Patents by Inventor Bruno Michel

Bruno Michel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7329111
    Abstract: A device for flowing a liquid on a surface comprises: a flow path. A first port supplies the liquid to one end of the flow path and applies a first port pressure for retaining the liquid when the flow path is remote from the surface. A second port receives the liquid from the other end of the flow path and applies a second port pressure such that the difference between the first and second negative port pressures is oriented to promote flow of the liquid from the first port to the second port via the flow path in response to the flow path being located proximal to the surface and the liquid in the device contacting the surface. The first and second port pressures are such that the liquid is drawn towards at least the second port in response to withdrawal of the flow path from the surface. Such devices may employ microfluidic technology and find application in surface patterning.
    Type: Grant
    Filed: November 13, 2003
    Date of Patent: February 12, 2008
    Assignee: International Business Machines Corporation
    Inventors: Emmanuel Delamarche, David Juncker, Bruno Michel, Heinz Schmid
  • Publication number: 20080017978
    Abstract: A semiconductor device having a higher thermal dissipation efficiency comprises a thermally conducting structure attached to a surface of the semiconductor device via soldering. The thermally conducting structure is essentially formed of a thermally conducting material and comprises an array of freestanding fins, studs or frames, or a grid of connected fins. A process for fabricating such a semiconductor device includes forming a thermally conducting structure on a carrier and attaching the thermally conducting structure formed on the carrier to a surface of the semiconductor device via soldering.
    Type: Application
    Filed: September 9, 2007
    Publication date: January 24, 2008
    Inventors: Thomas Brunschwiler, Michel Despont, Mark Lantz, Bruno Michel, Peter Vettiger
  • Publication number: 20080000536
    Abstract: A device for flowing a liquid on a surface comprises: a flow path. A first port supplies the liquid to one end of the flow path and applies a first port pressure for retaining the liquid when the flow path is remote from the surface. A second port receives the liquid from the other end of the flow path and applies a second port pressure such that the difference between the first and second negative port pressures is oriented to promote flow of the liquid from the first port to the second port via the flow path in response to the flow path being located proximal to the surface and the liquid in the device contacting the surface. The first and second port pressures are such that the liquid is drawn towards at least the second port in response to withdrawal of the flow path from the surface. Such devices may employ microfluidic technology and find application in surface patterning.
    Type: Application
    Filed: August 9, 2007
    Publication date: January 3, 2008
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Emmanuel Delamarche, David Juncker, Bruno Michel, Heinz Schmid
  • Patent number: 7306970
    Abstract: A method for manufacturing an organic electronic device including a stack of layers with a lateral structure on a substrate, at least one of the layers being an organic material layer. A method includes with the step of providing a stamp with at least one protrusion of the surface area corresponding to the lateral structure. The stack of layers is deposited with a first face on the surface area of the protrusion of the stamp. A second face of the stack that is opposite to the first face is brought into adhesive contact with the substrate. The stamp is released from the stack.
    Type: Grant
    Filed: August 29, 2005
    Date of Patent: December 11, 2007
    Assignee: International Business Machines Corporation
    Inventors: Siegfried F. Karg, Bruno Michel, Heike E. Riel, Walter H. Riess
  • Publication number: 20070275556
    Abstract: A method for forming a multilevel structure on a surface by depositing a curable liquid layer on the surface; pressing a stamp having a multilevel pattern therein into the liquid layer to produce in the liquid layer a multilevel structure defined by the pattern; and, curing the liquid layer to produce a solid layer having the multilevel structure therein. Mechanical alignment may be employed to enhance optical alignment of the stamp relative to the substrate via spaced protrusions on the substrate on which the structure is to be formed and complementary recesses in the patterning of the stamp.
    Type: Application
    Filed: August 23, 2004
    Publication date: November 29, 2007
    Inventors: Alexander Bietsch, Bruno Michel
  • Patent number: 7282799
    Abstract: An interface is formed by pressing a patterned first surface and a second surface together, with a particle-loaded interface material in between. The first surface is fabricated with a pattern of channels designed to redistribute the velocity gradients that occur in the interface material during interface formation in order to control the arrangement, orientation and concentration of particles at the end of the interface formation. The concept finds application in thermal interfaces and controlled placement of nano and micro particles and biological molecules.
    Type: Grant
    Filed: May 19, 2006
    Date of Patent: October 16, 2007
    Assignee: International Business Machines Corporation
    Inventors: Thomas J. Brunschwiler, Urs Kloter, Ryan Joesph Linderman, Bruno Michel, Hugo E. Rothuizen
  • Publication number: 20070230133
    Abstract: A stress release thermal interface is provided for preventing the building up of stress between chip and heat sink surfaces in a multi-chip module (MCM) while maintaining reliable thermal and mechanical contact. The interface achieves enhanced thermal conduction by using flexible, interlocking posts attached to the surfaces of the chip and the heat sink.
