Patents by Inventor Byung-Jun Park

Byung-Jun Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210141294
    Abstract: An apparatus for stabilizing a camera of an autonomous vehicle includes: a sensor that detects vibration generated and applied to the camera due to a state of a road surface when the autonomous vehicle is traveling; a first actuator that attenuates roll vibration applied to the camera; a second actuator that attenuates pitch vibration applied to the camera; and a controller that controls the first actuator and the second actuator to attenuate the vibration detected by the sensor.
    Type: Application
    Filed: July 6, 2020
    Publication date: May 13, 2021
    Applicants: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION
    Inventors: Sang Woo HWANG, Young Dae PARK, Byung Rim LEE, Min Jun KIM, Se Hyun CHANG, Hyeon Seok CHO
  • Publication number: 20210125565
    Abstract: A display device includes first pixels configured to be positioned in a first pixel area and configured to be connected to first scan lines; first scan stage circuits configured to be positioned in a first peripheral area that is positioned outside the first pixel area and configured to supply first scan signals to the first scan lines; second pixels configured to be positioned in a second pixel area and configured to be connected to second scan lines; and second scan stage circuits configured to be positioned in a second peripheral area that is positioned outside the second pixel area and configured to supply second scan signals to the second scan lines. A gap between adjacent second scan stage circuits is larger than a gap between adjacent first scan stage circuits.
    Type: Application
    Filed: January 4, 2021
    Publication date: April 29, 2021
    Inventors: Byung Sun KIM, Sun Ja KWON, Yang Wan KIM, Hyun Ae PARK, Hyung Jun PARK, Su Jin LEE, Jae Yong LEE, Yu Jin JEON
  • Publication number: 20210115236
    Abstract: Disclosed are a polyolefin resin composition and a production method using same. The polyolefin resin satisfies the following conditions: (1) melt index (MI2.16, 190° C., under a load of 2.16 kg) is 0.1 to 1.5 g/10 min; (2) density is 0.91 to 0.93 g/cc; (3) polydispersity Index (Mw (weight-average molecular weight)/Mn (number-average molecular weight)) is 3 to 7; (4) Mz (Z-average molecular weight)/Mw (weight-average molecular weight) is 2.3 to 4.5; and (5) COI (Comonomer Orthogonal Index) value calculated by Equation 1 in the specification is 5 to 12. In Equation 1, “SCB number at Mz” represents average number of branches derived from comonomers per 1000 carbon atoms at Z-average molecular weight (Mz), and “SCB number at Mn” represents average number of branches derived from comonomers per 1000 carbon atoms at number-average molecular weight (Mn) based on a molecular weight-comonomer distribution graph.
    Type: Application
    Filed: April 2, 2019
    Publication date: April 22, 2021
    Inventors: Jang Woo LEE, Byung Keel SOHN, Sah Mun HONG, Da Jung KIM, Hee Jun LEE, Sung Ho CHOI, Su Hyun PARK
  • Patent number: 10943939
    Abstract: A semiconductor device includes a lower device and an upper device disposed on the lower device. The lower device includes a lower substrate, a lower plug pad disposed on the lower substrate, and a lower interlayer dielectric layer on the lower plug pad. The upper device includes an upper substrate, an etch-delay structure in a lower portion of the upper substrate, an upper plug pad disposed on a bottom surface of the upper substrate, an upper interlayer dielectric layer on the upper plug pad, and a via plug configured to penetrate the upper substrate and contact the upper plug pad and the lower plug pad. The via plug includes a first portion in contact with the upper plug pad and the first etch-delay structure, and a second portion in contact with the lower plug pad.
    Type: Grant
    Filed: February 11, 2019
    Date of Patent: March 9, 2021
    Inventors: Byung-Jun Park, Chang-Rok Moon, Seung-Hun Shin, Seong-Ho Oh, Tae-Seok Oh, June-Taeg Lee
  • Patent number: 10753872
    Abstract: A fluorescence lifetime measurement apparatus according to an embodiment of the present invention includes an illumination light generation unit that generates illumination light, a fluorescence photon detection unit that collects fluorescence photons generated by illuminating a sample including fluorescent molecules with the illumination light, a conversion unit that converts the collected fluorescence photons into a first clock signal and converts illumination light that does not pass through the sample into a second clock signal, a first module that analyzes a fluorescence lifetime of the collected fluorescence photons from the conversion unit, a control unit that designates a range of interest (ROI) of the sample from the first module, and a second module that analyzes a fluorescence lifetime of fluorescence photons corresponding to the ROI.
