Patents by Inventor C. Lin

C. Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • EXPERIENCE GRAPH
    Publication number: 20150134664
    Abstract: Method and system for organizing and sharing content through experience are described. In one embodiment, content may be organized and shared among users through a specific experience. A method for sharing content in a network may include: collecting contents related to a specific experience from a specific user; generating an experience graph of the specific experience; enabling the specific user to invite other users to join the experience graph; and enabling each user inside the experience graph to share new content into the experience graph.
    Type: Application
    Filed: September 12, 2014
    Publication date: May 14, 2015
    Inventors: Andrew C. Lin, Eric I. Feng, Eugene C. Wei
  • ALUMINUM ALLOYS, ALUMINUM ALLOY PRODUCTS AND METHODS FOR MAKING THE SAME
    Publication number: 20150122660
    Abstract: Decorative shape cast products and methods, systems, compositions and apparatus for producing the same are described. In one embodiment, the decorative shape cast products are produced from an Al—Ni or Al—Ni—Mn alloy, with a tailored microstructure to facilitate production of anodized decorative shape cast product having the appropriate finish and mechanical properties.
    Type: Application
    Filed: January 8, 2015
    Publication date: May 7, 2015
    Inventors: Jen C. Lin, James R. Fields, Albert L. Askin, Xinyan Yan, Ralph R. Sawtell, Shawn Patrick Sullivan, Janell Lyn Abbott
  • SEMICONDUCTOR DEVICE WITH FACE-TO-FACE CHIPS ON INTERPOSER AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20150118794
    Abstract: A method of making a semiconductor device with face-to-face chips on interposer includes the step of attaching a chip-on-interposer subassembly on a heat spreader with the chip inserted into a cavity of the heat spreader so that the heat spreader provides mechanical support for the interposer. The heat spreader also provides thermal dissipation, electromagnetic shielding and moisture barrier for the enclosed chip. In the method, a second chip is also electrically coupled to a second surface of the interposer and an optional second heat spreader is attached to the second chip.
    Type: Application
    Filed: October 26, 2014
    Publication date: April 30, 2015
    Inventors: Charles W. C. Lin, Chia-Chung Wang
  • LOW RESISTANCE BITLINE AND SOURCELINE APPARATUS FOR IMPROVING READ AND WRITE OPERATIONS OF A NONVOLATILE MEMORY
    Publication number: 20150117095
    Abstract: Described is an apparatus for improving read and write margins. The apparatus comprises: a sourceline; a first bitline; a column of resistive memory cells, each resistive memory cell of the column coupled at one end to the sourceline and coupled to the first bitline at another end; and a second bitline in parallel to the first bitline, the second bitline to decouple read and write operations on the bitline for the resistive memory cell. Described is also an apparatus which comprises: a sourceline; a bitline; a column of resistive memory cells, each resistive memory cell in the column coupled at one end to the sourceline and coupled to the bitline at another end; and sourceline write drivers coupled to the bitline and the sourceline, wherein the sourceline write drivers are distributed along the column of resistive memory cells.
    Type: Application
    Filed: October 31, 2013
    Publication date: April 30, 2015
    Inventors: Cyrille Dray, Blake C. Lin, Fatih Hamzaoglu, Liqiong Wei, Yih Wang
  • Semiconductor chip assembly with post/base heat spreader and dual adhesives
    Patent number: 9018667
    Abstract: A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and first and second adhesives. The semiconductor device is electrically connected to the conductive trace and thermally connected to the heat spreader. The heat spreader includes a post and a base. The post extends upwardly from the base through an opening in the first adhesive, and the base extends laterally from the post. The first adhesive extends between the base and the conductive trace and the second adhesive extends between the post and the conductive trace. The conductive trace provides signal routing between a pad and a terminal.
    Type: Grant
    Filed: April 12, 2010
    Date of Patent: April 28, 2015
    Assignee: Bridge Semiconductor Corporation
    Inventors: Charles W. C. Lin, Chia-Chung Wang, Sangwhoo Lim
  • METHOD OF TREATING CONSTIPATION-PREDOMINANT IRRITABLE BOWEL SYNDROME
    Publication number: 20150099713
    Abstract: Disclosed is a method of manipulating the rate of gastrointestinal transit in a mammalian subject. Also disclosed is the use, in the manufactiurc of a medicament for the treatment of constipation, of a selective inhibitor of methanogensis, a methanogen-displacing probiotic agent, or a prebiotic agent that inhibits the growth of methanogenic bacteria or promotes the growth of competing non-methanogenic intestinal flora. Alternatively, in accordance with the invention, is disclosed the use in the manufacture of a medicament for the treatment of diarrhea, of methane or a methane precursor, a methanogenic or other methane-enhancing probiotic agent, or a methanogenesis-enhancing prebiotic agent.
