Abstract: A novel heat sink structure for being mounted to a module board to which semiconductor chips are attached and for dissipating or spreading heat generated from the semiconductor chips is disclosed. The heat sink comprises a heat sink base, and a coupling means for coupling the heat sink base to the module board. The coupling means passes through the heat sink base. The coupling means includes integrally formed upper and lower body portions, an orifice formed at least through the lower body portion, and a flanged base formed integral with the lower body portion. The flanged base fixes the coupling means to the heat sink base. The outer dimension of the upper body portion is smaller than the inner dimension of the lower body portion. As a result, many heat sinks can be stacked stably.

Abstract: A novel heat sink structure for being mounted to a module board to which semiconductor chips are attached and for dissipating or spreading heat generated from the semiconductor chips is disclosed. The heat sink comprises a heat sink base, and a coupling means for coupling the heat sink base to the module board. The coupling means passes through the heat sink base. The coupling means includes integrally formed upper and lower body portions, an orifice formed at least through the lower body portion, and a flanged base formed integral with the lower body portion. The flanged base fixes the coupling means to the heat sink base. The outer dimension of the upper body portion is smaller than the inner dimension of the lower body portion. As a result, many heat sinks can be stacked stably.

Abstract: A ceramic-metal composite that is tough and stiff has been prepared and is comprised of an inert ceramic (e.g., alumina) embedded and dispersed in a matrix comprised of a metal (e.g., aluminum), a reactive ceramic (e.g., boron carbide) and a reactive ceramic-metal reaction product (e.g., AlB2, Al4BC, Al3B48C2, AlB12, Al4C3, AlB24C4 or mixtures thereof) wherein grains of the inert ceramic have an average grain size greater than or equal to the average grain size of grains of the reactive ceramic. The ceramic-metal composite may be prepared by forming a mixture comprised of an inert ceramic powder (e.g., alumina) and a reactive ceramic powder (e.g., boron carbide), the inert ceramic powder having an average particle size equal to or greater than the average particle size of the reactive ceramic powder, forming the mixture into a porous body and consolidating the porous body in the presence of a metal (e.g., aluminum) to form the ceramic-metal composite.

Abstract: A process for preparing complex-shaped, ceramic-metal composite articles, comprising: (a) contacting a non-wettable powder that is non-wetting to a metal to be used for infiltration with a shaped ceramic body to form a layer of the non-wettable powder on one or more surfaces of the shaped ceramic body, wherein the shaped ceramic body has a region where there is no layer of the non-wettable powder, and (b) infiltration the shaped ceramic body with the metal through the region or regions where there is no layer of the non-wettable powder, such that a complex-shaped ceramic-metal composite comprising one or more metal phases and one or more ceramic phases is formed, wherein the article has substantially the net shape of the shaped ceramic body and undesirable regions of excess metal on the surface and undesirable phases within the complex-shaped ceramic-metal composite article near the surface are located only in the region or regions where there is no layer of the non-wettable powder.

Abstract: A method for loading sub-processors in system having a plurality of sub-processors connected with main processor via a repeater and utilizing broadcasting function is disclosed. The method comprises the Steps of inspecting a transfer path communicating the main processor and the plural sub-processors; collecting a loading request signal transmitted from the sub-processors at predetermined time period; and loading simultaneously the sub-processors using broadcasting function after interconnecting the sub-processors which request the collected loading during the collecting Step with the main processor via the repeater in multipoint base. The sub-processors having the collected signal are simultaneously loaded using broadcasting function, it has the effect for reducing loading time.

