Abstract: Described is an apparatus for improving read and write margins. The apparatus comprises: a sourceline; a first bitline; a column of resistive memory cells, each resistive memory cell of the column coupled at one end to the sourceline and coupled to the first bitline at another end; and a second bitline in parallel to the first bitline, the second bitline to decouple read and write operations on the bitline for the resistive memory cell. Described is also an apparatus which comprises: a sourceline; a bitline; a column of resistive memory cells, each resistive memory cell in the column coupled at one end to the sourceline and coupled to the bitline at another end; and sourceline write drivers coupled to the bitline and the sourceline, wherein the sourceline write drivers are distributed along the column of resistive memory cells.

Abstract: New aluminum casting alloys having 8.5-9.5 wt. % silicon, 0.8-2.0 wt. % copper (Cu), 0.20-0.53 wt. % magnesium (Mg), and 0.35 to 0.8 wt. % manganese are disclosed. The alloy may be solution heat treated, treated in accordance with T5 tempering and/or artificially aged to produce castings, e.g., for cylinder heads and engine blocks. In one embodiment, the castings are made by high pressure die casting.

Abstract: A source system receives, from at least one of the user associated with an entity or the human operator associated with the source system, an indication to suppress all listings associated with the entity on one or more provider systems, wherein the indication comprises identification data of the entity and an indication that the identification data of the entity is no longer valid. The source system retrieves, from a database associated with the source system, a list of one or more provider systems associated with the source system and having at least one listing corresponding to the entity. For each provider system in the list of one or more provider systems: the source system searches the provider system for listings having identification data matching the identification data of the entity.

Abstract: A pressure sensor device with a MEMS piezoresistive pressure sensing element attached to an in-circuit ceramic board comprises a monolithic ceramic circuit board formed by firing multiple layers of ceramic together. The bottom side of the circuit board has a cavity, which extends through layers of material from the ceramic circuit board is formed. A ceramic diaphragm, which is one of the layers, has a peripheral edge. The diaphragm's thickness enables the diaphragm bounded by the edge to deflect responsive to applied pressure. A MEMS piezoresistive pressure sensing element attached to the top side of the ceramic circuit board generates an output signal responsive to deflection of the ceramic diaphragm. A conduit carrying a pressurized fluid (liquid or gas) can be attached directly to the ceramic circuit board using a seal on the bottom of the ceramic circuit board, which surrounds the opening of the cavity through the bottom.

Abstract: A technique is disclosed for automatic switching of a mobile device between a videoconference operating mode and a teleconference operating mode, where the automatic switching is based on a detected functional use and current position of the device in relation to a user of the device. In at least some embodiments, the disclosed technology includes a video-audio switching system that works in coordination with a sensor mechanism associated with the device to enable the automatic switching. The technology disclosed herein enables the user to carry out a conversation via the device (i.e., conference session) without interruption when transitioning between different settings, (e.g., using the device while sitting at an office to using it while on-the-go to an appointment).

Abstract: A wiring board with dual stiffeners and integrated dual routing circuitries is characterized in that first and second routing circuitries are positioned within and beyond a through opening of a first stiffener, respectively, and an array of vertical connecting channels are disposed on the second routing circuitry and laterally surrounded by a second stiffener. The mechanical robustness of the first and second stiffeners can prevent the wiring board from warping. The vertical connecting channels can offer electrical contacts for next-level connection. The first routing circuitry, positioned within the through opening of the first stiffener, can provide primary fan-out routing, whereas the second routing circuitry not only provides further fan-out wiring structure for the first routing circuitry, but also mechanically binds the first routing circuitry with the first stiffener.

Abstract: A source system receives initial identification data of a listing related to an entity. The source system searches a provider system for one or more listings having identification data matching the initial identification data. The source system receives, from the provider system, a plurality of potential matching listings having identification data matching the initial identification data, wherein each listing of the plurality of potential matching listings has a corresponding confidence score assigned by the source system, and wherein each listing of the plurality of potential matching listings has a corresponding provider-supplied external identifier assigned by the provider system. The source system designates a representative listing of the entity located on a provider system from among the plurality of potential matching listings, the representative listing having the highest confidence score assigned by the source system.