    Type: Grant
    Filed: November 17, 2017
    Date of Patent: August 25, 2020
    Assignees: INTEKPLUS CO., LTD., OSONG MEDICAL INNOVATION FOUNDATION
    Inventors: Sang Yoon Lee, Min Gu Kang, Young Jae Won, Seung Rag Lee, Byung Jun Park, Byung Yeon Kim
  • Publication number: 20200251509
    Abstract: A substrate includes a plurality of pixels arranged in a two-dimensional array structure and has a front side and a back side opposite to the front side. An interconnection is arranged on the front side of the substrate. An insulating layer, a color filter, and a micro-lens are arranged on the back side of the substrate. A pixel separation structure is disposed in the substrate. The pixel separation structure includes a conductive layer having a grid structure in a planar view of the image sensor and surrounds each of the plurality of pixels. A back side contact is vertically overlapped with and electrically connected to a grid point portion of the grid structure of the conductive layer of the pixel separation structure.
    Type: Application
    Filed: April 23, 2020
    Publication date: August 6, 2020
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Han-seok KIM, Byung-jun PARK, Hee-geun JEONG, Seung-joo NAH
  • Publication number: 20200235156
    Abstract: An integrated circuit (IC) device includes a first substrate and a first structure on a front surface of the first substrate. The first structure includes a first interlayer insulating layer structure including a plurality of first conductive pad layers spaced apart from one another at different levels of the first interlayer insulating layer structure. The IC device includes a second substrate on the first substrate and a second structure on a front surface of the second substrate, which faces the front surface of the first substrate. The second structure includes a second interlayer insulating layer structure bonded to the first interlayer insulating layer structure. A through-silicon via (TSV) structure penetrates the second substrate and the second interlayer insulating layer structure. The TSV structure is in contact with at least two first conductive pad layers of the plurality of first conductive pad layers located at different levels.
    Type: Application
    Filed: April 3, 2020
    Publication date: July 23, 2020
    Inventors: Sun-hyun Kim, Sang-il Jung, Byung-jun Park
  • Patent number: 10644053
    Abstract: A substrate includes a plurality of pixels arranged in a two-dimensional array structure and has a front side and a back side opposite to the front side. An interconnection is arranged on the front side of the substrate. An insulating layer, a color filter, and a micro-lens are arranged on the back side of the substrate. A pixel separation structure is disposed in the substrate. The pixel separation structure includes a conductive layer having a grid structure in a planar view of the image sensor and surrounds each of the plurality of pixels. A back side contact is vertically overlapped with and electrically connected to a grid point portion of the grid structure of the conductive layer of the pixel separation structure.
    Type: Grant
    Filed: May 9, 2019
    Date of Patent: May 5, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Han-seok Kim, Byung-jun Park, Hee-geun Jeong, Seung-joo Nah
  • Patent number: 10629643
    Abstract: An integrated circuit (IC) device includes a first substrate and a first structure on a front surface of the first substrate. The first structure includes a first interlayer insulating layer structure including a plurality of first conductive pad layers spaced apart from one another at different levels of the first interlayer insulating layer structure. The IC device includes a second substrate on the first substrate and a second structure on a front surface of the second substrate, which faces the front surface of the first substrate. The second structure includes a second interlayer insulating layer structure bonded to the first interlayer insulating layer structure. A through-silicon via (TSV) structure penetrates the second substrate and the second interlayer insulating layer structure. The TSV structure is in contact with at least two first conductive pad layers of the plurality of first conductive pad layers located at different levels.
    Type: Grant
    Filed: August 3, 2016
    Date of Patent: April 21, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sun-hyun Kim, Sang-il Jung, Byung-jun Park
  • Publication number: 20200113960
    Abstract: Provided herein are compositions for treating a disorder or a disease associated with or characterized by neuro-inflammation, neuro-apoptosis, or neuro-oxidative damage in a subject, pharmaceutical compositions comprising the compositions and pharmaceutically acceptable excipients, and pharmaceutical formulations comprising the compositions. Provided also herein are methods of treating a disorder or a disease associated with or characterized by neuro-inflammation, neuro-apoptosis, or neuro-oxidative damage in a subject, and methods of regulating inflammation, antioxidant enzymes, and apoptosis in a subject having a disorder or a disease associated with or characterized by neuro-inflammation, neuro-apoptosis, or neuro-oxidative damage.
