Patents by Inventor Bruno Michel

Bruno Michel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120105144
    Abstract: A mechanism is provided for optimizing semiconductor packing in a three-dimensional (3D) very-large-scale integration (VLSI) device. The 3D VLSI device comprises a processor layer coupled, via a first set of coupling devices, to at least one signaling and input/output (I/O) layer. The 3D VLSI device further comprises a power delivery layer coupled, via a second set of coupling devices, to the processor layer. In the 3D VLSI device the power delivery layer is dedicated to only delivering power and does not provide data communication signals to the elements of the three-dimensional VLSI device, and the at least one signaling and input/output (I/O) layer is dedicated to only transmitting the data communication signals to and receiving the data communications signals from the processor layer and does not provide power to the elements of the processor layer.
    Type: Application
    Filed: October 28, 2010
    Publication date: May 3, 2012
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Harry Barowski, Thomas Brunschwiler, Hubert Harrer, Andreas Huber, Bruno Michel, Tim Niggemeier, Stephan Paredes, Jochen Supper
  • Publication number: 20120095945
    Abstract: A method of executing a computer application in the context of a computer model comprising the steps of retrieving computer model data from a model server, retrieving application information from an application server, and executing said application information in the context of the model in an execution environment.
    Type: Application
    Filed: October 8, 2008
    Publication date: April 19, 2012
    Inventors: David Scott Jones, Russel Williamkay, Michael Dailly, Luke Joseph Halliwell, Jacques Bruno Michel Menuet, Jonathan Sinclair Hughes, Oliver Norton, Jonathan Ball, William Herderson
  • Patent number: 8106505
    Abstract: An assembly includes a chip including an integrated circuit, a casing including an integrated circuit and having an upper portion formed on a side of the chip and lower portion formed on another side of the chip, plural through-wafer vias (TWVs) for electrically connecting the integrated circuit of the chip and the integrated circuit of the casing, and a card connected to the casing for electrically connecting the casing to a system board.
    Type: Grant
    Filed: October 31, 2007
    Date of Patent: January 31, 2012
    Assignee: International Business Machines Corporation
    Inventors: Kerry Bernstein, Thomas Brunschwiler, Bruno Michel
  • Patent number: 8107234
    Abstract: Disclosed herein is a data center having a plurality of liquid cooled computer systems. The computer systems each include a processor coupled with a cold plate that allows direct liquid cooling of the processor. The cold plate is further arranged to provide adapted flow of coolant to different portions of the processor whereby higher temperature regions receive a larger flow rate of coolant. The flow is variably adjusted to reflect different levels of activity. By maximizing the coolant temperature exiting the computer systems, the system may utilize the free cooling temperature of the ambient air and eliminate the need for a chiller. A data center is further provided that is coupled with a district heating system and heat is extracted from the computer systems is used to offset carbon emissions and reduce the total cost of ownership of the data center.
    Type: Grant
    Filed: June 4, 2010
    Date of Patent: January 31, 2012
    Assignee: International Business Machines Corporation
    Inventors: Thomas J. Brunschwiler, Ryan J. Linderman, Bruno Michel, Erich M. Ruetsche
  • Patent number: 8049207
    Abstract: A method for manufacturing an organic electronic device including a stack of layers including a release layer, the stack having a lateral structure on a substrate, at least one of the layers being an organic material layer. A method includes with the step of providing a stamp with at least one protrusion of the surface area corresponding to the lateral structure. The stack of layers is deposited with a first face on the surface area of the protrusion of the stamp. A second face of the stack that is opposite to the first face is brought into adhesive contact with the substrate. The stamp is released from the stack.
