Abstract: A mounting structure of a semiconductor device and a method of mounting the semiconductor device are provided. The mounting structure includes a circuit substrate having a terminal pad. A device substrate is located over the circuit substrate having a ball pad facing the terminal pad of the circuit substrate. A conductive ball is formed between the circuit substrate and the device substrate in order to connect the terminal pad of the circuit substrate to the ball pad of the device substrate. A first soldering flux including an epoxy-based resin connects the conductive ball to the ball pad of the device substrate. An underfill layer is formed between the circuit substrate and the device substrate in order to bury the conductive ball and the first soldering flux.

Abstract: A semiconductor package may include a substrate having external contact terminals. A semiconductor chip having bonding pads may be formed on the substrate. Conductive bumps may connect the external contact terminals of the substrate to the bonding pads of the semiconductor chip. An underfill may be interposed between the substrate and the semiconductor chip. The underfill may include a first underfill region composed of a first material adjacent to the semiconductor chip and a second underfill region composed of a second material adjacent to the substrate, the first material having a higher glass transition temperature than the second material.

Abstract: Example embodiments relate to a semiconductor package. The semiconductor package may include a mounting substrate, a semiconductor chip mounted to the mounting substrate, at least one passive component passing therethrough and mounted to the mounting substrate, and a cover covering the mounting substrate, the semiconductor chip and the at least one passive component.

Abstract: A polyethylene terephthalate monofilament obtained by spinning a polyethylene terephthalate chip having an intrinsic viscosity of 0.8 to 1.3, which gives a stress-strain curve exhibiting an elongation of less than 2.5% at an initial stress of 2.0 g/d, with an initial modulus value of 80 to 160 g/d, an elongation of 7.5% or less in a stress range of from 2.0 g/d to 9.0 g/d, and an elongation of at least 2.0% or more in a stress range of from 10.0 g/d to the point of break, is provided.

Abstract: A method of correcting distortion caused by fingerprint input sensors of heterogeneous fingerprint recognition systems. The method includes a first step of fabricating a measurement pattern for measuring resolutions of a fingerprint input sensor, a second step of measuring image resolutions of an image, acquired by the fingerprint input sensor, using the fabricated measurement pattern for predetermined locations and directions, a third step of designing control lines for compensating for the distortion caused by the fingerprint input sensor, based on the measured resolutions, a fourth step of obtaining average horizontal and vertical resolutions of the acquired image, a fifth step of modeling the control lines based on a ratio of the average horizontal resolution to the vertical average resolution, and a sixth step of compensating for the distortion of the acquired image based on results of the modeling.

Abstract: A porous mullite composition is made by forming a mixture of one or more precursor compounds having the elements present in mullite (e.g., clay, alumina, silica) and a property enhancing compound. The property enhancing compound is a compound having an element selected from the group consisting of Mg, Ca, Fe, Na, K, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, B, Y, Sc, La and combination thereof. The mixture is shaped and to form a porous green shape which is heated under an atmosphere having a fluorine containing gas to a temperature sufficient to form a mullite composition comprised substantially of acicular mullite grains that are essentially chemically bound.

Abstract: A porous mullite composition is made by forming a mixture of one or more precursor compounds having the elements present in mullite (e.g., clay, alumina, silica) and a property enhancing compound. The property enhancing compound is a compound having an element selected from the group consisting of Mg, Ca, Fe, Na, K, Ce, Pr, Nd, Sm, Eu, Gd, Th, Dy, Ho, Er, Tm, Yb, Lu, B, Y, Sc, La and combination thereof. The mixture is shaped and to form a porous green shape which is heated under an atmosphere having a fluorine containing gas to a temperature sufficient to form a mullite composition comprised substantially of acicular mullite grains that are essentially chemically bound.

Abstract: An apparatus for inspecting a semiconductor device may include an external image detector to acquire an exterior image of the semiconductor device, an internal image detector to acquire an interior image of the semiconductor device, and a controller to compare the acquired images with respective references. The apparatus may both inspect the exterior and the interior of the semiconductor device.

Abstract: Example embodiments may be directed to a printed circuit board having an insulating substrate, pads disposed on the surface of the insulating substrate, a solder resist, and a solder moving portion. Leads of a semiconductor package may be mounted on the insulating substrate. The pads to which the leads of the semiconductor package are connected may be disposed on the surface of the insulating substrate. The solder resist layer may cover the insulating substrate, but may also contain openings exposing at least a portion of the pads to which the leads of the semiconductor package are connected. During the process by which each semiconductor lead is connected to a pad, the solder moving portion on the pad may allow an adhesion solder coating each of the leads of the semiconductor package to move towards a shoulder portion of the semiconductor package leads.

Abstract: A method of testing a substrate may involve photographing a first chip on a first face of the substrate to obtain a first image of the first chip, and photographing a second chip on a second face of the substrate opposite to the first face without reversing the substrate to obtain a second image of the second chip. The normality of the first and the second chips may be determined based on the first and the second images.

