Abstract: Methods and systems are provided which convey access control information from a first server to a second server through an end user device, for example in a system in which these servers and devices are all connected to the Internet. The method starts after the first server receives a message from the end user device. The first server in response to this message from the end user device sends a response message to the end user device containing the access control information to be conveyed to the second server, optionally after performing authentication. The response message also contains an instruction for the end user device to post a second message to the second server containing the information. The information is preferably contained in a content portion of the message. A hidden form may be used in the response message to contain the information. Optionally, the end user may be presented with an option to post the second message or not.

Abstract: A fabrication process of a conductive column suitable for a fabrication of a circuit board is provided. The circuit board comprises a dielectric layer. A first blind hole is formed in the dielectric layer from a first surface thereof, and a second blind hole is formed in the dielectric layer from a second surface opposite to the first surface, wherein the blind end of the first blind hole connects to the blind end of the second blind hole. The first blind hole and the second blind constitute a through hole and is formed in an hourglass shape such that an inner diameter of the through hole near to the first or the second surface is substantially larger than an inner diameter of the through hole near a middle portion of the through hole. A conductive material is filled in the through hole to form a conductive column.

Abstract: The present invention discloses a color display system. The color display system includes a plurality of light emitting polymer (LEP) optical fibers each formed as plurality of light-emitting segments for emitting a specific color by using a special light emitting polymer. The light emitting segments are arranged as a two-dimensional array with each of the light emitting segments controlled to turn on and off for presenting a color image by turning on a plurality of the light emitting segments. In a preferred embodiment, each of the light emitting segments includes an indium/tin oxide (ITO) layer segment covering the LEP optical fiber wherein each of the ITO segments is connected to an ITO control voltage for turning on and off the light emitting segment.

Abstract: A waterproof and heat-dissipating structure of an electronic apparatus including a circuit board, an input element and an output element is disclosed. The structure includes an aluminum-wrapped housing having at least four adjoining surfaces for defining a space, a first opening end and a second opening end, wherein the space is used for accommodating the circuit board, a first lateral plate fixed to the aluminum-wrapped housing, covering the first opening end and having a first hole for fixing the input element therein, and a second lateral plate fixed to the aluminum-wrapped housing, covering the second opening end and having a second hole for fixing the output element therein.

Abstract: The present invention discloses an acoustic voice cancellation system for generating a non-interference zone. The acoustic system includes an input transducer for receiving an acoustic input signal from a speaker to a signal processor. The acoustic system further includes a subsystem for providing a non-interfering environment The subsystem for providing non-interfering environment generates an acoustic cancellation signal for destructively interfering with the acoustic input signal at a distance away from the speaker. In a preferred embodiment, the subsystem for providing a non-interfering environment further includes an acoustic attenuation means for generating a cancellation acoustic signal for destructively interfering with the acoustic input signal. In another preferred embodiment, the subsystem for providing a non-interfering environment further includes a signal transmission means for transmitting the cancellation acoustic signal to the distance away from the speaker.

Abstract: A waterproof and heat-dissipating structure of an electronic apparatus including a circuit board, an input element and an output element is disclosed. The structure includes an aluminum-wrapped housing having at least four adjoining surfaces for defining a space, a first opening end and a second opening end, wherein the space is used for accommodating the circuit board, a first lateral plate fixed to the aluminum-wrapped housing, covering the first opening end and having a first hole for fixing the input element therein, and a second lateral plate fixed to the aluminum-wrapped housing, covering the second opening end and having a second hole for fixing the output element therein.

Abstract: A method of forming an integrated circuit package with an upward-facing chip cavity such that the fabrication of the substrate and the packaging of silicon chip are combined. By forming a patterned dielectric layer to expose bonding pads on a silicon chip and subsequently connecting the bonding pad on the chip with trace lines on the substrate through electroplating, reliable connections between the chip and substrate are formed and no more bubbles are formed inside the dielectric layer.

Abstract: The present invention discloses an optical energy collecting system for providing optical power to a display system for showing an image. The optical energy collection system includes an optical energy collecting system for collecting optical energy from a background illumination source surrounding and illuminating on the display system whereby an optical energy provided by said optical energy collecting system to said display system for illumination is naturally adjusted according to a background illumination of the background illumination source surrounding the display system.

Abstract: A hole metal-filling method, applied to hole filling and electroplating a printed circuit board which has been mechanical-drilled with holes. A plurality of holes is drilled in a substrate. The substrate is placed on a platform. A plurality of metal balls is disposed on a surface of the substrate. By vibrating the platform, a part of the metal balls roll into the holes, while the metal balls not rolling into the holes are removed. The substrate is then placed on a press down unit. The metal balls in the holes are pressed to level with surfaces of the substrate. The substrate is directly electroplated for forming a plating layer closely dovetail to the metal balls.

Abstract: A method of forming an integrated circuit package with an upward-facing chip cavity such that the fabrication of the substrate and the packaging of silicon chip are combined. By forming a patterned dielectric layer to expose bonding pads on a silicon chip and subsequently connecting the bonding pad on the chip with trace lines on the substrate through electroplating, reliable connections between the chip and substrate are formed and no more bubbles are formed inside the dielectric layer.