Abstract: A face-to-face semiconductor assembly is characterized in that first and second semiconductor devices are face-to-face mounted on two opposite sides of a first routing circuitry and is further electrically connected to an interconnect board through the first routing circuitry. The interconnect board has a heat spreader to provide thermal dissipation for the second semiconductor device, and a second routing circuitry formed on the heat spreader and electrically coupled to the first routing circuitry. The first routing circuitry provides primary fan-out routing for the first and second semiconductor devices, whereas the second routing circuitry provides further fan-out wiring structure for the first routing circuitry.

Abstract: New 6xxx aluminum alloys are disclosed. The new 6xxx aluminum alloys may include 1.05-1.50 wt. Mg, 0.60-0.95 wt. % Si, where the (wt. % Mg)/(wt. % Si) is from 1.30 to 1.90, 0.275-0.50 wt. % Cu, and from 0.05 to 1.0 wt. % of at least one secondary element, wherein the secondary element is selected from the group consisting of V, Fe, Cr, Mn, Zr, Ti, and combinations thereof.

Abstract: The appliances and methods provide a tab on a “U”-shaped clip having a labial (i.e. toward the patient's lips or cheek) section and a lingual (i.e. toward the patient's tongue) section. The tab is located in a position that facilitates access by a practitioner and also reduces the moment applied to the clip when the clips is opened and closed. Advantageously, the tab can be positioned to account for the varying degree of resistance encountered by different sections of the clip and minimize the likelihood of either distorting the clip or torquing the appliance. The tab can be positioned coplanar with the sliding mechanism. Advantageously, these appliances can provide improved ease of use, reduced clip distortion over time, and greater patient comfort.

Abstract: Described is an apparatus for improving read and write margins. The apparatus comprises: a sourceline; a first bitline; a column of resistive memory cells, each resistive memory cell of the column coupled at one end to the sourceline and coupled to the first bitline at another end; and a second bitline in parallel to the first bitline, the second bitline to decouple read and write operations on the bitline for the resistive memory cell. Described is also an apparatus which comprises: a sourceline; a bitline; a column of resistive memory cells, each resistive memory cell in the column coupled at one end to the sourceline and coupled to the bitline at another end; and sourceline write drivers coupled to the bitline and the sourceline, wherein the sourceline write drivers are distributed along the column of resistive memory cells.

Abstract: A radio frequency identification (RFID) automatic vehicle identification (AVI) system configured to mitigate signal interference, the system comprising a plurality of RFID readers, comprising a first RFID reader and a second RFID reader; and a plurality of antennas, wherein a first antenna is connected to the first RFID reader and a second antenna is connected to the second RFID reader. Prior to the first RFID reader transmitting a signal through the first antenna, the first RFID reader samples a received radio frequency (RF) signal from the first antenna, and if the received RF signal meets predetermined strength and frequency criteria, the first RFID reader inhibits transmission of the signal through the first antenna.

Abstract: A semiconductor assembly with built-in stiffener and integrated dual routing circuitries is characterized in that a semiconductor device and a first routing circuitry are positioned within a through opening of a stiffener whereas a second routing circuitry extends to an area outside of the through opening of the stiffener. The mechanical robustness of the stiffener can prevent the assembly from warping. The first routing circuitry can enlarge the pad size and pitch of the semiconductor device, whereas the second routing circuitry not only provides further fan-out wiring structure, but also mechanically binds the first routing circuitry with the stiffener.

