Abstract: An electrical assembly includes (a) a first inductor including a first winding wound around a first winding axis, (b) a second inductor separated from the first inductor in a first direction, and (c) a coupler at least partially disposed between the first inductor and the second inductor in the first direction, the coupler forming at least part of an electrical circuit enabling electric current to flow through the coupler, and the coupler being asymmetric with respect to a dividing axis of the first inductor extending in a second direction that is orthogonal to the first direction.

Abstract: A downhole telemetry well system transmits data at a high rate inside a tubular pipe by encoding signals on a Stoneley wave. Telemetry devices for the Stoneley mode are implemented in short pipe joints inserted at various intervals between the tubulars. Each telemetry device includes Stoneley transducers, which may act as a transmitter, receiver, or repeater. The Stoneley telemetry devices transmit and receive the Stoneley waves making up the carrier of the signal. The Stoneley telemetry devices may be powered by on-board batteries or via some remote power source.

Abstract: A downhole telemetry well system transmits data at a high rate inside a tubular pipe by encoding signals on a Stoneley wave. Telemetry devices for the Stoneley mode are implemented in short pipe joints inserted at various intervals between the tubulars. Each telemetry device includes Stoneley transducers, which may act as a transmitter, receiver, or repeater. The Stoneley telemetry devices transmit and receive the Stoneley waves making up the carrier of the signal. The Stoneley telemetry devices may be powered by on-board batteries or via some remote power source.

Abstract: A circuit board structure including a dielectric layer, a fine circuit pattern and a patterned conductive layer is provided, wherein the fine circuit pattern is embedded in a surface of the dielectric layer, and the patterned conductive layer is disposed on another surface of the dielectric layer and protrudes therefrom.

Abstract: An expandable data center is provided. The expandable data center includes a first movable container, a second movable container coupling with the first movable container, and a plurality of racks disposed within the first movable container and the second movable container. The size of the second movable container is less than that of the first movable container, so that the second movable container can be moved into the first movable container when a vehicle carries the first movable container and the second movable container from a place to another place. A plurality of sensors and/or detectors are disposed within the first movable container and the second movable container, respectively, for sensing and/or detecting one or more environmental parameters in the first and the second movable containers. A method for deploying a data center is also provided.

Abstract: The present invention relates to a power management system comprising at least one power management subsystem. Each power management subsystem comprises a first power module coupled to a first load and comprising at least one first power supply for supplying power to the first load; a second power module coupled to a second load and comprising at least one second power supply, wherein at least one second power supply is retractably installed in the second power module and selectively coupled to the second load; and a pass-through module comprising at least one pass-through unit retractably installed in the second power module to replace with the at least one second power supply and selectively connecting the first power module to the second load for allowing the first power module to supply power to the second load.

Abstract: A circuit board structure comprising a composite layer, a fine circuit pattern and a patterned conductive layer is provided. The fine circuit pattern is inlaid in the composite layer, and the patterned conductive layer is disposed on a surface of the composite layer. After fine circuit grooves are formed on the surface of the composite layer, conductive material is filled into the grooves to form the fine circuit pattern inlaid in the composite layer. Since this fine circuit pattern has relatively fine line width and spacing, the circuit board structure has a higher wiring density.

Abstract: The present invention relates to a power management system comprising at least one power management subsystem. Each power management subsystem comprises a first power module coupled to a first load and comprising at least one first power supply for supplying power to the first load; a second power module coupled to a second load and comprising at least one second power supply, wherein at least one second power supply is retractably installed in the second power module and selectively coupled to the second load; and a pass-through module comprising at least one pass-through unit retractably installed in the second power module to replace with the at least one second power supply and selectively connecting the first power module to the second load for allowing the first power module to supply power to the second load.

Abstract: An electrical interconnecting structure suitable for a circuit board is provided. The electrical interconnecting structure includes a core, an ultra fine pattern, and a patterned conductive layer. The core has a surface, and the ultra fine pattern is inlaid in the surface of the core. The patterned conductive layer is disposed on the surface of the core and is partially connected to the ultra fine pattern. Since the ultra fine pattern of the electrical interconnecting structure is inlaid in the surface of the core and is partially connected to the patterned conductive layer located on the surface of the core.

Abstract: The present invention relates to a power management system comprising at least one power management subsystem. Each power management subsystem comprises a first power module coupled to a first load and comprising at least one first power supply for supplying power to the first load; a second power module coupled to a second load and comprising at least one second power supply, wherein at least one second power supply is retractably installed in the second power module and selectively coupled to the second load; and a pass-through module comprising at least one pass-through unit retractably installed in the second power module to replace with the at least one second power supply and selectively connecting the first power module to the second load for allowing the first power module to supply power to the second load.

