Abstract: A wiring board with embedded interposer is characterized in that the embedded interposer is integrated with a stiffener and a build-up circuitry is deposited on the stiffener, so that the mechanical robustness of the stiffener can prevent the entire wiring board from warping. The interposer provides primary fan-out routing whereas the build-up circuitry provides further fan-out routing and can further enlarge the pad size and pitch of the interposer.

Abstract: The present invention relates to a method of making a semiconductor package with package-on-package stacking capability. In accordance with a preferred embodiment, the method is characterized by the step of attaching a chip-on-interposer subassembly on a metallic carrier with the chip inserted into a cavity of the metallic carrier, and the step of selectively removing portions of the metallic carrier to define a heat spreader for the chip. The heat spreader can provide thermal dissipation, electromagnetic shielding and moisture barrier, whereas the interposer provides a CTE-matched interface and fan-out routing for the chip.

Abstract: One embodiment of the present invention provides an RF front-end system. The RF front-end system includes one or more RF front-end components and a programmable logic device, which has a baseband interface for coupling to a baseband digital signal processor (DSP), and a set of component interfaces for coupling to the one ore more RF front-end components. The programmable logic device is configured to: receive, from the baseband DSP via the baseband interface, a command which includes an address and a control signal; identify a component interface from the set of component interfaces based on the address; and send the control signal to the identified component interface, thereby enabling the baseband DSP to control a front-end component coupled to the programmable logic device via the identified component interface.

Abstract: A wiring board with integrated dual wiring structures is characterized in that first and second wiring structures are positioned within and beyond a through opening of a stiffener, respectively. The mechanical robustness of the stiffener can prevent the wiring board from warping. The first wiring structure, positioned within the through opening of the stiffener, can provide primary fan-out routing, whereas the second wiring structure not only provides further fan-out wiring structure for the first wiring structure, but also mechanically binds the first wiring structure with the stiffener.

Abstract: Technology is disclosed for placement of single-bit flip-flops and multi-bit flip-flops. Single-bit flip-flops with replaced with multi-bit flip-flops and/or relative placement groups of single-bit flip-flops.

Abstract: Disclosed is a method of treating small intestinal bacterial overgrowth (SIBO) or a SIBO-caused condition in a human subject. SIBO-caused conditions include irritable bowel syndrome, fibromyalgia, chronic pelvic pain syndrome, chronic fatigue syndrome, depression, impaired mentation, impaired memory, halitosis, tinnitus, sugar craving, autism, attention deficit/hyperactivity disorder, drug sensitivity, an autoimmune disease, and Crohn's disease. Also disclosed are a method of screening for the abnormally likely presence of SIBO in a human subject and a method of detecting SIBO in a human subject. A method of determining the relative severity of SIBO or a SIBO-caused condition in a human subject, in whom small intestinal bacterial overgrowth (SIBO) has been detected, is also disclosed.

Abstract: Disclosed is a method of manipulating the rate of gastrointestinal transit in a mammalian subject. Also disclosed is the use, in the manufacture of a medicament for the treatment of constipation, of a selective inhibitor of methanogensis, a methanogen-displacing probiotic agent, or a prebiotic agent that inhibits the growth of methanogenic bacteria or promotes the growth of competing non-methanogenic intestinal flora. Alternatively, in accordance with the invention, is disclosed the use in the manufacture of a medicament for the treatment of diarrhea, of methane or a methane precursor, a methanogenic or other methane-enhancing probiotic agent, or a methanogenesis-enhancing prebiotic agent.

Abstract: A source system receives initial identification data of a listing related to an entity. The source system searches a provider system for one or more listings having identification data matching the initial identification data. The source system receives, from the provider system, a plurality of potential matching listings having identification data matching the initial identification data, wherein each listing of the plurality of potential matching listings has a corresponding confidence score assigned by the source system, and wherein each listing of the plurality of potential matching listings has a corresponding provider-supplied external identifier assigned by the provider system. The source system designates a representative listing of the entity located on a provider system from among the plurality of potential matching listings, the representative listing having the highest confidence score assigned by the source system.

Abstract: New 6xxx aluminum alloy bodies and methods of producing the same are disclosed. The new 6xxx aluminum alloy bodies may be produced by preparing the aluminum alloy body for post-solutionizing cold work, cold working by at least 25%, and then thermally treating. The new 6xxx aluminum alloy bodies may realize improved strength and other properties.

Abstract: The present invention provides a casting having increased crashworthiness including an an aluminum alloy of about 6.0 wt % to about 8.0 wt % Si; about 0.12 wt % to about 0.25 wt % Mg; less than or equal to about 0.35 wt % Cu; less than or equal to about 4.0 wt % Zn; less than or equal to about 0.6 wt % Mn; and less than or equal to about 0.15 wt % Fe, wherein the cast body is treated to a T5 or T6 temper and has a tensile strength ranging from 100 MPa to 180 MPa and has a critical fracture strain greater than 10%. The present invention further provides a method of forming a casting having increased crashworthiness.