    Type: Application
    Filed: March 30, 2006
    Publication date: October 4, 2007
    Applicant: International Business Machines Corporation
    Inventors: Bruno Michel, Thomas Brunschwiler, Ryan Linderman, Hugo Rothuizen, Urs Kloter
  • Patent number: 7271034
    Abstract: Provides semiconductor devices and method for fabricating devices having a high thermal dissipation efficiency. An example device comprises a thermally conducting structure attached to a surface of the semiconductor device via soldering. The thermally conducting structure is essentially formed of a thermally conducting material and comprises an array of freestanding fins, studs or frames, or a grid of connected fins. A process for fabricating such a semiconductor device includes forming a thermally conducting structure on a carrier and attaching the thermally conducting structure formed on the carrier to a surface of the semiconductor device via soldering.
    Type: Grant
    Filed: June 9, 2005
    Date of Patent: September 18, 2007
    Assignee: International Business Machines Corporation
    Inventors: Thomas J. Brunschwiler, Michel Despont, Mark A. Lantz, Bruno Michel, Peter Vettiger
  • Patent number: 7255153
    Abstract: A manifold apparatus, system and method for thermally controlling a substrate whereby a manifold body having a microjet array and a drain array traversing there-through in a direction orthogonal to a substrate surface and parallel to each other is attached to the substrate surface for heating or cooling thereof. A cavity of the manifold body resides over the substrate surface such that liquid is emitted from the liquid microjets into the cavity for contact with the substrate surface, while the drains orthogonally remove spent liquid from the cavity. The manifold body is designed and configured into a plurality of cooling cells, whereby each cooling cell has a liquid microjet surrounded by at least three drains for preventing interactions between adjacent liquid microjets within adjacent cooling cells. Gas microjets may also traverse through the manifold body to form an atomized liquid spray for contact with the substrate surface.
    Type: Grant
    Filed: May 25, 2005
    Date of Patent: August 14, 2007
    Assignee: International Business Machines Corporation
    Inventors: Daniel G. Berger, Raschid J. Bezama, Lester W. Herron, Bruno Michel, Govindarajan Natarajan
  • Patent number: 7238906
    Abstract: The invention proposes a switch (10) comprising a casing (12) which carries a pair of fixed contact elements (48), a contact bar (96) which is movable between a rear closure position and a front opening position, and a member (60) for actuation of the movable contact bar (96) which is mounted so as to slide between a rear rest position and a front triggering position, the movable contact bar (96) and the actuation member (60) constituting a movable assembly, and the switch (10) comprising a return spring (108) which co-operates with the movable contact bar (96) so as to urge it towards its rear closure position.
    Type: Grant
    Filed: September 12, 2006
    Date of Patent: July 3, 2007
    Assignee: ITT Manufacturing Enterprises, Inc.
    Inventor: Bruno Michel
  • Patent number: 7235464
    Abstract: The invention relates to a method for creating a pattern on a substrate comprising a first alignment structure, using an elastomeric stamp comprising a patterning structure and a second alignment structure. The method comprises a moving step for moving the elastomeric stamp towards the substrate, and a deformation step for deforming the patterning structure with a tensile or compressive force generated by cooperation of the first alignment structure and the second alignment structure.
    Type: Grant
    Filed: May 28, 2003
    Date of Patent: June 26, 2007
    Assignee: International Business Machines Corporation
    Inventors: Gian-Luca Bona, Bruno Michel, Hugo Eric Rothuizen, Peter Vettiger, Han Biebuyck
  • Publication number: 20070119565
    Abstract: A cooling device has a large number of closely spaced impinging jets, adjacent an impingement gap, with parallel return paths for supplying coolant flow for the impinging jets with the least possible pressure drop using an interdigitated, branched hierarchical manifold. Surface enhancement features spanning the impingement gap form U-shaped microchannels between single impinging jets and single outlets.
    Type: Application
    Filed: November 13, 2006
    Publication date: May 31, 2007
    Applicant: International Business Machines Corporation
    Inventors: Thomas Brunschwiler, Urs Kloter, Ryan Linderman, Bruno Michel, Hugo Rothuizen
  • Patent number: 7168939
    Abstract: UV molding from elastomeric masters on thin bendable backplanes that allow replication of UV-cured resist patterns with high accuracy is disclosed. This design accommodates large substrate topographies, has improved de-molding properties, and facilitates two-in-one lithography and assembly of the sliders on topographically structured elastomeric sticky pads. The combination of sticky pad assembly and two-in-one lithography allows an all-in-one harmony process based on UV-molding. These features cure prior art technical problems of the harmony process while significantly reducing cost.
