board and the frame section. The flex circuit is adapted for electrically coupling the first and second printed circuit board layers in the rigid circuit board to the frame section. The controller chip is mounted on a surface of the first rigid printed circuit board layer.
    Type: Application
    Filed: March 2, 2006
    Publication date: July 20, 2006
    Inventors: Hengju Cheng, Lee Xu, Brian Kim, Darren Crews, Jesse Chin
  • Publication number: 20060153506
    Abstract: A transceiver assembly includes a frame section, a rigid printed circuit board, a flex circuit, and an edge connector. The frame section includes a flex circuit layer for use in carrying data, and control and power signals, and an optoelectronic device. The rigid printed circuit board includes a first rigid printed circuit board layer and a flex circuit layer for use in carrying data, and control and power signals. The flex circuit is for carrying data, and control and power signals which flexibly links the rigid printed circuit board to the frame section and forms the flex circuit layers in the rigid printed circuit board and the frame section. The edge connector is formed on one end of the printed circuit board by a plurality of connection pads disposed along one edge of the printed circuit board.
    Type: Application
    Filed: March 2, 2006
    Publication date: July 13, 2006
    Inventors: Hengju Cheng, Lee Xu, Brian Kim, Darren Crews, Jesse Chin
  • Publication number: 20060153505
    Abstract: A frame section includes a flex circuit layer, a support layer, and a silicon substrate carrier. The flex circuit layer includes a plurality of communication lines and having a flex circuit window section. The support layer includes a support layer window smaller that the flex circuit window section so as to define an inwardly extending support shelf. The silicon substrate carrier is mounted on the support shelf in the support layer window and includes an optoelectronic device supported on the silicon substrate carrier. The optoelectronic device includes a set of photoactive components. The frame section is used for supporting the optoelectronic device within a fiber optic transceiver assembly which in turn is used for connecting to a fiber optic ferrule supporting a set of fiber optic communication fibers.
    Type: Application
    Filed: March 2, 2006
    Publication date: July 13, 2006
    Inventors: Hengju Cheng, Lee Xu, Brian Kim, Darren Crews, Jesse Chin
  • Patent number: 7073955
    Abstract: A transceiver assembly includes a frame section, a rigid circuit board, a flex circuit, and a controller chip. The frame section includes an optoelectronic device containing a set of photoactive components, a signal processing chip for providing drive signals to the set of photoactive components, and a flex circuit layer. The rigid circuit board includes a first rigid printed circuit board layer, a second rigid printed circuit board layer, and a flex circuit layer. The flex circuit also forms the flex circuit layers in the rigid circuit board and the frame section. The flex circuit is adapted for electrically coupling the first and second printed circuit board layers in the rigid circuit board to the frame section. The controller chip is mounted on a surface of the first rigid printed circuit board layer.
    Type: Grant
    Filed: March 2, 2006
    Date of Patent: July 11, 2006
    Assignee: Stratos International, Inc.
    Inventors: Hengju Cheng, Lee L. Xu, Brian Kim, Darren Crews, Jesse Chin
  • Patent number: 7073954
    Abstract: A frame section includes a flex circuit layer, a support layer, and a silicon substrate carrier. The flex circuit layer includes a plurality of communication lines and having a flex circuit window section. The support layer includes a support layer window smaller that the flex circuit window section so as to define an inwardly extending support shelf. The silicon substrate carrier is mounted on the support shelf in the support layer window and includes an optoelectronic device supported on the silicon substrate carrier. The optoelectronic device includes a set of photoactive components. The frame section is used for supporting the optoelectronic device within a fiber optic transceiver assembly which in turn is used for connecting to a fiber optic ferrule supporting a set of fiber optic communication fibers.
    Type: Grant
    Filed: March 2, 2006
    Date of Patent: July 11, 2006
    Assignee: Stratos International, Inc.
    Inventors: Hengju Cheng, Lee L. Xu, Brian Kim, Darren Crews, Jesse Chin
  • Publication number: 20060147159
    Abstract: An optoelectronic subassembly includes a planar substrate, a set of guide pins, and a support block. The planar substrate has an array of photoactive components mounted on the planar substrate and a set of apertures in the planar substrate are aligned with the photoactive components. The set of guide pins have proximal and distal ends extending through the set of apertures in the planar substrate. The support block includes a set of support passages in which the distal ends of the guide pins are cemented, and a support face which is at right angles to the set of support passages. The optoelectronic subassembly is for use in a fiber optic communications transceiver which is adapted for being mechanically and optically connected to an optical ferrule. The optical ferrule supports an array of optical communications fibers.