    Type: Application
    Filed: December 9, 2014
    Publication date: April 9, 2015
    Applicant: CEDARS-SINAI MEDICAL CENTER
    Inventors: Mark Pimentel, Henry C. Lin
  • 6xxx aluminum alloys, and methods for producing the same
    Patent number: 8999079
    Abstract: New 6xxx aluminum alloy bodies and methods of producing the same are disclosed. The new 6xxx aluminum alloy bodies may be produced by preparing the aluminum alloy body for post-solutionizing cold work, cold working by at least 25%, and then thermally treating. The new 6xxx aluminum alloy bodies may realize improved strength and other properties.
    Type: Grant
    Filed: August 17, 2012
    Date of Patent: April 7, 2015
    Assignee: Alcoa, Inc.
    Inventors: Rajeev G. Kamat, John M. Newman, Ralph R. Sawtell, Jen C. Lin
  • Earth-boring tools having cutting elements with cutting faces exhibiting multiple coefficients of friction, and related methods
    Patent number: 8991525
    Abstract: An earth-boring tool having at least one cutting element with a multi-friction cutting face provides for the steering of formation cuttings as the cuttings slide across the cutting face. The multi-friction cutting element includes a diamond table bonded to a substrate of superabrasive material. The diamond table has a cutting face formed thereon with a cutting edge extending along a periphery of the cutting face. The cutting face has a first area having an average surface finish roughness less than an average surface finish roughness of a second area of the cutting face, the two areas separated by a boundary having a proximal end proximate a tool crown and a distal end remote from the tool crown.
    Type: Grant
    Filed: May 1, 2012
    Date of Patent: March 31, 2015
    Assignee: Baker Hughes Incorporated
    Inventors: Juan Miguel Bilen, Anthony A. DiGiovanni, Chih C. Lin, Suresh G. Patel, Rudolf Carl Pessier, Danny E. Scott, Michael L. Doster
  • FUSION WELDABLE FILLER ALLOYS
    Publication number: 20150072170
    Abstract: Al—Mg and Al—Mg—Zn weld filler alloy compositions for use with fusion weldable 7xxx, 6xxx, 5xxx and 2xxx series aluminum alloy base metals are disclosed. The weld filler alloys may be used for joining a first aluminum base metal segment to a second aluminum base metal segment, where the base metal segments is at least one of 7xxx, 6xxx, 5xxx and 2xxx series aluminum alloy. The weld filler alloys, in wire or rod form, may also be used to repair a defective weld.
    Type: Application
    Filed: November 18, 2014
    Publication date: March 12, 2015
    Inventors: Jen C. Lin, Israel Stol, Kyle L. Williams
  • SEALED AND UN-MATED ELECTRICAL CONNECTION SYSTEM USING SINGLE INSERTION PRESS FIT PINS
    Publication number: 20150064962
    Abstract: A method of creating a sealed, un-mated electrical connector system using single insertion press-fit pins. Using single insertion press-fit pins allows for use of simple plastic parts for the connector shroud and a true position assurance comb in conjunction with single insertion press-fit pins. The result is a lower cost for the final connector assembly. Less plastic is needed for the combined shroud and true position assurance comb, because the true position assurance is provided in part by the shroud, and in part by the position assurance comb.
    Type: Application
    Filed: August 8, 2014
    Publication date: March 5, 2015
    Inventors: James D. Baer, Benjamin C. Lin, Timothy J. Trento
  • Composite metallic elastomeric sealing components for roller cone drill bits
    Patent number: 8967301
    Abstract: An earth boring bit has a bit body with a depending bearing pin, a cone rotatably mounted on the bearing pin, a seal gland between the cone and the bearing pin, and a seal assembly located in the seal gland. The seal assembly includes an annular metallic spring encircling the bearing pin. The spring has a geometric center line that extends in a circle around the bearing pin. The spring is elastically deformable in radial directions relative to the center line. An elastomeric layer is located on an exterior side of the spring and is biased by the spring against a surface of the seal gland.
