Abstract: A semiconductor device comprises a carrier including an adhesive disposed over the carrier. The semiconductor device further comprises a semiconductor wafer including a plurality of semiconductor die separated by a non-active region. A plurality of bumps is formed over the semiconductor die. The semiconductor wafer is mounted to the carrier with the adhesive disposed around the plurality of bumps. Irradiated energy is applied to the non-active region to form a modified region within the non-active region. The semiconductor wafer is singulated along the modified region to separate the semiconductor die. The semiconductor wafer is singulated along the modified region by applying stress to the semiconductor wafer. The adhesive is removed from around the plurality of bumps after singulating the semiconductor wafer. The semiconductor wafer includes a plurality of semiconductor die comprising through silicon vias. The modified region optionally includes a plurality of vertically stacked modified regions.

Abstract: A semiconductor device has a semiconductor die and an encapsulant deposited over the semiconductor die. A conductive layer can be formed over the encapsulant and the semiconductor die. A transmissive layer can be formed over the semiconductor die. An interconnect structure can be formed through the encapsulant and electrically connected to the conductive layer, whereby the interconnect structure is formed off to only one side of the semiconductor die.

Abstract: A semiconductor manufacturing apparatus may include: a pickup unit configured to pick up a chip in a first region of the semiconductor manufacturing apparatus; a bonding head configured to receive the picked-up chip and configured to move from the first region to a top of a circuit board in a second region of the semiconductor manufacturing apparatus; and/or an optical unit configured to detect a bonding position on the circuit board while moving from the first region to the second region. A semiconductor manufacturing apparatus may include: a bonding head including a heater for heating a chip and bonding the chip onto a circuit board; and/or a cooling block, adjacent to the heater, through which cooling liquid flows. The cooling liquid may be removed from the cooling block while the heater generates heat. The cooling liquid may be supplied to the cooling block while the heater is cooled.

Abstract: A rivet screw drill for fastening at least two panels, the rivet screw drill includes a head portion mounted to a fastening tool, a fastening portion integrally formed with the head portion and of which a screw thread is formed thereto and a perforating portion integrally formed with the fastening portion and pressurizing and penetrating the panels by rotation according to operation of the fastening tool, wherein a mounting protrusion, connected to the fastening tool, is protruded from the head portion and a plurality of support ends are formed to the mounting protrusion.

Abstract: An integrated circuit packaging system and method of manufacture thereof includes: a substrate with internal circuitry between a substrate top side, a substrate bottom side, and vertical sides; an integrated circuit coupled to the internal circuitry; a molded package body formed directly on the integrated circuit and the substrate top side of the substrate; and a conductive conformal shield structure applied directly on the molded package body, the vertical sides, and to extend below the substrate bottom side coupled to the internal circuitry.

Abstract: An image signal processing device includes a channel converter to divide an input signal stream, that includes image signals generated by a plurality of pixels, by processing units and generate a plurality of processing unit signals, an image signal processing core including a plurality of image processing channels each performing an image signal processing operation, and generating a plurality of output unit signals by receiving and processing the plurality of processing unit signals in parallel through one or more of the plurality of image processing channels, a channel combiner to combine the plurality of output unit signals and generate an output signal stream, and a configuration controller to control, according to an operation mode, at least one of the number of the plurality of processing unit signals, selection of a frequency of a processing clock signal, and combination of the plurality of output unit signals.

Abstract: Provided are an image sensor and an imaging apparatus. The image sensor of a multi-layered sensor structure, the image sensor includes a plurality of sensing pixels, each of the plurality of sensing pixels including a micro lens configured to collect light, a first photoelectric converter configured to convert light of a first wavelength band into an electric signal, and a second photoelectric converter formed on a substrate configured to convert incident light into the electric signal, wherein a central axis of the second photoelectric converter is spaced apart from an optical axis of the micro lens.

Abstract: An electronic device is provided. The electronic device includes a memory in which contact information is stored, a communication circuit configured to receive at least one piece of contact information from the outside, and a processor configured to unify language scripts between a name of the stored contact information and a name of the received contact information and determine whether to integrate the stored contact information and the received contact information by comparing the name of the stored contact information with the name of the received contact information in a unified language script.