Abstract: An organic additive is removed from a ceramic honeycomb by an improved method by contacting each end of the extruded honeycomb with a member that has a gas permeability no greater than the outer wall, the member essentially covering the ends and heating the honeycomb to a temperature sufficient to remove the organic additive.

Abstract: Example embodiments of the present invention may include a printed circuit board, a method of manufacturing the printed circuit board, and a memory module/socket assembly. Example embodiments of the present invention may increase the number of contact taps on a memory module, in addition, a force required to insert the memory module into a module socket may be decreased.

Abstract: An electronic component mounting apparatus that includes a demagnetizer used to demagnetize a head nozzle, and a method for demagnetizing an electronic component apparatus. The method may include setting conditions, mounting electronic components, and demagnetizing a head nozzle of the electronic component mounting apparatus based on the conditions.

Abstract: A molded brassiere cup manufacturing apparatus includes a wound roller for consecutively supplying upper and lower cloths and a reinforcing pad cloth interleaved between the upper and lower cloths, a puncturing unit for puncturing at least one position checking hole at a predetermined position of the cloth supplied from the wound roller, a molding unit having upper and lower molding casts formed in correspondence with a predetermined bust shape, a cooling unit having upper and lower cooling casts, a cutting unit having first upper and lower cutting casts formed in correspondence with a predetermined bust shape and second upper and lower cutting casts formed in correspondence with a predetermined reinforcing pad to be placed at a lower portion of the predetermined bust shape, wherein the molding unit, the cooling unit, and the cutting unit each have at least one sensor for detecting the position checking hole at the side thereof opposite to the cloth.

Abstract: A porous mullite composition is made by Forming a mixture of one or more precursor compounds having the elements present in mullite (e.g., clay, alumina, silica) and a property enhancing compound. The property enhancing compound is a compound having an element selected from the group consisting of Mg, Ca, Fe, Na, K, Ce, Pr, Nd, Sm, Eu, Gd, Th, Dy, Ho, Er, Tm, Yb, Lu, B, Y, Sc, La and combination thereof. The mixture is shaped and to form a porous green shape which is heated under an atmosphere having a fluorine containing gas to a temperature sufficient to form a mullite composition comprised substantially of acicular mullite grains that are essentially chemically bound.

Abstract: A method for removing dissolved contaminants from solution using a surface-activated crystalline titanium oxide product having a high adsorptive capacity and a high rate of adsorption with respect to dissolved contaminants, in particular, arsenate and arsenite. Preferably, the titanium oxide product includes crystalline anatase having primary crystallite diameters in the range of 1-30 nm. The surface-activated titanium oxide is combined with other filter media to further improve the removal of dissolved contaminants.

Abstract: A method for removing dissolved contaminants from solution using a surface-activated crystalline titanium oxide product having a high adsorptive capacity and a high rate of adsorption with respect to dissolved contaminants, in particular, arsenate and arsenite. Preferably, the titanium oxide product includes crystalline anatase having primary crystallite diameters in the range of 1-30 nm. The surface-activated titanium oxide is combined with other filter media to further improve the removal of dissolved contaminants.

Abstract: The present invention is a method for a biochip detecting limited cells. The present invention comprises steps of: obtaining a nylon membrane chip having required nucleotide fragments arranged in a dot matrix way by using a manual spotter; naturally drying by heat and fixing the nucleotide fragments on the nylon membrane chip by a rapid nucleic acid cross-linker when preparing a chip; collecting some normal whole blood to be linearly amplified; synthesizing required amount of cDNA by a reverse transcription to obtain a marker as a probe; processing labeling, hybridization and post-hybridization to the chip and the marker; processing chemical color reaction; and automatically analyzing the result image after the chemical color reaction. Accordingly, a gene biochip operation technology platform with low cost, easy operation and high efficiency is obtained.

Abstract: A ceramic-metal composite that is tough and stiff has been prepared and is comprised of an inert ceramic (e.g., alumina) embedded and dispersed in a matrix comprised of a metal (e.g., aluminum), a reactive ceramic (e.g., boron carbide) and a reactive ceramic-metal reaction product (e.g., AlB2, Al4BC, Al3B48C2, AlB12, Al4C3, AlB24C4 or mixtures thereof) wherein grains of the inert ceramic have an average grain size greater than or equal to the average grain size of grains of the reactive ceramic. The ceramic-metal composite may be prepared by forming a mixture comprised of an inert ceramic powder (e.g., alumina) and a reactive ceramic powder (e.g., boron carbide), the inert ceramic powder having an average particle size equal to or greater than the average particle size of the reactive ceramic powder, forming the mixture into a porous body and consolidating the porous body in the presence of a metal (e.g., aluminum) to form the ceramic-metal composite.

Abstract: Stable aqueous dispersions of prepolymers or preformed polymers or redisperable powder polymers that are film-forming at processing temperatures of concrete or mortar can be blended with concrete or mortar to impart desirable low water permeability and Ready-Mix truck deliverability to the modified concrete or mortar.