Abstract: Disclosed is a method of treating small intestinal bacterial overgrowth (SIBO) or a SIBO-caused condition in a human subject. SIBO-caused conditions include irritable bowel syndrome, fibromyalgia, chronic pelvic pain syndrome, chronic fatigue syndrome, depression, impaired mentation, impaired memory, halitosis, tinnitus, sugar craving, autism, attention deficit/hyperactivity disorder, drug sensitivity, an autoimmune disease, and Crohn's disease. Also disclosed are a method of screening for the abnormally likely presence of SIBO in a human subject and a method of detecting SIBO in a human subject. A method of determining the relative severity of SIBO or a SIBO-caused condition in a human subject, in whom small intestinal bacterial overgrowth (SIBO) has been detected, is also disclosed.

Abstract: Described herein are powder coated films comprising a polymer matrix designed for use in a toothpaste to indicate a color change during brushing, dentifrice compositions comprising the films, and methods of making and using the same.

Abstract: A method of making a semiconductor device with face-to-face chips on interposer includes the step of attaching a chip-on-interposer subassembly on a heat spreader with the chip inserted into a cavity of the heat spreader so that the heat spreader provides mechanical support for the interposer. The heat spreader also provides thermal dissipation, electromagnetic shielding and moisture barrier for the enclosed chip. In the method, a second chip is also electrically coupled to a second surface of the interposer and an optional second heat spreader is attached to the second chip.

Abstract: The present invention relates to an interconnect substrate with an embedded device, a built-in stopper and dual build-up circuitries and a method of making the same. In accordance with one preferred embodiment of the present invention, the method includes: forming a stopper on a dielectric layer; mounting a semiconductor device on the dielectric layer using the stopper as a placement guide for the semiconductor device; attaching a stiffener to the dielectric layer; forming a first build-up circuitry and a second build-up circuitry that cover the semiconductor device, the stopper and the stiffener at both sides; and providing a plated through-hole that provides an electrical connection between the first and second build-up circuitries. Accordingly, the stopper can accurately confine the placement location of the semiconductor device and avoid the electrical connection failure between the semiconductor device and the build-up circuitry.

Abstract: A method of making a wiring board having a low CTE isolator incorporated in a resin core is characterized by the provision of an adhesive substantially coplanar with the metallized isolator and the metal layers on two opposite sides of the resin core at smoothed lapped top and bottom surfaces so that a metal bridge can be deposited on the adhesive at the smoothed lapped bottom surface and connect the metallized isolator with a surrounding heat spreader on the bottom surface of the resin core. In the method, routing circuitries are also deposited on the adhesive at the smoothed lapped top surface so as to provide electrical connections between contact pads on the isolator and terminal pads on the resin core.

Abstract: The present invention provides an Al—Zn—Mg—Cu casting alloy that provides high strength for automotive and aerospace applications and optimized stress corrosion cracking resistance in highly corrosive and tensile environments. The inventive alloy composition includes about 3.5 wt. % to about 5.5 wt. % Zn; about 1.0 wt. % to about 3.0 wt. % Mg; about 0.5 wt. % to about 1.2 wt. % Cu; less than about 1.0 wt. % Si; less than about 0.30 wt. % Mn; less than about 0.30 wt. % Fe; and a balance of Al and incidental impurities.

Abstract: Embodiments of this disclosure include systems, methods, and kits for sterilizing in vivo catheters using an optical fiber to deliver UV light. In an embodiment, a method for sterilizing a catheter with at least a first lumen, includes inserting a distal end of a fiber optic cable into a fiber insertion port of a catheter connector attached to a hub of the first lumen, flushing the first lumen with fluid from a fluid source, inserting the fiber optic cable into the first lumen until a stopper of the fiber optic cable is adjacent to the fiber insertion port, providing light to the fiber optic cable from a light source after the fiber optic cable is inserted into the first lumen, withdrawing the fiber optic cable from the first lumen while the light is provided, and ceasing to provide light to the fiber optic cable after the fiber optic cable is withdrawn from the first lumen. The disclosure is also applicable to catheters with multiple lumens and to catheters accessed through subcutaneous ports.

Abstract: A method of making a semiconductor device is characterized by the step of attaching a chip-on-interposer subassembly to a heat spreader with the chip inserted into a cavity of the heat spreader and the interposer laterally extending beyond the cavity. The interposer backside process is executed after the chip-on-interposer attachment and encapsulation to form the finished interposer. The heat spreader provides thermal dissipation, and the finished interposer provides primary fan-out routing for the chip. In the method, a buildup circuitry is electrically coupled to the interposer to provide further fan-out routing.

Abstract: Downhole motors include a stator, which may be formed from a steel material and comprise a bore. At least one surface of the stator may be treated with a surface treatment. The surface treatment includes a nitrided region comprising nitrogen diffused into the steel material and a ceramic material adjacent to the nitrided region; the ceramic material defining an interior surface of the stator defining the bore. Methods of making downhole motors may include exposing a stator to an elevated temperature to heat the stator in a nitrogen-rich environment. Nitrogen may be diffused into a steel material of the stator and a nitrided region may be formed at one or more surfaces of the stator. The stator may be cooled. The stator may be removed from the nitrogen-rich environment. A ceramic material may be coated on the nitrided region of the stator.

Abstract: Technology is disclosed for placement of single-bit flip-flops and multi-bit flip-flops. Single-bit flip-flops with replaced with multi-bit flip-flops and/or relative placement groups of single-bit flip-flops.