Abstract: An interactive program system for a first viewer and a second viewer to share a display is provided. The display can show two different video images or frames at the same time, and with a screen sharing mechanism, only the video program selected by viewers can be seen by the viewers. The screen sharing mechanism is implemented by code-division or frequency-division technology.

Abstract: A process for fabricating a circuit board is provided. In the process, first, a circuit substrate including an insulation layer and at least a pad contacting the insulation layer is provided. Next, a barrier material layer is formed on the circuit substrate. The barrier material layer completely covers the insulation layer and the pad. Then, at least one conductive bump is formed on the barrier material layer. The conductive bump is opposite to the pad, and the material of the barrier material layer is different from the material of the conductive bump. Next, a portion of the barrier material layer is removed by using the conductive bump as a mask, so as to expose the surface of the insulation layer and to form a barrier connected between the conductive bump and the pad.

Abstract: A power converter system supplies power to one or more loads. The power converter system comprises at least one power converter operating at a desired efficiency; and a power storage system coupled to the at least one power converter for receiving power supplied from the at least one power converter and storing power therein when the at least one power converter operates at an efficiency that is below the desired efficiency.

Abstract: An embedded chip package process is disclosed. A first substrate having a first patterned circuit layer is provided. A second substrate having a second patterned circuit layer is provided. A dielectric material layer is formed to cover the first patterned circuit layer. A compression process is performed to cover the second substrate over the dielectric material layer and the second patterned circuit layer is embed into the dielectric material layer. A curing process is performed to cure the dielectric material layer after the step of performing the compression process. At least a conductive plug through the dielectric material layer is formed to electrically connect the first patterned circuit layer to the second patterned circuit layer after the step of performing the curing process. The first substrate, the second substrate and a portion of the at least a conductive plug are removed after the step of forming the conductive through hole.

Abstract: An expandable data center is provided. The expandable data center includes a first movable container, a second movable container coupling with the first movable container, and a plurality of racks disposed within the first movable container and the second movable container. The size of the second movable container is less than that of the first movable container, so that the second movable container can be moved into the first movable container when a vehicle carries the first movable container and the second movable container from a place to another place. A plurality of sensors and/or detectors are disposed within the first movable container and the second movable container, respectively, for sensing and/or detecting one or more environmental parameters in the first and the second movable containers. A method for deploying a data center is also provided.

Abstract: A magnetic flux generating device is provided. The magnetic flux generating device includes: a magnetic flux structure, including: a core and at least one coil wraps around at least part of the core; and a power module, electrically coupled between a power source and the magnetic flux structure, for exciting the magnetic flux structure to generate magnetic flux, the power module including: an energy storage device for storing power outputted from the power source and providing power to the magnetic flux structure. The energy storage device includes at least one super capacitor. A magnetic heat pump based on the magnetic flux generating device is also provided.

Abstract: A control system for an electrical power generation system (EPGS) provides overload protection without disconnecting a generator of the EPGS from an excessive electrical load. Available engine power and current levels of the electrical load are continuously measured. A command voltage is calculated that corresponds to a voltage required to sustain with the maximum available power. Output voltage of a generator of the EPGS is controlled at the calculated command voltage so that a power limit of the engine is not exceeded during electrical overload conditions.

Abstract: An embedded chip package process is disclosed. A first substrate having a first patterned circuit layer is provided. A second substrate having a second patterned circuit layer is provided. A dielectric material layer is formed to cover the first patterned circuit layer. A compression process is performed to cover the second substrate over the dielectric material layer and the second patterned circuit layer is embed into the dielectric material layer. A curing process is performed to cure the dielectric material layer after the step of performing the compression process. At least a conductive plug through the dielectric material layer is formed to electrically connect the first patterned circuit layer to the second patterned circuit layer after the step of performing the curing process. The first substrate, the second substrate and a portion of the at least a conductive plug are removed after the step of forming the conductive through hole.

Abstract: A control system for an electrical power generation system (EPGS) provides overload protection without disconnecting a generator of the EPGS from an excessive electrical load. Available engine power and current levels of the electrical load are continuously measured. A command voltage is calculated that corresponds to a voltage required to sustain with the maximum available power. Output voltage of a generator of the EPGS is controlled at the calculated command voltage so that a power limit of the engine is not exceeded during electrical overload conditions.

Abstract: An embedded chip package process is disclosed. First, a first substrate having a first patterned circuit layer thereon is provided. Then, a first chip is disposed on the first patterned circuit layer and electrically connected to the first patterned circuit layer. A second substrate having a second patterned circuit layer thereon is provided. A second chip is disposed on the second patterned circuit layer and electrically connected to the second patterned circuit layer. Afterwards, a dielectric material layer is formed and covers the first chip and the first patterned circuit layer. Then, a compression process is performed to cover the second substrate over the dielectric material layer so that the second patterned circuit layer and the second chip on the second substrate are embedded into the dielectric material layer.