    Type: Grant
    Filed: October 3, 2007
    Date of Patent: November 1, 2011
    Assignee: International Business Machines Corporation
    Inventors: Siegfried F. Karg, Bruno Michel, Heike E. Riel, Walter H. Riess
  • Patent number: 8004832
    Abstract: Disclosed herein is a data center having a plurality of liquid cooled computer systems. The computer systems each include a processor coupled with a cold plate that allows direct liquid cooling of the processor. The cold plate is further arranged to provide adapted flow of coolant to different portions of the processor whereby higher temperature regions receive a larger flow rate of coolant. The flow is variably adjusted to reflect different levels of activity. By maximizing the coolant temperature exiting the computer systems, the system may utilize the free cooling temperature of the ambient air and eliminate the need for a chiller. A data center is further provided that is coupled with a district heating system and heat is extracted from the computer systems is used to offset carbon emissions and reduce the total cost of ownership of the data center.
    Type: Grant
    Filed: June 4, 2010
    Date of Patent: August 23, 2011
    Assignee: International Business Machines Corporation
    Inventors: Thomas J. Brunschwiler, Ryan J. Linderman, Bruno Michel, Erich M. Ruetsche
  • Publication number: 20110117306
    Abstract: The present invention describes the synthesis of new sulforated fluorinated elastomers having very low glass transition temperatures (Tg), a good resistance to bases, oils and fuels and good properties of workability. These elastomers contain, by way of example, from 80 to 60 mole % of vinylidene fluoride (VDF) and 20 to 40 mole % of perfluoro(4-methyl-3,6-dioxaoct-7-ene) sulfonyl fluoride (PFSO2F). In this case, they are prepared by radical copolymerisation of VDF and PFSO2F in the presence of different organic initiators, for example, peroxides, peresters or diazo compounds.
    Type: Application
    Filed: January 24, 2011
    Publication date: May 19, 2011
    Applicant: HYDRO-QUEBEC
    Inventors: BRUNO Michel AMEDURI, Michel Armand, Mario Boucher, Abdellatif Manseri
  • Publication number: 20110094404
    Abstract: A method for transferring a pattern from an elastic stamp to a substrate in the presence of a third medium is described. A proximity contact is achieved between the stamp and the substrate. A layer of the third medium between the stamp and the substrate is controlled to a predetermined thickness. Stamps for carrying out this method are also described.
    Type: Application
    Filed: January 7, 2011
    Publication date: April 28, 2011
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Alexander Bietsch, Emmanuel Delamarche, Bruno Michel, Heinz Schmid, Heiko Wolf
  • Patent number: 7928565
    Abstract: A semiconductor device having a higher thermal dissipation efficiency includes a thermally conducting structure attached to a surface of the semiconductor device via soldering. The thermally conducting structure is essentially formed of a thermally conducting material and comprises an array of freestanding fins, studs or frames, or a grid of connected fins. A process for fabricating such a semiconductor device includes forming a thermally conducting structure on a carrier and attaching the thermally conducting structure formed on the carrier to a surface of the semiconductor device via soldering.
    Type: Grant
    Filed: February 22, 2010
    Date of Patent: April 19, 2011
    Assignee: International Business Machines Corporation
    Inventors: Thomas J. Brunschwiler, Michel Despont, Mark A. Lantz, Bruno Michel, Peter Vettiger
  • Patent number: 7891295
    Abstract: A method for transferring a pattern from an elastic stamp to a substrate in the presence of a third medium is described. A proximity contact is achieved between the stamp and the substrate. A layer of the third medium between the stamp and the substrate is controlled to a predetermined thickness. Stamps for carrying out this method are also described.
    Type: Grant
    Filed: October 10, 2008
    Date of Patent: February 22, 2011
    Assignee: International Business Machines Corporation
    Inventors: Alexander Bietsch, Emmanuel Delamarche, Bruno Michel, Heinz Schmid, Heiko Wolf
  • Publication number: 20110036538
    Abstract: The invention relates to a cooling arrangement comprising a heat spreader (2) comprising a first surface (5), a second surface (8), at least one heat absorption chamber (9) and at least one heat dissipation chamber (10), the at least one heat absorption chamber (9) being in thermal contact with the first surface (5) and the at least one heat dissipation chamber (10) being in thermal contact with the second surface (8) and hydraulically coupled to the at least one heat absorption chamber (9). A cooling fluid (13) can be driven from the heat absorption chamber (9) to the heat dissipation chamber (10) using a plurality of flow patterns for cooling the first surface (5).
