Abstract: An integrated circuit coupling device includes an integrated circuit package; and an optical data transmission medium connected to the integrated circuit package, and comprising a movable coolant, adapted to remove heat from the integrated circuit package, in operation.

Abstract: An electronic circuit device, including a combined optical transmission and cooling fluid conduit network. The network includes at least one cooling conduit having an optical transmission medium. The network is configured to convey a cooling fluid via the at least one cooling conduit and to convey an electromagnetic signal via the optical transmission medium. The network is in thermal communication with a first set of one or more components of the electronic circuit device and in signal communication with a second set of one or more components of the electronic circuit device. The first set and second set of components are at least partly overlapping. A method for conveying optical signal in such an electronic circuit device is also provided.

Abstract: Electronic circuit device (ECD) and method for conveying clock signal in an ECD. The ECD includes: a cooling fluid conduit network (CFCN) including at least one conduit adapted for conveying an electromagnetic signal, wherein the CFCN is arranged in thermal communication with a first set of one or more components of the ECD and is in signal communication with a second set, and wherein the CFCN is configured to convey both a cooling fluid in the at least one conduit and an electromagnetic signal via the at least one conduit; a clock signal injection unit configured to inject an electromagnetic clock signal (ECS) at an input location of the CFCN; and a clock signal collection unit configured to collect at an output location of the CFCN, an ECS for one or more components of the second set, wherein the ECS is conveyed via a conduit of the CFCN.

Abstract: A mechanism is provided for cooling electronic components of a printed circuit board module and for supplying power to the electronic components of the printed circuit board module. The computer module comprises a printed circuit board module, wherein the electronic components are attached to a first side of the printed circuit board module, and a cooling module being attached to a second side of the printed circuit board, being arranged in parallel to the printed circuit board and having a first layer being thermally and electrically conductive. The first layer is arranged such that heat is dissipated from the printed circuit board module and that power from a power source is supplied to the electronic components of the printed circuit board module.

Abstract: Adsorption heat exchanger devices (11, 25) are provided for use in solid sorption refrigeration systems (1) together with methods for making such devices and adsorbent structures therefor. The methods include applying a curable binder, in solution in a solvent, to granular adsorbent material, and then evaporating the solvent and curing the binder. The curable binder solution is sufficiently dilute that, during evaporation of the solvent, the binder becomes concentrated around contact points between granules (18) of the adsorbent material whereby localized bonds (19) are formed around the contact points on curing of the binder.

Abstract: An integrated circuit coupling device includes an integrated circuit package with N integrated circuit layers (L1-LN) arranged as a 3D stack; and a data transmission medium with n data transmission layers (l1-ln), wherein n?1 and N?2, and wherein the N integrated circuit layers are electrically connectable to the n data transmission layers.

Abstract: A method in a computer-aided design system for generating a functional design model of an integrated circuitry structure including generating a functional representation of at least first and second regions of the integrated circuitry structure, generating a functional representation of an optical layer comprising optical waveguides, and generating a functional representation of a heat-conductive material for transferring heat from at least the second region through the optical layer to a heat sink.

Abstract: An assembly includes a chip including an integrated circuit, a casing including an integrated circuit including plural active elements and having an upper portion formed on a side of the chip and lower portion formed on another side of the chip, plural through-wafer vias (TWVs) for electrically connecting the integrated circuit of the chip and the integrated circuit of the casing, and a card connected to the casing for electrically connecting the casing to a system board.

Abstract: An assembly includes a chip including an integrated circuit, a casing including an integrated circuit and having an upper portion formed on a side of the chip and lower portion formed on another side of the chip, plural through-wafer vias (TWVs) for electrically connecting the integrated circuit of the chip and the integrated circuit of the casing, and a card connected to the casing for electrically connecting the casing to a system board. The card includes an upper card connected to the upper portion of the casing, and a lower card connected to the lower portion of the casing. The upper card includes one of a photosensor, light emitting element, radio frequency (RF) antenna, and radio frequency emitter. The lower card includes an area array input/output.

Abstract: A photovoltaic cell includes an absorbing layer configured to generate electron-hole pairs from incident photons of incoming light; and a first grating layer arranged at a first surface of the absorbing layer which is opposite to a second surface of the absorbing layer from which light is incident, wherein the first grating layer includes at least one grating extending along the first surface, wherein the at least one grating has grating structures which are dimensioned to provide a reflectivity for light incident through the absorbing layer back into the absorbing layer.