Abstract: The present invention relates to a thermally enhanced interconnect substrate and a method of making the same. In accordance with one preferred embodiment, the method includes: forming a stopper on a metal layer of a laminate substrate; removing a selected portion of the metal layer to form a paddle layer; mounting a semiconductor device on the paddle layer using the stopper as a placement guide for the semiconductor device; attaching a stiffener to the laminate substrate; forming first and second build-up circuitries that cover the semiconductor device, the paddle layer and the stiffener at both sides; and providing a plated through-hole that provides an electrical connection between the first and second build-up circuitries. Accordingly, the paddle layer can provide excellent heat spreading, and the stopper can accurately confine the placement location of the semiconductor device and avoid the electrical connection failure between the semiconductor device and the build-up circuitry.

Abstract: An earth-boring tool having at least one cutting element with a multi-friction cutting face provides for the steering of formation cuttings as the cuttings slide across the cutting face. The multi-friction cutting element includes a diamond table bonded to a substrate of superabrasive material. The diamond table has a cutting face formed thereon with a cutting edge extending along a periphery of the cutting face. The cutting face has a first area having an average surface finish roughness less than an average surface finish roughness of a second area of the cutting face, the two areas separated by a boundary having a proximal end proximate a tool crown and a distal end remote from the tool crown.

Abstract: Disclosed is a method of manipulating the rate of gastrointestinal transit in a mammalian subject. Also disclosed is the use, in the manufacture of a medicament for the treatment of constipation, of a selective inhibitor of methanogensis, a methanogen-displacing probiotic agent, or a prebiotic agent that inhibits the growth of methanogenic bacteria or promotes the growth of competing non-methanogenic intestinal flora. Alternatively, in accordance with the invention, is disclosed the use in the manufacture of a medicament for the treatment of diarrhea, of methane or a methane precursor, a methanogenic or other methane-enhancing probiotic agent, or a methanogenesis-enhancing prebiotic agent.

Abstract: Provided are improved self-ligating appliances and methods that use a flexible “U”-shaped spring clip slidably engaged to the appliance body and have a cavity located on an outwardly-facing side of the appliance that includes a concave side surface that interrupts a side wall of the slot. The cavity is collectively defined by the body and one leg of the “U”-shaped clip when the clip is in its closed position and has a size sufficient to accommodate the tip of a hand instrument. By providing tactile feedback to the practitioner along surfaces of both the clip and appliance body, the appliance mechanism can be conveniently operated without a line of sight with the cavity.

Abstract: In a preferred embodiment, a wiring board with embedded device and electromagnetic shielding includes a semiconductor device, a core layer, a shielding lid, shielding slots and build-up circuitry. The build-up circuitry covers the semiconductor device and the core layer. The shielding slots and the shielding lid are electrically connected to at least one ground contact pad of the semiconductor device by the build-up circuitry and can respectively serve as effective horizontal and vertical electromagnetic shields for the semiconductor devices.

Abstract: A quick-drying print and environmental-friendly biaxially orientated polypropylene synthetic paper is produced from a polypropylene resin composition comprising a high crystalline polypropylene resin, calcium carbonate composite particles, titanium dioxide composite particles, antistatic agents, UV absorbers and anti-blocking agent, which are fed into one twin-screw primary extruder and two twin-screw secondary extruders respectively, convergently flowed through the same T-die, co-extruded into a three-layer structure substrate film, after cooling and setting, this film is first longitudinally orientated, then laterally orientated; thereafter the three-layer film is high-frequency corona treated and winded up to gain the film having thickness less than 250 ?m.

Abstract: A method of making a semiconductor package with package-on-package stacking capability is characterized by the step of attaching a chip-on-interposer subassembly on a base carrier with the chip inserted into a through opening of the base carrier and the interposer laterally extending beyond the through opening. The interposer provides primary fan-out routing for the chip whereas dual buildup circuitries formed on both opposite sides of the base carrier provides further fan-out routing and are electrically connected to each other by plated through holes to provide the package with stacking capacity.

Abstract: An earth boring bit has a bit body with a depending bearing pin, a eons rotatably mounted on the hearing pin, a seal gland between the cone and the bearing pin, and a seal assembly located in the seal gland. The seal assembly includes an annular metallic spring encircling the bearing pin. The spring has a geometric center line that extends in a circle around the bearing pin. The spring is elastically deform able in radial directions relative to the center line. An elastomeric layer is located on an exterior side of the spring and is biased by the spring against a surface of the seal gland.

Abstract: A method of making a semiconductor assembly is characterized by the step of attaching a chip-on-interposer subassembly on a base carrier with the chip inserted into a through opening of the base carrier and the interposer laterally extending beyond the through opening. The base carrier provides a platform for the chip-on-interposer subassembly attachment, whereas the interposer provides primary fan-out routing for the chip. In the method, a buildup circuitry is electrically coupled to the interposer and an optional cover sheet or additional buildup circuitry can be provided on the chip.

Abstract: The present invention relates to a method of making a semiconductor package with package-on-package stacking capability. In accordance with a preferred embodiment, the method is characterized by the step of attaching a chip-on-interposer subassembly on a metallic carrier with the chip inserted into a cavity of the metallic carrier, and the step of selectively removing portions of the metallic carrier to define a heat spreader for the chip. The heat spreader can provide thermal dissipation, electromagnetic shielding and moisture barrier, whereas the interposer provides a CTE-matched interface and fan-out routing for the chip.