    Type: Application
    Filed: September 2, 2008
    Publication date: February 17, 2011
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Thomas J. Brunschwiler, Urs Koter, Ryan Joseph Linderman, Bruno Michel, Hugo E. Rothuizen, Reto Waelchli
  • Patent number: 7866173
    Abstract: Disclosed herein is a server system having a plurality of computer systems and a liquid cooling system. The computer systems are capable of operating in a first mode of operation at a first operating speed and a first temperature. The computer systems are further capable of operating in a second mode of operation at a second operating speed and a second temperature. The server system switches from the second mode and the first mode in response to a request for processing services rising above a first threshold. The server system further uses a cold battery to store coolant during times of low demand and releases coolant from said cold battery when the system switches to the first mode.
    Type: Grant
    Filed: February 28, 2008
    Date of Patent: January 11, 2011
    Assignee: International Business Machines Corporation
    Inventors: Thomas J. Brunschwiler, Ryan J. Linderman, Bruno Michel, Erich M. Ruetsche
  • Publication number: 20100330317
    Abstract: The present invention describes the synthesis of new fluorinated elastomers with very low glass transition temperatures (Tg), a good resistance to bases, gasoline and other carburants and good workability properties, these elastomers contain hexafluoropropene (HFP), perfluoro(4-methyl-3,6-dioxaoct-7-ene) sulfonyl fluoride (PFSO2F), vinylidene fluoride (VDF) and/or at least one fluorinated alkene and/or one vinyl perfluorinated ether. In a precise case, they are prepared by radical polymerisation of HFP and PFSO2F or by radical terpolymerisation HFP, PFSO2F and VDF in the presence of different organic initiator, such as peroxides, peresters or diazo compounds.
    Type: Application
    Filed: September 9, 2010
    Publication date: December 30, 2010
    Applicant: HYDRO-QUEBEC
    Inventors: Bruno Michel AMEDURI, Michel Armand, Mario Boucher, Abdellatif Manseri
  • Publication number: 20100290188
    Abstract: The invention relates to an integrated circuit stack (1) comprising a plurality of integrated circuit layers (2) and at least one cooling layer (3) arranged in a space between two circuit layers (2). The integrated circuit stack (1) is cooled using a cooling fluid (10) pumped through the cooling layer (3). The invention further relates to a method for optimizing a configuration of such an integrated circuit stack (1).
    Type: Application
    Filed: September 17, 2008
    Publication date: November 18, 2010
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Thomas J. Brunschwiler, Ryan Joseph Linderman, Bruno Michel, Hugo E. Rothuizen
  • Patent number: 7808780
    Abstract: Disclosed herein is a data center having a plurality of liquid cooled computer systems. The computer systems each include a processor coupled with a cold plate that allows direct liquid cooling of the processor. The cold plate is further arranged to provide adapted flow of coolant to different portions of the processor whereby higher temperature regions receive a larger flow rate of coolant. The flow is variably adjusted to reflect different levels of activity. By maximizing the coolant temperature exiting the computer systems, the system may utilize the free cooling temperature of the ambient air and eliminate the need for a chiller. A data center is further provided that is coupled with a district heating system and heat is extracted from the computer systems is used to offset carbon emissions and reduce the total cost of ownership of the data center.