Abstract: An apparatus for automatic loading or unloading printed circuit boards (PCBs) for semiconductor modules is disclosed. The apparatus employs an elastic jig carrier into which the PCBs are loaded. The jig carrier includes movable clamps for fixing the PCBs by elastic force. A jig opener of the apparatus applies opening force, in the reverse direction of the elastic force, to the movable clamps so that the PCBs can be loaded into or unloaded from the jig carrier by a picker. The jig carrier is transferred along a conveyor belt, while the PCBs are supplied from a PCB stage such as a tray to the jig carrier. The apparatus may further comprise a gripper and a rotator. The gripper grips the upright PCBs and the rotator rotates them to be horizontal, so that the picker can pick up the horizontal PCBs. The apparatus may also comprise an aligner for exact alignment of the PCBs in the jig carrier. A method for loading or unloading the PCBs into or from the jig carrier is also disclosed in connection with the apparatus.

Abstract: An apparatus for carrying plural printed circuit boards (PCBs) for semiconductor modules is disclosed. The apparatus comprises a main frame which is formed with an inside space for the PCBs. The main frame includes receivers for supporting one shorter edge of the PCBs. A clamp frame joined to the main frame includes a support plate for the other shorter edge of the PCBs. Movable clamps are elastically connected to the clamp frame so as to push the PCBs by elastic force when the PCBs are loaded into the apparatus. A adjustable mounting such as a slot or holes is provided in the main frame for fasteners joining two frames each other. Therefore, the apparatus can carry the PCBs of different size. The elastic connection between the clamp and the clamp frame is preferably made by slide bars and elastic members. Clamp holes, sub-walls, partition walls, hollow corners, and so forth may be preferably provided for the apparatus.

Abstract: A process for preparing complex-shaped, ceramic-metal composite articles, comprising:a) contacting a non-wettable powder that is non-wetting to a metal to be used for infiltration with a shaped ceramic body to form a layer(s) of the non-wettable powder on one or more surface(s) of the shaped ceramic body wherein the shaped ceramic body has a region(s) where there is no layer of the non-wettable powder;b) infiltrating the shaped ceramic body with the metal through the region(s) where there is no layer of the non-wettable powder such that a complex-shaped ceramic-metal composite comprising one or more metal phases and one or more ceramic phases is formed, wherein the article has substantially the net shape of the shaped ceramic body and the undesirable regions of excess metal on the surface and undesirable phases within the complex-shaped ceramic-metal composite article near the surface are located only in the region(s) where there is no layer of the non-wettable powder.

Abstract: A hard drive disk substrate is formed of a multi-phase ceramic-based material having at least two phases with amorphous phases being present in an amount less than about 1 volume percent based on the volume of the ceramic-based material or at least one phase being free metal. A process for producing the ceramic-based disk substrate is produced by forming a flat disk of a porous ceramic and then infiltrating the porous ceramic with a metal whereby a multi-phase ceramic-based computer hard drive disk is produced. Additionally, a step of passivating the porous ceramic by elevating it to a temperature of about 1300.degree. to about 1800.degree. C. before the infiltrating step may be performed, such that the surfaces are passivated and the reaction kinetics can be controlled during the infiltrating step. A preferred composite material is made of a multi-phase boron carbide composite material including grains having peaks with an average roughness value, Ra, of between about 1 to about 200.ANG.

Abstract: A hard drive disk substrate is formed of a multi-phase ceramic-based material having at least two phases with amorphous phases being present in an amount less than about 1 volume percent based on the volume of the ceramic-based material or at least one phase being free metal. A process for producing the ceramic-based disk substrate is produced by forming a flat disk of a porous ceramic and then infiltrating the porous ceramic with a metal whereby a multi-phase ceramic-based computer hard drive disk is produced. Additionally, a step of passivating the porous ceramic by elevating it to a temperature of about 1300.degree. to about 1800.degree. C. before the infiltrating step may be performed, such that the surfaces are passivated and the reaction kinetics can be controlled during the infiltrating step. A preferred composite material is made of a multi-phase boron carbide composite material including grains having peaks with an average roughness value, Ra, of between about 1 to about 200 .ANG.

Abstract: Ceramic precursor mixtures containing a metal cation, a carbohydrate, and an anion capable of participating in an anionic oxidation-reduction reaction with the carbohydrate for continuous or batchwise drying and pyrolyzing to provide ceramic powders.