    Type: Application
    Filed: March 2, 2006
    Publication date: July 6, 2006
    Inventors: Hengju Cheng, Lee Xu, Brian Kim, Darren Crews, Jesse Chin
  • Patent number: 7056032
    Abstract: A transceiver assembly for use in fiber optic communications systems where multiple optical fibers are used in transmitting and receiving optical signals. The assembly is adapted for being mechanically and optically connected with a ferrule supporting a set of optical communications fibers. The transceiver assembly supports an optoelectronic device having a corresponding set of photoactive components which are operative for either converting photonic signals to electrical signals (in a receiver) or converting electrical signals to photonic signals (in a transmitter). The transceiver assembly includes a frame section having a carrier which is precisely fabricated for supporting the optoelectronic device and includes an alignment structure for cooperating with the optical ferrule to align the photoactive components with the fibers in the ferrule.
    Type: Grant
    Filed: September 17, 2001
    Date of Patent: June 6, 2006
    Assignee: Stratos International, Inc.
    Inventors: Hengju Cheng, Lee L. Xu, Brian Kim, Darren Crews, Jesse Chin
  • Publication number: 20060112720
    Abstract: A cooling air guide unit for a walk-in refrigerator includes a mounting part comprising a first mounting surface and a second mounting surface and a cooling air blowing part. The first and second mounting surface of the mounting part are tilted with respect to each other by a predetermined angle, and the cooling air blowing part is installed on the second mounting surface of the mounting part. The mounting part further includes a bottom interface surface, a first side interface surface, and a second side interface surface. The first and second mounting surface are rectangular and meet each other along an edge. The bottom interface surface, the first side interface surface, and the second side interface surface of the mounting part connect the remaining three edges of the first and second mounting surface, forming a shape of wedge. The cooling air blowing unit includes a fan and a safety grid, preferably made of plastic.
    Type: Application
    Filed: November 29, 2004
    Publication date: June 1, 2006
    Inventor: Brian Kim
  • Publication number: 20060067684
    Abstract: A transceiver is disclosed. The transceiver includes a carrier assembly having active components to transmit and receive optical input/output (I/O); and a connector, coupled to the carrier assembly to couple optical I/O between the active components and a waveguide.
    Type: Application
    Filed: September 30, 2004
    Publication date: March 30, 2006
    Inventors: Brian Kim, Darren Crews, Lee Xu, Hengju Cheng, An-chun Tien, Wei-zen Lo, William Wang
  • Publication number: 20060067630
    Abstract: Briefly, in accordance with one embodiment of the invention, a module assembly for an optical link may include a first frame and a second frame coupled with a lead frame. The second frame includes a pair of holes and the first frame includes a pair of posts. The holes may serve as pattern recognition marks for placement of one or more optical components onto the lead frame and second frame. Furthermore, the mating of the posts with the holes may serve to provide alignment of an optical path of the optical link with the optical components by virtue of the mating.
    Type: Application
    Filed: September 30, 2004
    Publication date: March 30, 2006
    Inventor: Brian Kim
  • Publication number: 20050196109
    Abstract: An optical module that may be used in small-form factor pluggable applications includes a delatching/latching mechanism. The optical module may be an optical transceiver, for example, and the delatching/latching mechanism may allow for improved insertion and removal of the optical module from a cage in a computer board assembly. A latching assembly that assists in latching and delatching may include a latching member having a slotted mating element that is in contact with, and rotates relative to a substantially-fixed pivot element. Rotation may be achieved via a rotatable actuator having a cam engaging a cam follower. Numerous example biasing apparatuses are described to bias the latching assembly to its latched position and to promote contact between the mating element and the pivot element.
    Type: Application
    Filed: March 18, 2004
    Publication date: September 8, 2005
    Applicant: INTEL CORPORATION
    Inventors: Brian Kim, William Wang
  • Publication number: 20050012460
    Abstract: A resilient cylindrical degaussing coil holder with longitudinal ribs closely surrounds a degaussing coil for a cathode ray tube (CRT) to dampen mechanical noise transmission from the coil to the chassis assembly that holds the CRT.
    Type: Application
    Filed: June 15, 2004
    Publication date: January 20, 2005
    Inventors: Brian Kim, Jared Zamaloff
  • Patent number: 6814009
    Abstract: A novel pillar is provided. The pillar having a longitudinal axis and first and second ends, an outer skin, an extruded support structure disposed within the outer skin, with the support structure including multiple cells arranged along the longitudinal axis for support of longitudinal loads, and a tension bar disposed at least partially within the extruded support structure. The outer skin and extruded support may include structural plastic, and the extruded support structure may be separately insertable into the outer skin. However, in an alternative embodiment the outer skin and extruded support structure are co-extruded as a single monolithic piece.
    Type: Grant
    Filed: October 9, 2001
    Date of Patent: November 9, 2004
    Assignees: Sony Corporation, Sony Electronics, Inc.
    Inventors: Mario Acevedo, Hirokazu Goto, Brian Kim
  • Patent number: 6739766
    Abstract: A lens array for use in fiber optic communications modules where multiple optical fibers are used in either transmitting or receiving optical signals. The lens array is adapted for optically interfacing a set of photoactive components such as semiconductor lasers or photo diodes deployed on an integrated circuit chip with a set of optical communications fibers supported in a ferrule. The individual lens elements within the array are shaped to have a greater height than width and are fitted together by being truncated along their boundaries with adjoining lenses. The increased height of the lens elements allows them to gather and transfer more light between the photoactive components and the optical fibers.