    Type: Application
    Filed: October 15, 2019
    Publication date: April 16, 2020
    Inventor: Byung-Jun Park
  • Publication number: 20190383740
    Abstract: A fluorescence lifetime measurement apparatus according to an embodiment of the present invention includes an illumination light generation unit that generates illumination light, a fluorescence photon detection unit that collects fluorescence photons generated by illuminating a sample including fluorescent molecules with the illumination light, a conversion unit that converts the collected fluorescence photons into a first clock signal and converts illumination light that does not pass through the sample into a second clock signal, a first module that analyzes a fluorescence lifetime of the collected fluorescence photons from the conversion unit, a control unit that designates a range of interest (ROI) of the sample from the first module, and a second module that analyzes a fluorescence lifetime of fluorescence photons corresponding to the ROI.
    Type: Application
    Filed: November 17, 2017
    Publication date: December 19, 2019
    Applicants: INTEKPLUS CO.,LTD., OSONG MEDICAL INNOVATION FOUNDATION
    Inventors: Sang Yoon LEE, Min Gu KANG, Young Jae WON, Seung Rag LEE, Byung Jun PARK, Byung Yeon KIM
  • Publication number: 20190267413
    Abstract: A substrate includes a plurality of pixels arranged in a two-dimensional array structure and has a front side and a back side opposite to the front side. An interconnection is arranged on the front side of the substrate. An insulating layer, a color filter, and a micro-lens are arranged on the back side of the substrate. A pixel separation structure is disposed in the substrate. The pixel separation structure includes a conductive layer having a grid structure in a planar view of the image sensor and surrounds each of the plurality of pixels. A back side contact is vertically overlapped with and electrically connected to a grid point portion of the grid structure of the conductive layer of the pixel separation structure.
    Type: Application
    Filed: May 9, 2019
    Publication date: August 29, 2019
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Han-seok KIM, Byung-jun PARK, Hee-geun JEONG, Seung-joo NAH
  • Publication number: 20190214813
    Abstract: The present invention relates to pressure generation apparatus and method for superconducting power equipment and, more particularly, to pressure generation apparatus and method for superconducting power equipment, wherein a pressure system separately arranged to apply pressure to liquid nitrogen in the superconducting power equipment is disposed inside a pressure vessel.
    Type: Application
    Filed: November 23, 2016
    Publication date: July 11, 2019
    Inventors: Young-Hee HAN, Byung-Jun PARK, Seong-Eun YANG
  • Publication number: 20190189668
    Abstract: A semiconductor device includes a lower device and an upper device disposed on the lower device. The lower device includes a lower substrate, a lower plug pad disposed on the lower substrate, and a lower interlayer dielectric layer on the lower plug pad. The upper device includes an upper substrate, an etch-delay structure in a lower portion of the upper substrate, an upper plug pad disposed on a bottom surface of the upper substrate, an upper interlayer dielectric layer on the upper plug pad, and a via plug configured to penetrate the upper substrate and contact the upper plug pad and the lower plug pad. The via plug includes a first portion in contact with the upper plug pad and the first etch-delay structure, and a second portion in contact with the lower plug pad.
    Type: Application
    Filed: February 11, 2019
    Publication date: June 20, 2019
    Inventors: BYUNG-JUN PARK, CHANG-ROK MOON, SEUNG-HUN SHIN, SEONG-HO OH, TAE-SEOK OH, JUNE-TAEG LEE
  • Patent number: 10304887
    Abstract: A substrate includes a plurality of pixels arranged in a two-dimensional array structure and has a front side and a back side opposite to the front side. An interconnection is arranged on the front side of the substrate. An insulating layer, a color filter, and a micro-lens are arranged on the back side of the substrate. A pixel separation structure is disposed in the substrate. The pixel separation structure includes a conductive layer having a grid structure in a planar view of the image sensor and surrounds each of the plurality of pixels. A back side contact is vertically overlapped with and electrically connected to a grid point portion of the grid structure of the conductive layer of the pixel separation structure.