Abstract: A hole metal-filling method, applied to hole filling and electroplating a printed circuit board which has been mechanical-drilled with holes. A plurality of holes is drilled in a substrate. The substrate is placed on a platform. A plurality of metal balls is disposed on a surface of the substrate. By vibrating the platform, a part of the metal balls roll into the holes, while the metal balls not rolling into the holes are removed. The substrate is then placed on a press down unit. The metal balls in the holes are pressed to level with surfaces of the substrate. The substrate is directly electroplated for forming a plating layer closely dovetail to the metal balls.

Abstract: A method of forming an integrated circuit package with a downward-facing chip cavity. A substrate comprising an insulating core layer and a conductive layer is provided. A through-hole is formed in the substrate and an adhesive tape is attached to the surface of the conductive layer. A silicon chip is attached to the exposed adhesive tape surface at the bottom of the first opening. The chip has an active surface and a back surface. The chip further includes a plurality of bonding pads on the active surface. The back surface of the chip is attached to the adhesive tape. A patterned dielectric layer is formed filling the first opening and covering a portion of the adhesive tape, the active surface, the bonding pad and the insulating core layer. The patterned dielectric layer has a plurality of openings that exposes the bonding pads and some through holes. A metallic layer is formed over the exposed surface of the openings and the upper surface of the patterned dielectric layer by electroplating.

Abstract: A method of fabricating a multi-chip module (MCM) package that can fabricate the substrate and the package simultaneously. The bonding pads of a chip are exposed by forming a patterned dielectric layer, and the bonding pads of the chip are electrically connected to the substrate by utilizing to an electroplating to form a metal layer. The present invention provides a fabircating method that can prevent air bubble produced in the patterned dielectric layer and improve the connection ability between the chip and the substrate.

Abstract: The present invention discloses a personal computer that has circuit elements enclosed in a light transmissible case. The personal computer further includes a visible light enclosed in the light-transmissible case for providing indication of various functional statuses of the personal computer through the light transmissible case. In a preferred embodiment, the personal computer further includes a light controller for controlling the visible light for providing a plurality of visible light signals for indicating various functional statuses of the personal computer. In another preferred embodiment, the light controller further includes a light intensity controller for controlling an intensity of the visible light for indicating various functional statuses of the personal computer. In another preferred embodiment, the light controller further includes a light flash-pattern controller for controlling a flash-pattern of the visible light for indicating various functional statuses of the personal computer.

Abstract: This invention discloses a portable electronic device. The portable electronic device has an image source. The portable electronic device further includes a virtual image display system for display a virtual image. The virtual image display system further includes a real image means for generating a real image for the image source. The virtual image display system further includes a virtual image means for generating a magnified virtual image of the real image.

Abstract: The present invention discloses power supply cable for providing DC power from a power supply to a microprocessor of a personal computer. The output cable includes a plate-cable includes a first and a second metal plates insulated with an insulation layer between the first and second metal plates. The output cable further includes a plurality of capacitors disposed on the plate cable. Each of the capacitors has a first and second electrical terminals and each of the first and second electrical terminals connected to one of the first and second metal layers provided for storing electrical charges therein for transmitting through the metal layers for supplying power to the microprocessor. In a preferred embodiment, the plurality of capacitors disposed on the first metal plate with the first electrical terminal for each of the capacitors connected to the first metal plate.

Abstract: The present invention discloses a color display system. The color display system includes a plurality of light emitting polymer (LEP) optical fibers each formed as plurality of light-emitting segments for emitting a specific color by using a special light emitting polymer. The light emitting segments are arranged as a two-dimensional array with each of the light emitting segments controlled to turn on and off for presenting a color image by turning on a plurality of the light emitting segments. In a preferred embodiment, each of the light emitting segments includes an indium/tin oxide (ITO) layer segment covering the LEP optical fiber wherein each of the ITO segments is connected to an ITO control voltage for turning on and off the light emitting segment.

Abstract: A mechanical-laser structure on a printed circuit board and a carrier. A method for fabricating the mechanical-laser structure includes the following steps. A substrate is provided. A first through hole is formed in the substrate by mechanical drilling. An epoxy plug is formed within the first through hole. A conductive layer is formed on the substrate by compression. The conductive layer is patterned to form conducting wires and exposes the epoxy plug. A micro via is formed within the epoxy plug by laser drilling.

Abstract: The present invention discloses a direct-current (DC) electric connector that includes plurality of conductive and insulation layers constituting a near-zero inductance connector. The connector further includes a top and a bottom insulation-and-protection covers covering and protecting the plurality of conductive and insulation layers. The top and bottom insulation-and-protection covers having a tapered outer surface for providing a tapered profile along a horizontal direction toward a connector opening for receiving a printed circuit board into the near-zero inductance connector. The connector further includes a locking cartridge for adaptively enclosing the near-zero inductance connector with the printed circuit board inserted therein. The locking cartridge has top and bottom surfaces each engages the top and bottom insulation-and-protection covers respectively for horizontally pushing toward a direction having a gradually increased profile height for generating a vertical pressing force.