Abstract: A package for a device to be inserted into a solid structure may include a building material that includes particles of one of micrometric and sub-micrometric dimensions. The device may include an integrated detection module having at least one integrated sensor and the package arranged to coat at least one portion of the device including the integrated detection module. A method aspect includes a method of manufacturing the device. A system aspect is for monitoring parameters in a solid structure that includes the device.

Abstract: The integrated electronic device is for detecting a local parameter related to a force experienced in a predetermined direction within a solid structure. The device includes a semiconductor substrate having a substantially planar region that defines a plane substantially perpendicular to the predetermined direction. At least one sensor detects the local parameter at least in the predetermined direction with a piezo-resistive effect. At least one substantially planar face is arranged in a portion of the integrated electronic device, the face belonging to a inclined plane by a predetermined angle relative to the plane perpendicular to the predetermined direction, which plane is defined by the substantially planar region of the substrate. The predetermined angle is defined such as to reduce forces acting in directions other than the predetermined direction at the portion of the device around the at least one sensor.

Abstract: The integrated electronic device is for detecting a local parameter related to a force experienced in a predetermined direction within a solid structure. The device includes a semiconductor substrate having a substantially planar region that defines a plane substantially perpendicular to the predetermined direction. At least one sensor detects the local parameter at least in the predetermined direction with a piezo-resistive effect. At least one substantially planar face is arranged in a portion of the integrated electronic device, the face belonging to a inclined plane by a predetermined angle relative to the plane perpendicular to the predetermined direction, which plane is defined by the substantially planar region of the substrate. The predetermined angle is defined such as to reduce forces acting in directions other than the predetermined direction at the portion of the device around the at least one sensor.

Abstract: The integrated electronic device is for detecting a local parameter related to a force observed in a given direction, within a solid structure. The device includes at least one sensor configured to detect the above-mentioned local parameter at least in the given direction through piezo-resistive effect. At least one damping element, integrated in the device, is arranged within a frame-shaped region that is disposed around the at least one sensor and belongs to a substantially planar region comprising a plane passing through the sensor and perpendicular to the given direction. Such at least one damping element is configured to damp forces acting in the planar region and substantially perpendicular to the given direction.

Abstract: A MEMS device includes a supporting body, a first deformable element and a second deformable element, and a mobile element set between the first and second deformable elements and rotatable with respect to the fixed supporting body. A generator causes a current to flow through at least one of the first and second deformable elements, which function as resistors, so as to generate an electrical position signal proportional to deformation of the first and second deformable elements and indicative of angular position of the mobile element. The electrical signal is processed to determine mobile element angular position. A drive signal is generated in response to the electrical signal for the purpose of driving oscillation of the mobile element.

Abstract: Device (100) for detecting and monitoring local parameters within a solid structure (300). The device comprises an integrated detection module (1) made on a single chip, having an integrated functional circuitry portion (16) comprising at least one integrated sensor (10) and an integrated antenna (11), and electromagnetic means (2) for transmitting/receiving signals and energy exchange. The integrated functional circuitry portion (16) comprises a functional surface (18) facing towards the outside of the chip. A passivation layer (15) is arranged to completely cover at least the functional surface (18), so that the integrated detection module (1) is entirely hermetically sealed and galvanically insulated from the surrounding environment. The integrated antenna (11), the electromagnetic means (2) and the remote antenna (221) are operatively connected wirelessly through magnetic or electromagnetic coupling.

Abstract: A monitoring device is for the inner pressure distribution of building material in a building structure. The device may include planar sensing capacitors to be buried in contact with the building material, with each sensing capacitor including a pair of plates and a dielectric material layer therebetween adapted to undergo elastic deformation under pressure without deforming plastically. The device may also include a protection box to be buried in the building material, a dielectric material enclosed in the protection box, and connection terminals protruding from the protection box. Pairs of metal vias are buried in the dielectric material enclosed within the protection box, with each pair connecting the plates of a respective planar sensing capacitor to respective connection terminals.

Abstract: In an electrostatic micromotor, a mobile substrate faces a fixed substrate and is suspended over the fixed substrate at a given distance of separation in an operative resting condition; an actuation unit is configured so as to give rise to a relative movement of the mobile substrate with respect to the fixed substrate in a direction of movement during an operative condition of actuation. The actuation unit is also configured so as to bring the mobile substrate and the fixed substrate substantially into contact and to keep them in contact during the operative condition of actuation. The electrostatic micromotor is provided with an electronic unit for reducing friction, configured so as to reduce a friction generated by the contact between the rotor substrate and the stator substrate during the relative movement.

Abstract: In an electrostatic micromotor, a mobile substrate faces a fixed substrate, and electrostatic-interaction elements are provided to allow a relative movement of the mobile substrate with respect to the fixed substrate in a direction of movement. The electrostatic-interaction elements include electrodes arranged on a facing surface of the fixed substrate (2) facing the mobile substrate. The mobile substrate has indentations, which extend within the mobile substrate starting from a respective facing surface that faces the fixed substrate and define between them projections staggered with respect to the electrodes in the direction of movement. Side walls of the indentations have a first distance of separation at the respective facing surface, and a second distance of separation, greater than the first distance of separation, at an internal region of the indentations.