    Type: Grant
    Filed: December 17, 2001
    Date of Patent: May 25, 2004
    Assignee: Stratos International, Inc.
    Inventors: Lee L. Xu, Brian Kim, Darren Crews
  • Patent number: 6729771
    Abstract: A subassembly for use in fiber optic communications systems where multiple optical fibers are used in either transmitting or receiving optical signals. The subassembly is adapted for being mechanically and optically connected with a ferrule supporting a set of optical communications fibers. The subassembly uses a carrier assembly to support an optoelectronic device having a corresponding set of photoactive components which are operative for either converting photonic signals to electrical signals (in a receiver) or converting electrical signals to photonic signals (in a transmitter). The subassembly includes a lens and alignment frame having a set of guide pins and an array of lenses for interfacing the fibers of the ferrule with the photoactive components of the optoelectronic device on the carrier assembly. The carrier assembly may also include signal processing devices and a circuit board having an edge connector for removably connecting the subassembly with a computer or communications system.
    Type: Grant
    Filed: December 17, 2001
    Date of Patent: May 4, 2004
    Assignee: Stratos Lightwave, Inc.
    Inventors: Brian Kim, Lee L. Xu, Hengju Cheng, Darren Crews, Jesse Chin
  • Publication number: 20030113071
    Abstract: A subassembly for use in fiber optic communications systems where multiple optical fibers are used in either transmitting or receiving optical signals. The subassembly is adapted for being mechanically and optically connected with a ferrule supporting a set of optical communications fibers. The subassembly uses a carrier assembly to support an optoelectronic device having a corresponding set of photoactive components which are operative for either converting photonic signals to electrical signals (in a receiver) or converting electrical signals to photonic signals (in a transmitter). The subassembly includes a lens and alignment frame having a set of guide pins and an array of lenses for interfacing the fibers of the ferrule with the photoactive components of the optoelectronic device on the carrier assembly. The carrier assembly may also include signal processing devices and a circuit board having an edge connector for removably connecting the subassembly with a computer or communications system.
    Type: Application
    Filed: December 17, 2001
    Publication date: June 19, 2003
    Applicant: PARACER, INC.
    Inventors: Brian Kim, Lee L. Xu, Hengju Cheng, Darren Crews, Jesse Chin
  • Publication number: 20030113077
    Abstract: A lens array for use in fiber optic communications modules where multiple optical fibers are used in either transmitting or receiving optical signals. The lens array is adapted for optically interfacing a set of photoactive components such as semiconductor lasers or photo diodes deployed on an integrated circuit chip with a set of optical communications fibers supported in a ferrule. The individual lens elements within the array are shaped to have a greater height than width and are fitted together by being truncated along their boundaries with adjoining lenses. The increased height of the lens elements allows them to gather and transfer more light between the photoactive components and the optical fibers.
    Type: Application
    Filed: December 17, 2001
    Publication date: June 19, 2003
    Applicant: PARACER, INC.
    Inventors: Lee L. Xu, Brian Kim, Darren Crews
  • Publication number: 20030066463
    Abstract: A novel pillar is provided. The pillar having a longitudinal axis and first and second ends, an outer skin, an extruded support structure disposed within the outer skin, with the support structure including multiple cells arranged along the longitudinal axis for support of longitudinal loads, and a tension bar disposed at least partially within the extruded support structure. The outer skin and extruded support may include structural plastic, and the extruded support structure may be separately insertable into the outer skin. However, in an alternative embodiment the outer skin and extruded support structure are co-extruded as a single monolithic piece.
    Type: Application
    Filed: October 9, 2001
    Publication date: April 10, 2003
    Inventors: Mario Acevedo, Hirokazu Goto, Brian Kim
  • Publication number: 20030053762
    Abstract: A transceiver assembly for use in fiber optic communications systems where multiple optical fibers are used in transmitting and receiving optical signals. The assembly is adapted for being mechanically and optically connected with a ferrule supporting a set of optical communications fibers. The transceiver assembly supports an optoelectronic device having a corresponding set of photoactive components which are operative for either converting photonic signals to electrical signals (in a receiver) or converting electrical signals to photonic signals (in a transmitter). The transceiver assembly includes a frame section having a carrier which is precisely fabricated for supporting the optoelectronic device and includes an alignment structure for cooperating with the optical ferrule to align the photoactive components with the fibers in the ferrule.
    Type: Application
    Filed: September 17, 2001
    Publication date: March 20, 2003
    Inventors: Hengju Cheng, Lee L. Xu, Brian Kim, Darren Crews, Jesse Chin
  • Patent number: D489547
    Type: Grant
    Filed: June 18, 2002
    Date of Patent: May 11, 2004
    Assignees: Sony Corporation, Sony Electronics, Inc.
    Inventors: Mario Acevedo, Hirokazu Goto, Brian Kim