    Type: Grant
    Filed: February 3, 2010
    Date of Patent: March 3, 2015
    Assignee: Baker Hughes Incorporated
    Inventors: David A. Curry, Terry J. Koltermann, Chih C. Lin, Stuart Hall
  • COST EFFECTIVE MULTIBAND RF FRONT-END ARCHITECTURE FOR MOBILE APPLICATIONS
    Publication number: 20150056941
    Abstract: One embodiment of the present invention provides an RF front-end system. The RF front-end system includes one or more RF front-end components and a programmable logic device, which has a baseband interface for coupling to a baseband digital signal processor (DSP), and a set of component interfaces for coupling to the one ore more RF front-end components. The programmable logic device is configured to: receive, from the baseband DSP via the baseband interface, a command which includes an address and a control signal; identify a component interface from the set of component interfaces based on the address; and send the control signal to the identified component interface, thereby enabling the baseband DSP to control a front-end component coupled to the programmable logic device via the identified component interface.
    Type: Application
    Filed: August 20, 2013
    Publication date: February 26, 2015
    Applicant: Aviacomm Inc.
    Inventors: Shao C. Lin, Shih Hsiung Mo
  • SIMPLE AND FLEXIBLE INTERFACE ARCHITECTURE FOR CONTROLLING RF FRONT-END COMPONENTS
    Publication number: 20150055720
    Abstract: One embodiment of the present invention provides a system for controlling at least one RF front-end component. During operation, the system receives, at a programmable logic chip from a baseband chip, a command; identifies the RF front-end component based on an address indicated by the command; and sends a control signal included in the command to the identified RF front-end component via the second interface. The programmable logic chip is coupled to the baseband chip via a first interface, and is coupled to the at least one RF front-end component via a second interface.
    Type: Application
    Filed: August 21, 2013
    Publication date: February 26, 2015
    Applicant: Aviacomm Inc.
    Inventors: Shao C. Lin, Chung-Hsing Chang, Shih Hsiung Mo
  • Aluminum alloy products having improved property combinations and method for artificially aging same
    Patent number: 8961715
    Abstract: Aluminum alloy products about 4 inches thick or less that possesses the ability to achieve, when solution heat treated, quenched, and artificially aged, and in parts made from the products, an improved combination of strength, fracture toughness and corrosion resistance, the alloy consisting essentially of: about 6.8 to about 8.5 wt. % Zn, about 1.5 to about 2.00 wt. % Mg, about 1.75 to about 2.3 wt. % Cu; about 0.05 to about 0.3 wt. % Zr, less than about 0.1 wt. % Mn, less than about 0.05 wt. % Cr, the balance Al, incidental elements and impurities and a method for making same. The instantly disclosed alloys are useful in making structural members for commercial airplanes including, but not limited to, upper wing skins and stringers, spar caps, spar webs and ribs of either built-up or integral construction.
    Type: Grant
    Filed: April 17, 2014
    Date of Patent: February 24, 2015
    Assignee: Alcoa Inc.
    Inventors: Gary H. Bray, Dhruba J. Chakrabarti, Diana K. Denzer, Jen C. Lin, John Newman, Gregory B. Venema, Cagatay Yanar, Julien Boselli
  • Stackable semiconductor assembly with bump/flange heat spreader and dual build-up circuitry
    Patent number: 8952526
    Abstract: A stackable semiconductor assembly includes a semiconductor device, a heat spreader, an adhesive, a plated through-hole, first build-up circuitry and second build-up circuitry. The heat spreader includes a bump and a flange. The bump defines a cavity. The semiconductor device is mounted on the bump at the cavity, electrically connected to the first build-up circuitry and thermally connected to the bump. The bump extends into an opening in the adhesive and the flange extends laterally from the bump at the cavity entrance. The first build-up circuitry and the second build-up circuitry extend beyond the semiconductor device in opposite vertical directions. The plated through-hole extends through the adhesive and provides signal routing between the first build-up circuitry and the second build-up circuitry. The heat spreader provides heat dissipation for the semiconductor device.
    Type: Grant
    Filed: November 2, 2011
    Date of Patent: February 10, 2015
    Assignee: Bridge Semiconductor Corporation
    Inventors: Charles W. C. Lin, Chia-Chung Wang
  • Aluminum alloys, aluminum alloy products and methods for making the same
    Patent number: 8950465
    Abstract: Decorative shape cast products and methods, systems, compositions and apparatus for producing the same are described. In one embodiment, the decorative shape cast products are produced from an Al—Ni or Al—Ni—Mn alloy, with a tailored microstructure to facilitate production of anodized decorative shape cast product having the appropriate finish and mechanical properties.