Abstract: A process manufactures an interaction structure for a storage medium. The process includes forming a first interaction head provided with a first conductive region having a sub-lithographic dimension. The step of forming a first interaction head includes: forming on a surface a first delimitation region having a side wall; depositing a conductive portion having a deposition thickness substantially matching the sub-lithographic dimension on the side wall; and then defining the conductive portion. The sub-lithographic dimension preferably is between 1 and 50 nm, more preferably 20 nm.

Abstract: A process manufactures an interaction structure for a storage medium. The process includes forming a first interaction head provided with a first conductive region having a sub-lithographic dimension. The step of forming a first interaction head includes: forming on a surface a first delimitation region having a side wall; depositing a conductive portion having a deposition thickness substantially matching the sub-lithographic dimension on the side wall; and then defining the conductive portion. The sub-lithographic dimension preferably is between 1 and 50 nm, more preferably 20 nm.

Abstract: A pressure sensor including a pressure-sensor element having a monolithic body of semiconductor material, and a first main face and a second main face acting on which is a stress resulting from a pressure, the value of which is to be determined; and a package enclosing the pressure-sensor element. The package has an inner chamber containing liquid material, and the pressure-sensor element is arranged within the inner chamber in such a manner that the first and second main faces are both in contact with the liquid material. In particular, the liquid material is a silicone gel.

Abstract: A microelectromechanical device that includes a fixed supporting body, at least one semiconductor body, which is movable with respect to the fixed supporting body, and at least one micromotor for moving the semiconductor body with respect to the fixed supporting body, the micromotor having at least one permanent magnet and a coil, which are coupled together and are movable with respect to one another. A ferromagnetic guide is coupled to the magnet and is shaped so as to concentrate lines of magnetic field generated by the magnet towards the coil.

Abstract: A microelectromechanical device that includes a fixed supporting body, at least one semiconductor body, which is movable with respect to the fixed supporting body, and at least one micromotor for moving the semiconductor body with respect to the fixed supporting body, the micromotor having at least one permanent magnet and a coil, which are coupled together and are movable with respect to one another. A ferromagnetic guide is coupled to the magnet and is shaped so as to concentrate lines of magnetic field generated by the magnet towards the coil.

Abstract: An electrostatic micromotor is provided with a fixed substrate, a mobile substrate facing the fixed substrate, and electrostatic-interaction elements enabling a relative movement of the mobile substrate with respect to the fixed substrate in a movement direction; the electrostatic micromotor is also provided with a capacitive position-sensing structure configured to enable sensing of a relative position of the mobile substrate with respect to the fixed substrate in the movement direction. The capacitive position-sensing structure is formed by sensing indentation, extending within the mobile substrate from a first surface thereof, and by first sensing electrode, facing, in given operating condition, the sensing indentation.

Abstract: In an electrostatic micromotor, a mobile substrate faces a fixed substrate and is suspended over the fixed substrate at a given distance of separation in an operative resting condition; an actuation unit is configured so as to give rise to a relative movement of the mobile substrate with respect to the fixed substrate in a direction of movement during an operative condition of actuation. The actuation unit is also configured so as to bring the mobile substrate and the fixed substrate substantially into contact and to keep them in contact during the operative condition of actuation. The electrostatic micromotor is provided with an electronic unit for reducing friction, configured so as to reduce a friction generated by the contact between the rotor substrate and the stator substrate during the relative movement.

Abstract: In an electrostatic micromotor, a mobile substrate faces a fixed substrate, and electrostatic-interaction elements are provided to allow a relative movement of the mobile substrate with respect to the fixed substrate in a direction of movement. The electrostatic-interaction elements include electrodes arranged on a facing surface of the fixed substrate (2) facing the mobile substrate. The mobile substrate has indentations, which extend within the mobile substrate starting from a respective facing surface that faces the fixed substrate and define between them projections staggered with respect to the electrodes in the direction of movement. Side walls of the indentations have a first distance of separation at the respective facing surface, and a second distance of separation, greater than the first distance of separation, at an internal region of the indentations.

Abstract: An electrostatic micromotor is provided with a fixed substrate, a mobile substrate facing the fixed substrate, and electrostatic-interaction elements enabling a relative movement of the mobile substrate with respect to the fixed substrate in a movement direction; the electrostatic micromotor is also provided with a capacitive position-sensing structure configured to enable sensing of a relative position of the mobile substrate with respect to the fixed substrate in the movement direction. The capacitive position-sensing structure is formed by sensing indentation, extending within the mobile substrate from a first surface thereof, and by first sensing electrode, facing, in given operating condition, the sensing indentation.

Abstract: A process manufactures an interaction structure for a storage medium. The process includes forming a first interaction head provided with a first conductive region having a sub-lithographic dimension. The step of forming a first interaction head includes: forming on a surface a first delimitation region having a side wall; depositing a conductive portion having a deposition thickness substantially matching the sub-lithographic dimension on the side wall; and then defining the conductive portion. The sub-lithographic dimension preferably is between 1 and 50 nm, more preferably 20 nm.

Abstract: A micro-electro-mechanical device formed by a body of semiconductor material having a thickness and defining a mobile part and a fixed part. The mobile part is formed by a mobile platform, supporting arms extending from the mobile platform to the fixed part, and by mobile electrodes fixed to the mobile platform. The fixed part has fixed electrodes facing the mobile electrodes, a first biasing region fixed to the fixed electrodes, a second biasing region fixed to the supporting arms, and an insulation region of insulating material extending through the entire thickness of the body. The insulation region insulates electrically at least one between the first and the second biasing regions from the rest of the fixed part.