Abstract: The invention relates to an integrated circuit stack (1) comprising a plurality of integrated circuit layers (2) and at least one cooling layer (3) arranged in a space between two circuit layers (2). The integrated circuit stack (1) is cooled using a cooling fluid (10) pumped through the cooling layer (3). The invention further relates to a method for configuring of such an integrated circuit stack (1) by optimizing a configuration of the cooling layer (3).

Abstract: An assembly includes a chip including an integrated circuit, a casing including an integrated circuit and having an upper portion formed on a side of the chip and lower portion formed on another side of the chip, plural through-wafer vias (TWVs) for electrically connecting the integrated circuit of the chip and the integrated circuit of the casing, and a card connected to the casing for electrically connecting the casing to a system board.

Abstract: A method of making integrated adsorption and heat exchanger devices for solid sorption refrigeration systems (1). An integrated adsorption and heat exchanger device comprises a solid material having formed therein both a porous adsorption structure, which is pervious to an adsorbate of said system, and a heat exchanger structure, which is impervious to said adsorbate, for heat exchange with the porous adsorption structure in operation of the system.

Abstract: Integrated adsorption and heat exchanger devices are provided for solid sorption refrigeration systems (1), together with methods for making such devices. An integrated adsorption and heat exchanger device (20, 30, 45, 52) comprises a solid material having formed therein both a porous adsorption structure (21, 31, 44, 53), which is pervious to an adsorbate of said system (1), and a heat exchanger structure (22, 32), which is impervious to said adsorbate, for heat exchange with the porous adsorption structure in operation of the system (1).

Abstract: A method is disclosed for operating a photovoltaic thermal hybrid system having a hybrid solar receiver with a photovoltaic module, operatively coupled to the system to deliver an electrical output power for a power user, a thermal collector distinct from the photovoltaic module, wherein the photovoltaic module and/or the thermal collector are movably mounted in the system, a collector thermal storage thermally connected to the thermal collector to store heat collected at the thermal collector, and a positioning mechanism adapted to move the photovoltaic module and/or the thermal collector. The method includes instructing the positioning mechanism to move the photovoltaic module and/or the thermal collector to change a ratio of an intensity of radiation received at the photovoltaic module to an intensity of radiation received at the thermal collector.

Abstract: A chip module cooling device includes two fluid circuits corresponding to inlet and outlet fluid circuits, respectively, wherein each comprises orifices and channel portions forming a tree structure, wherein branches represent the orifices, and nodes represent the channel portions, a branch linking a node to one child node only, wherein several nodes having a same parent node are sibling nodes and extends through L levels of the tree structure, with L?3, and in fluidic connection with the other of the two fluid circuits, via channel portions corresponding to leaf nodes. For each fluid circuit, channel portions corresponding to sibling nodes are parallel to each other, and are not parallel to a channel portion corresponding to a parent node of the sibling nodes; and wherein channel portions of one of the fluid circuits are parallel to and interdigitated with channel portions of the other one of the fluid circuits.

Abstract: A photovoltaic thermal hybrid solar receiver includes a thermal collector, extending in a first plane and comprising an aperture; and a photovoltaic module, configured for electrical output power delivery, comprising a photo-active area that extends in a second plane at a distance from the first plane, the photo-active area being vis-à-vis the aperture, a projection of the aperture perpendicularly to the second plane corresponding to the photo-active area.

Abstract: An assembly includes a chip including an integrated circuit, a casing including an integrated circuit and having an upper portion formed on a side of the chip and lower portion formed on another side of the chip, plural through-wafer vias (TWVs) for electrically connecting the integrated circuit of the chip and the integrated circuit of the casing, and a card connected to the casing for electrically connecting the casing to a system board.

Abstract: A mechanism is provided for optimizing semiconductor packing in a three-dimensional (3D) very-large-scale integration (VLSI) device. The 3D VLSI device comprises a processor layer coupled, via a first set of coupling devices, to at least one signaling and input/output (I/O) layer. The 3D VLSI device further comprises a power delivery layer coupled, via a second set of coupling devices, to the processor layer. In the 3D VLSI device the power delivery layer is dedicated to only delivering power and does not provide data communication signals to the elements of the three-dimensional VLSI device, and the at least one signaling and input/output (I/O) layer is dedicated to only transmitting the data communication signals to and receiving the data communications signals from the processor layer and does not provide power to the elements of the processor layer.

Abstract: A stamp for transferring a pattern to a substrate in the presence of a third medium, includes a permeable hydrophilic matrix for guiding excess third medium away from the surface of the stamp.