Abstract: Disclosed is an event communication apparatus for a protection relay, which effectively simplifies an event determination operation by a main processing module and a communication module, thereby enhancing updating. The event communication apparatus for the protection relay includes a shared memory configured to store and provide data needed to share, a main processing module configured to, whenever an event occurs, update previous event data to a status information of the event and a status occurrence time information as new event data, and write the updated event data into the shared memory, and a communication module configured to periodically read status information from the shared memory, compare the read status information with pre-stored previous status information to determine whether there is a status change, determine occurrence of a new event when there is the status change, and transmit corresponding event data to an supervisory monitor immediately when the new event occurs.

Abstract: An image signal processor including a first data processing circuit, a second data processing circuit, and a multiplexing control circuit configured to transmit first line data included in first frame data and second line data included in second frame data to the first data processing circuit in a time-division multiplexing mode may be provided. The multiplexing control circuit may be further configured to transmit to the first data processing circuit a switching control signal, which indicates whether current line data to be transmitted to the first data processing circuit is the first line data or the second line data.

Abstract: A frame for a self-piercing rivet system that can provide bearing capacity for joining a rivet to a plate by using an anvil die and a punch unit is disclosed.

Abstract: A software-defined network (SDN) system and method for implementing the same can construct a network having flexible network topology by abstracting switches and controllers, as well as a host connected to said switches, and controllers, thereby increasing scalability of a hierarchical SDN network. The SDN system includes a host part, an SDN switch part, and an SDN controller part.

Abstract: A system for controlling a carrier virtual network is disclosed. The system includes at least one virtual network controller for controlling resources of a carrier virtual network based on customer request information received from a customer network controller, and at least one physical network controller for controlling resources of a carrier physical network based on a service profile received from the at least one virtual network controller. The at least one virtual network controller interworks with the at least one physical network controller in a one to one, one to N (N is an integer equal to or larger than 2), or N to one correspondence.

Abstract: An image processing device includes a pixel array including multiple unit pixels each configured to generate multiple color signals in response to incident light, and a data processing unit configured to generate output image data by processing the color signals in parallel in a first operating mode, and further configured to generate two image signals for each unit pixel based on the color signals and to generate the output image data by processing the two image signals in parallel in a second operating mode.

Abstract: An image sensor includes a pixel array having a plurality of layers and a control unit. Each of the plurality of layers including pixels having a photoelectric conversion element and a transmission transistor therein. The photoelectric conversion element is configured to collect charges during an associated charge collection time period and the transmission transistor is configured to transmit the charges to a respective floating diffusion node at an end of the charge collection time period. The control unit configured to individually instruct the transmission transistors associated with different ones of the layers to transmit the charges to the respective floating diffusion nodes such that the charge collection time periods associated with the photoelectric conversion elements implemented in at least two of the layers differs in length.

Abstract: Provided is a packet processing device for an information-centric network. The packet processing device includes a packet transceiver configured to transmit and receive packets, and a packet processing unit configured to process a transmitted or received packet including a forwarding identifier that identifies information present in the ICN and corresponds to an IP address of a network node holding the information, and at least one sub-identifier that identifies child information of the information, in which the forwarding identifier is used to forward packets.

Abstract: A system and method for virtualizing SDN-based network monitoring. The system for includes: an information collector, a monitoring component, an information converter, and a resource allocator, in which a user-defined virtual monitor is included so that integrated monitoring may be performed, and expandability may be guaranteed to dynamically respond to a user's, demands.

Abstract: A lens distortion correction device and an application processor having the same include a distortion correction unit configured to correct a distorted image into an undistorted image and an image enhancement unit configured to improve the undistorted image using a high-frequency component of the distorted image.

Abstract: The present invention relates to a high-efficiency organic photovoltaic cell using surface plasmon effect of an induced dipole polymer-metal nanoparticle hybrid and a method for fabricating the same. More particularly, it relates to a high-efficiency organic photovoltaic cell whose photoelectric efficiency is maximized by depositing an induced dipole polymer-metal nanoparticle hybrid in or on a hole injection layer, thereby enhancing surface plasmonic properties, and a method for fabricating the same.

Abstract: A cover member engagement device and a portable terminal having a battery cover engagement structure using the same are provided, in which a battery mounting portion is formed on a rear surface of a housing of the portable terminal, engagement recesses are formed in both edges of the battery mounting portion, and engagement ribs are formed on a surface of a battery cover, for being engaged in the engagement recesses, wherein at least one first hook protruding from an inner side surface of at least one of the engagement ribs and at least one second hook protruding from an outer side surface of at least one of the engagement ribs are engaged with the housing.