Abstract: A method of making a semiconductor device with face-to-face chips on interposer includes the step of attaching a chip-on-interposer subassembly on a heat spreader with the chip inserted into a cavity of the heat spreader so that the heat spreader provides mechanical support for the interposer. The heat spreader also provides thermal dissipation, electromagnetic shielding and moisture barrier for the enclosed chip. In the method, a second chip is also electrically coupled to a second surface of the interposer and an optional second heat spreader is attached to the second chip.

Abstract: Method and system for organizing and sharing content through experience are described. In one embodiment, content may be organized and shared among users through a specific experience. A method for sharing content in a network may include: collecting contents related to a specific experience from a specific user; generating an experience graph of the specific experience; enabling the specific user to invite other users to join the experience graph; and enabling each user inside the experience graph to share new content into the experience graph.

Abstract: Described are apparatuses for improving resistive memory energy efficiency. An apparatus performs data-driven write to make use of asymmetric write switch energy between write0 and write1 operations. The apparatus comprises: a resistive memory cell coupled to a bit line and a select line; a first pass-gate coupled to the bit line; a second pass-gate coupled to the select line; and a multiplexer operable by input data, the multiplexer to provide a control signal to the first and second pass-gates or to write drivers according to logic level of the input data. An apparatus comprises circuit for performing read before write operation which avoids unnecessary writes with an initial low power read operation. An apparatus comprises circuit to perform self-controlled write operation which stops the write operation as soon as bit-cell flips. An apparatus comprises circuit for performing self-controlled read operation which stops read operation as soon as data is detected.

Abstract: New 7xxx aluminum alloy bodies and methods of producing the same are disclosed. The new 7xxx aluminum alloy bodies may be produced by preparing the aluminum alloy body for post-solutionizing cold work, cold working by at least 25%, and then thermally treating. The new 7xxx aluminum alloy bodies may realize improved strength and other properties.

Abstract: New 2xxx aluminum alloy bodies and methods of producing the same are disclosed. The new 2xxx aluminum alloy bodies may be produced by preparing the aluminum alloy body for post-solutionizing cold work, cold working by at least 25%, and then thermally treating. The new 2xxx aluminum alloy bodies may realize improved strength and other properties.

Abstract: A method comprises fusion welding a filler metal to a first aluminum component; wherein the first aluminum component comprises a 7xxx series aluminum alloy; and wherein the filler metal comprises an aluminum alloy, in weight percent: up to 0.15 Fe; up to 0.15 Si; from 2.3 to 2.7 Mg; from 1.4 to 1.8 Cu; from 6.0 to 9.0 Zn; and from 0.06 to 0.14 Zr. In some embodiments, the 7xxx series aluminum alloy comprises 0.5-2.6 wt. % Cu. In some embodiments, the filler metal comprises, in weight percent, up to 0.45 Sc.

Abstract: The present invention relates to a method of making a semiconductor package with package-on-package stacking capability. In accordance with a preferred embodiment, the method is characterized by the step of attaching a chip-on-interposer subassembly on a metallic carrier with the chip inserted into a cavity of the metallic carrier, and the step of selectively removing portions of the metallic carrier to define a heat spreader for the chip. The heat spreader can provide thermal dissipation, electromagnetic shielding and moisture barrier, whereas the interposer provides a CTE-matched interface and fan-out routing for the chip.

Abstract: A system and method for quantifying clinical skill of a user, comprising: collecting data relating to a surgical task done by a user using a surgical device; comparing the data for the surgical task to other data for another similar surgical task; quantifying the clinical skill of the user based on the comparing of the data for the surgical task to the other data for the other similar surgical task; outputting the clinical skill of the user.

Abstract: A method of making a semiconductor assembly is characterized by the step of attaching a chip-on-interposer subassembly on a base carrier with the chip inserted into a through opening of the base carrier and the interposer laterally extending beyond the through opening. The base carrier provides a platform for the chip-on-interposer subassembly attachment, whereas the interposer provides primary fan-out routing for the chip. In the method, a buildup circuitry is electrically coupled to the interposer and an optional cover sheet or additional buildup circuitry can be provided on the chip.

Abstract: A source system searches a provider system for one or more listings. The source system receives a plurality of potential matching listings. The source system designates a representative listing of the entity located on a provider system from among the plurality of potential matching listings. The source system designates one or more remaining potential matching listings of the plurality of potential matching listings as one or more duplicate listings. The source system transmits, to the provider system, a request to synchronize the representative listing as the only representative listing of the entity on the provider system, the request comprising a first provider-supplied external identifier of the representative listing.