Abstract: Systems, methods, and devices are provided that provide hybrid flow control for a simple hinged flap high-lift system using sweeping jet (SWJ) actuators for active flow control (AFC) and adaptive vortex generators (AVGs) that may be actuated by flap deflection for passive flow control (PFC). The various embodiments may significantly reduce mass flow, differential pressure, and power requirements for equivalent flow control performance when compared to using AFC only. The various embodiments may reduce the power requirement of AFC, while still maintaining the aerodynamic performance enhancement necessary for high-lift applications using a simple hinged flap. The various embodiments may provide the necessary lift enhancement for a simple hinged flap high-lift system, while keeping the pneumatic power requirement (mass flow and pressure) for the AFC within an aircraft's capability for system integration.

Abstract: An aluminum casting alloy has 8.5-9.5 wt. % silicon, 0.5-2.0 wt. % copper (Cu), 0.27-0.53 wt. % magnesium (Mg), wherein the aluminum casting alloy includes copper and magnesium such that 4.7?(Cu+10Mg)?5.8, and other elements, the balance being aluminum. Selected elements may be added to the base composition to give resistance to degradation of tensile properties due to exposure to heat. The thermal treatment of the alloy is calculated based upon wt. % composition to solutionize unwanted phases having a negative impact on properties and may include a three level ramp-up and soak to a final temperature followed by cold water quenching and artificial aging.

Abstract: Responsive to selecting, by a source system, a representative listing of an entity located on a provider system, the representative listing having first identification data and a first provider-supplied external identifier, the source system searches the provider system for additional listings having identification data matching the first identification data. The source system receives, from the provider system, a potential matching listing having identification data matching the first identification data and having a second provider-supplied external identifier that differs from the first provider-supplied external identifier. The source system designates the potential matching listing as a duplicate listing. The source system transmits, to the provider system, a request to suppress the designated duplicate listing on the provider system, the request comprising the second provider-supplied external identifier.

Abstract: A coreless substrate includes a build-up circuitry, a warping controller and an optional stiffener. The warping controller is adhered to the solder ball attachment side of the build-up circuitry and provides mechanical support for the coreless substrate, whereas the optional stiffener is positioned around peripheral edges of the coreless substrate at the chip attachment side of the build-up circuitry and provides mechanical support for the peripheral area of the coreless substrate.

Abstract: The present invention provides a easting having increased crashworthiness including an aluminum alloy of about 6.0 wt % to about. 8.0 wt % Si; about 0.12 wt % to about 0.25 wt % Mg; less than or equal to about 0.35 wt % Cu; less than or equal to about 4.0 wt % Zn; less than or equal to about 0.6 wt % Mn; and less than or equal to about 0.15 wt % Fe, wherein the east body is treated to a T5 or T6 temper and has a tensile strength ranging from 100 MPa to 180 MPa and has a critical fracture strain greater than 10%. The present invention further provides a method of forming a casting having increased crashworthiness.

Abstract: A method of making a wiring board is characterized by the provision of moisture inhibiting caps covering interfaces between an electrical isolator/optional metal posts and a surrounding plastic material. In a preferred embodiment, the electrical isolator and metal posts are bonded to the resin core by an adhesive substantially coplanar with the metal layers on two opposite sides of the resin core, the metal posts and a thermally conductive slug that includes the electrical isolator at smoothed lapped top and bottom surfaces, so that a metal bridge can be deposited on the adhesive at the smoothed lapped bottom surface to completely cover interfaces between the electrical isolator/metal posts and the surrounding plastic material. Conductive traces are also deposited on the smoothed lapped top surface to provide electrical contacts for chip connection and electrically coupled to the metal posts.

Abstract: A wiring board with integrated interposer and dual wiring structures is characterized in that an interposer and a first wiring structure are positioned within a through opening of a stiffener whereas a second wiring structure is disposed beyond the through opening of the stiffener. The mechanical robustness of the stiffener can prevent the wiring board from warping. The interposer provides primary fan-out routing for a semiconductor device to be assembled thereon. The first wiring structure can further enlarge the pad size and pitch of the interposer, whereas the second wiring structure not only provides further fan-out wiring structure, but also mechanically binds the first wiring structure with the stiffener.