    Type: Grant
    Filed: February 26, 2004
    Date of Patent: January 30, 2007
    Assignee: Hitachi Global Storage Technologies Netherlands BV
    Inventors: Alexander Bietsch, Michael W. Chaw, Ashok Lahiri, Ian Robson McFadyen, Bruno Michel, Mark C. Thurber
  • Publication number: 20070017659
    Abstract: A flexible, self-contained active multi-phase heat spreader apparatus for cooling electronic components, the heat spreader having fluid sealed between two plates and a pumping mechanism to actuate multi-phase flow of the fluid. Thermal energy from an electronic component in contact with the heat spreader is dissipated from a core region via the working fluid to the entire heat spreader, and then to a heat sink. Surface enhancement features located between the two plates aid transfer of thermal energy from a first metal plate into the fluid.
    Type: Application
    Filed: June 28, 2006
    Publication date: January 25, 2007
    Applicant: International Business Machines Corporation
    Inventors: Thomas Brunschwiler, Urs Kloter, Ryan Linderman, Bruno Michel, Hugo Rothuizen
  • Publication number: 20070015153
    Abstract: A method for producing a monolayer of molecules on a surface comprises: loading a stamp with seed molecules; transferring seed molecules from the stamp to the surface; and, amplifying the seed molecules via an amplifying reaction to produce the monolayer. The method permit generation of complete monolayers from incomplete or sparse monolayers initially printed on the surface.
    Type: Application
    Filed: November 13, 2003
    Publication date: January 18, 2007
    Inventors: Sergey Amontov, Emmanuel Delamarche, Bruno Michel
  • Publication number: 20070000767
    Abstract: The invention proposes a switch (10) comprising a casing (12) which carries a pair of fixed contact elements (48), a contact bar (96) which is movable between a rear closure position and a front opening position, and a member (60) for actuation of the movable contact bar (96) which is mounted so as to slide between a rear rest position and a front triggering position, the movable contact bar (96) and the actuation member (60) constituting a movable assembly, and the switch (10) comprising a return spring (108) which co-operates with the movable contact bar (96) so as to urge it towards its rear closure position.
    Type: Application
    Filed: September 12, 2006
    Publication date: January 4, 2007
    Inventor: Bruno Michel
  • Publication number: 20060286682
    Abstract: Described is a process for producing a biomolecular monolayer on a biosensor surface comprising the steps of: reacting a biosensor surface with a solution of heterobifunctional reagent having a first functional group and a second functional group, the first functional group being capable of forming a covalent bond to the biosensor surface groups, the second functional group forming a covalent bond with a homobifunctional polymer to obtain a self-assembled monolayer, and thereafter reacting the monolayer with capture molecules.
    Type: Application
    Filed: June 21, 2006
    Publication date: December 21, 2006
    Inventors: Sergey Amontov, Bruno Michel, Sally Swanson, Heiko Wolf
  • Publication number: 20060286560
    Abstract: A method for producing a monolayer of molecules on a surface is described. The method includes loading a stamp with seed molecules, transferring seed molecules from the stamp to the surface, and amplifying the seed molecules via an amplifying reaction to produce the monolayer. This method permits generation of complete monolayers from incomplete or sparse monolayers initially printed on the surface.
    Type: Application
    Filed: June 16, 2005
    Publication date: December 21, 2006
    Applicant: International Business Machines Corporation
    Inventors: Sergey Amontov, Emmanuel Delamarche, Bruno Michel
  • Publication number: 20060286712
    Abstract: An interface is formed by pressing a patterned first surface and a second surface together, with a particle-loaded interface material in between. The first surface is fabricated with a pattern of channels designed to redistribute the velocity gradients that occur in the interface material during interface formation in order to control the arrangement, orientation and concentration of particles at the end of the interface formation. The concept finds application in thermal interfaces and controlled placement of nano and micro particles and biological molecules.
    Type: Application
    Filed: May 19, 2006
    Publication date: December 21, 2006
    Applicant: International Business Machines Corporation
    Inventors: Thomas Brunschwiler, Urs Kloter, Ryan Linderman, Bruno Michel, Hugo Rothuizen
  • Publication number: 20060266497
    Abstract: A manifold apparatus, system and method for thermally controlling a substrate whereby a manifold body having a microjet array and a drain array traversing there-through in a direction orthogonal to a substrate surface and parallel to each other is attached to the substrate surface for heating or cooling thereof. A cavity of the manifold body resides over the substrate surface such that liquid is emitted from the liquid microjets into the cavity for contact with the substrate surface, while the drains orthogonally remove spent liquid from the cavity. The manifold body is designed and configured into a plurality of cooling cells, whereby each cooling cell has a liquid microjet surrounded by at least three drains for preventing interactions between adjacent liquid microjets within adjacent cooling cells. Gas microjets may also traverse through the manifold body to form an atomized liquid spray for contact with the substrate surface.
    Type: Application
    Filed: May 25, 2005
    Publication date: November 30, 2006
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Daniel Berger, Raschid Bezama, Lester Herron, Bruno Michel, Govindarajan Natarajan