    Type: Grant
    Filed: February 28, 2008
    Date of Patent: October 5, 2010
    Assignee: International Business Machines Corporation
    Inventors: Thomas J. Brunschwiler, Ryan J. Linderman, Bruno Michel, Erich M. Ruetsche
  • Publication number: 20100246117
    Abstract: Disclosed herein is a data center having a plurality of liquid cooled computer systems. The computer systems each include a processor coupled with a cold plate that allows direct liquid cooling of the processor. The cold plate is further arranged to provide adapted flow of coolant to different portions of the processor whereby higher temperature regions receive a larger flow rate of coolant. The flow is variably adjusted to reflect different levels of activity. By maximizing the coolant temperature exiting the computer systems, the system may utilize the free cooling temperature of the ambient air and eliminate the need for a chiller. A data center is further provided that is coupled with a district heating system and heat is extracted from the computer systems is used to offset carbon emissions and reduce the total cost of ownership of the data center.
    Type: Application
    Filed: June 4, 2010
    Publication date: September 30, 2010
    Applicant: INTERNATIONAL BUSINESS MACHINES COPORATION
    Inventors: Thomas J. Brunschwiler, Ryan J. Linderman, Bruno Michel, Erich M. Ruetsche
  • Publication number: 20100241278
    Abstract: Disclosed herein is a data center having a plurality of liquid cooled computer systems. The computer systems each include a processor coupled with a cold plate that allows direct liquid cooling of the processor. The cold plate is further arranged to provide adapted flow of coolant to different portions of the processor whereby higher temperature regions receive a larger flow rate of coolant. The flow is variably adjusted to reflect different levels of activity. By maximizing the coolant temperature exiting the computer systems, the system may utilize the free cooling temperature of the ambient air and eliminate the need for a chiller. A data center is further provided that is coupled with a district heating system and heat is extracted from the computer systems is used to offset carbon emissions and reduce the total cost of ownership of the data center.
    Type: Application
    Filed: June 4, 2010
    Publication date: September 23, 2010
    Applicant: INTERNATIONAL BUSINESS MACHINES COPORATION
    Inventors: Thomas J. Brunschwiler, Ryan J. Linderman, Bruno Michel, Erich M. Ruetsche
  • Publication number: 20100180782
    Abstract: A method for transferring a pattern from an elastic stamp to a substrate in the presence of a third medium is described. A proximity contact is achieved between the stamp and the substrate. A layer of the third medium between the stamp and the substrate is controlled to a predetermined thickness. Stamps for carrying out this method are also described.
    Type: Application
    Filed: March 29, 2010
    Publication date: July 22, 2010
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Alexander Bietsch, Emmanuel Delamarche, Bruno Michel, Heinz Schmid, Heiko Wolf
  • Patent number: 7748440
    Abstract: The present invention provides a thermal interface with a first and a second face that are in contact to each other by a thermal conducting material. A first face includes grooves that are at least partly filled with the thermal conducting material, wherein at least two types of grooves are arranged, namely first grooves having a larger width than second grooves. The first face comprises an array with protrusions that are confined by the second grooves, the array being divided by the first grooves into sub-arrays.
    Type: Grant
    Filed: June 1, 2005
    Date of Patent: July 6, 2010
    Assignee: International Business Machines Corporation
    Inventors: Bruno Michel, Thomas J. Brunschwiler, Hugo E. Rothuizen, Urs Kloter
  • Patent number: 7740472
    Abstract: A device for flowing a liquid on a surface comprises: a flow path. A first port supplies the liquid to one end of the flow path and applies a first port pressure for retaining the liquid when the flow path is remote from the surface. A second port receives the liquid from the other end of the flow path and applies a second port pressure such that the difference between the first and second negative port pressures is oriented to promote flow of the liquid from the first port to the second port via the flow path in response to the flow path being located proximal to the surface and the liquid in the device contacting the surface. The first and second port pressures are such that the liquid is drawn towards at least the second port in response to withdrawal of the flow path from the surface. Such devices may employ microfluidic technology and find application in surface patterning.
    Type: Grant
    Filed: August 9, 2007
    Date of Patent: June 22, 2010
    Assignee: International Business Machines Corporation
    Inventors: Emmanuel Delamarche, David Juncker, Bruno Michel, Heinz Schmid