    Type: Grant
    Filed: December 3, 2012
    Date of Patent: February 10, 2015
    Assignee: Alcoa Inc.
    Inventors: Jen C. Lin, James R. Fields, Albert L. Askin, Xinyan Yan, Ralph R. Sawtell, Shawn Patrick Sullivan, Janell Lyn Abbott
  • 7XXX ALUMINUM ALLOYS, AND METHODS FOR PRODUCING THE SAME
    Publication number: 20150020930
    Abstract: New 7xxx aluminum alloy bodies and methods of producing the same are disclosed. The new 7xxx aluminum alloy bodies may be produced by preparing the aluminum alloy body for post-solutionizing cold work, cold working by at least 25%, and then thermally treating. The new 7xxx aluminum alloy bodies may realize improved strength and other properties.
    Type: Application
    Filed: September 3, 2014
    Publication date: January 22, 2015
    Inventors: Rajeev G. Kamat, John M. Newman, Ralph R. Sawtell, Jen C. Lin
  • Method of making thermally enhanced semiconductor assembly with bump/base/flange heat spreader and build-up circuitry
    Patent number: 8927339
    Abstract: A method of making a semiconductor assembly that includes a semiconductor device, a heat spreader, an adhesive and a build-up circuitry is disclosed. The heat spreader includes a bump, a base and a flange. The bump defines a cavity. The semiconductor device is mounted on the bump at the cavity, electrically connected to the build-up circuitry and thermally connected to the bump. The bump extends from the base into an opening in the adhesive, the base extends vertically from the bump opposite the cavity and the flange extends laterally from the bump at the cavity entrance. The build-up circuitry includes a dielectric layer and conductive traces on the semiconductor device and the flange. The conductive traces provide signal routing for the semiconductor device.
    Type: Grant
    Filed: November 18, 2011
    Date of Patent: January 6, 2015
    Assignee: Bridge Semiconductor Corporation
    Inventors: Charles W. C. Lin, Chia-Chung Wang
  • 2XXX SERIES ALUMINUM LITHIUM ALLOYS HAVING LOW STRENGTH DIFFERENTIAL
    Publication number: 20150000799
    Abstract: The present application discloses wrought 2xxx Al—Li alloy products that are work insensitive. The wrought aluminum alloy products generally include from about 2.75 wt. % to about 5.0 wt. % Cu, from about 0.2 wt. % to about 0.8 wt. % Mg, where the ratio of copper-to-magnesium ratio (Cu/Mg) in the aluminum alloy is in the range of from about 6.1 to about 17, from about 0.1 wt. % to 1.10 wt. % Li, from about 0.3 wt. % to about 2.0 wt. % Ag, from 0.50 wt. % to about 1.5 wt. % Zn, up to about 1.0 wt. % Mn, the balance being aluminum, optional incidental elements, and impurities. The wrought aluminum alloy products may realize a low strength differential and in a short aging time due to their work insensitive nature.
    Type: Application
    Filed: September 15, 2014
    Publication date: January 1, 2015
    Inventors: Cagatay Yanar, Roberto J. Rioja, Jen C. Lin, Ralph R. Sawtell
  • NITROGEN- AND CERAMIC-SURFACE-TREATED COMPONENTS FOR DOWNHOLE MOTORS AND RELATED METHODS
    Publication number: 20140377112
    Abstract: Downhole motors include a stator, which may be formed from a steel material and comprise a bore. At least one surface of the stator may be treated with a surface treatment. The surface treatment includes a nitrided region comprising nitrogen diffused into the steel material and a ceramic material adjacent to the nitrided region; the ceramic material defining an interior surface of the stator defining the bore. Methods of making downhole motors may include exposing a stator to an elevated temperature to heat the stator in a nitrogen-rich environment. Nitrogen may be diffused into a steel material of the stator and a nitrided region may be formed at one or more surfaces of the stator. The stator may be cooled. The stator may be removed from the nitrogen-rich environment. A ceramic material may be coated on the nitrided region of the stator.
    Type: Application
    Filed: June 25, 2013
    Publication date: December 25, 2014
    Inventors: Kyle L. Taylor, Chih C. Lin, Denis S. Kopecki