    Type: Grant
    Filed: January 4, 2018
    Date of Patent: May 28, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Han-seok Kim, Byung-jun Park, Hee-geun Jeong, Seung-joo Nah
  • Patent number: 10229949
    Abstract: A semiconductor device includes a lower device and an upper device disposed on the lower device. The lower device includes a lower substrate, a lower plug pad disposed on the lower substrate, and a lower interlayer dielectric layer on the lower plug pad. The upper device includes an upper substrate, an etch-delay structure in a lower portion of the upper substrate, an upper plug pad disposed on a bottom surface of the upper substrate, an upper interlayer dielectric layer on the upper plug pad, and a via plug configured to penetrate the upper substrate and contact the upper plug pad and the lower plug pad. The via plug includes a first portion in contact with the upper plug pad and the first etch-delay structure, and a second portion in contact with the lower plug pad.
    Type: Grant
    Filed: June 16, 2017
    Date of Patent: March 12, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Byung-Jun Park, Chang-Rok Moon, Seung-Hun Shin, Seong-Ho Oh, Tae-Seok Oh, June-Taeg Lee
  • Publication number: 20180317999
    Abstract: A tissue excising system includes: a tissue ablation device including an ablation unit ablate a body tissue, and an optical signal transmission module; an image generating unit including a light source configured to provide an optical signal to the optical signal transmission module and an optical interferometer configured to receive an optical signal reflected from the body tissue from the optical signal transmission module; and a display unit configured to display an image by receiving an optical image signal from the image generating unit. The optical signal transmission module line-scans the body tissue by penetrating the optical signal from the light source to the body tissue. The optical interferometer generates the optical image signal by applying optical coherence to the optical signal reflected from the body tissue by line-scanning, and the display unit images an inside of the body tissue, using the optical image signal.
    Type: Application
    Filed: March 30, 2016
    Publication date: November 8, 2018
    Applicant: Intekplus Co., Ltd.
    Inventors: Sung-Soo PARK, Young-Jae WON, Seung-Rag LEE, Byung-Jun PARK, Byung-Yeon KIM, Sang-Kyeong PARK, Hyeon-Jin BANG
  • Publication number: 20180286896
    Abstract: A substrate includes a plurality of pixels arranged in a two-dimensional array structure and has a front side and a back side opposite to the front side. An interconnection is arranged on the front side of the substrate. An insulating layer, a color filter, and a micro-lens are arranged on the back side of the substrate. A pixel separation structure is disposed in the substrate. The pixel separation structure includes a conductive layer having a grid structure in a planar view of the image sensor and surrounds each of the plurality of pixels. A back side contact is vertically overlapped with and electrically connected to a grid point portion of the grid structure of the conductive layer of the pixel separation structure.
    Type: Application
    Filed: January 4, 2018
    Publication date: October 4, 2018
    Inventors: Han-seok KIM, Byung-jun PARK, Hee-geun JEONG, Seung-joo NAH
  • Patent number: 10072719
    Abstract: A disk brake having a double self-cooling structure to suppress thermal deformation may include a brake disk having a double cooling structure, which is capable of securing cooling performance of the disk while reducing cost and weight of a vehicle compared with the prior art by configuring a self-cooling structure of the disk that can suppress thermal deformation due to excessive frictional heat during braking a vehicle.
    Type: Grant
    Filed: December 15, 2016
    Date of Patent: September 11, 2018
    Assignees: Hyundai Motor Company, DACCcarbn Co., Ltd.
    Inventors: Jae Hun Shim, Byung Jun Park, Joung Hee Lee, Gab Bae Jeon, Dong Won Im, Yeon Ho Choi, Kang Yoo, Nam Cheol Lee
  • Patent number: 10020437
    Abstract: Disclosed are a superconducting current-limiting element for a current limiter and a method of manufacturing a superconducting current-limiting element for a current limiter, in which the current-limiting element is formed in series by stacking linear superconducting wires, or is formed in parallel by stacking superconducting wires so that one or more superconducting wires are disposed in the same layer, thus facilitating the formation of the current-limiting element in series or in parallel and obviating the use of a winding machine when manufacturing the current-limiting element.
    Type: Grant
    Filed: July 18, 2014
    Date of Patent: July 10, 2018
    Assignee: Korea Electric Power Corporation
    Inventors: Seong-Eun Yang, Hye-Rim Kim, Woo-Seok Kim, Seung-Duck Yu, Hee-Sun Kim, Ji-Young Lee, Byung-Jun Park, Young-Hee Han, Sang-Jin Han