Abstract: A porous mullite composition is made by forming a mixture of one or more precursor compounds having the elements present in mullite (e.g., clay, alumina, silica) and a property enhancing compound. The property enhancing compound is a compound having an element selected from the group consisting of Mg, Ca, Fe, Na, K, Ce, Pr, Nd, Sm, Eu, Gd, Th, Dy, Ho, Er, Tm, Yb, Lu, B, Y, Sc, La and combination thereof. The mixture is shaped and to form a porous green shape which is heated under an atmosphere having a fluorine containing gas to a temperature sufficient to form a mullite composition comprised substantially of acicular mullite grains that are essentially chemically bound.

Abstract: An apparatus for inspecting a semiconductor device may include an external image detector to acquire an exterior image of the semiconductor device, an internal image detector to acquire an interior image of the semiconductor device, and a controller to compare the acquired images with respective references. The apparatus may both inspect the exterior and the interior of the semiconductor device.

Abstract: Example embodiments may be directed to a printed circuit board having an insulating substrate, pads disposed on the surface of the insulating substrate, a solder resist, and a solder moving portion. Leads of a semiconductor package may be mounted on the insulating substrate. The pads to which the leads of the semiconductor package are connected may be disposed on the surface of the insulating substrate. The solder resist layer may cover the insulating substrate, but may also contain openings exposing at least a portion of the pads to which the leads of the semiconductor package are connected. During the process by which each semiconductor lead is connected to a pad, the solder moving portion on the pad may allow an adhesion solder coating each of the leads of the semiconductor package to move towards a shoulder portion of the semiconductor package leads.

Abstract: A method of testing a substrate may involve photographing a first chip on a first face of the substrate to obtain a first image of the first chip, and photographing a second chip on a second face of the substrate opposite to the first face without reversing the substrate to obtain a second image of the second chip. The normality of the first and the second chips may be determined based on the first and the second images.

Abstract: An organic additive is removed from a ceramic honeycomb by an improved method by contacting each end of the extruded honeycomb with a member that has a gas permeability no greater than the outer wall, the member essentially covering the ends and heating the honeycomb to a temperature sufficient to remove the organic additive.

Abstract: Example embodiments of the present invention may include a printed circuit board, a method of manufacturing the printed circuit board, and a memory module/socket assembly. Example embodiments of the present invention may increase the number of contact taps on a memory module, in addition, a force required to insert the memory module into a module socket may be decreased.

Abstract: An electronic component mounting apparatus that includes a demagnetizer used to demagnetize a head nozzle, and a method for demagnetizing an electronic component apparatus. The method may include setting conditions, mounting electronic components, and demagnetizing a head nozzle of the electronic component mounting apparatus based on the conditions.

Abstract: A molded brassiere cup manufacturing apparatus includes a wound roller for consecutively supplying upper and lower cloths and a reinforcing pad cloth interleaved between the upper and lower cloths, a puncturing unit for puncturing at least one position checking hole at a predetermined position of the cloth supplied from the wound roller, a molding unit having upper and lower molding casts formed in correspondence with a predetermined bust shape, a cooling unit having upper and lower cooling casts, a cutting unit having first upper and lower cutting casts formed in correspondence with a predetermined bust shape and second upper and lower cutting casts formed in correspondence with a predetermined reinforcing pad to be placed at a lower portion of the predetermined bust shape, wherein the molding unit, the cooling unit, and the cutting unit each have at least one sensor for detecting the position checking hole at the side thereof opposite to the cloth.

Abstract: A porous mullite composition is made by Forming a mixture of one or more precursor compounds having the elements present in mullite (e.g., clay, alumina, silica) and a property enhancing compound. The property enhancing compound is a compound having an element selected from the group consisting of Mg, Ca, Fe, Na, K, Ce, Pr, Nd, Sm, Eu, Gd, Th, Dy, Ho, Er, Tm, Yb, Lu, B, Y, Sc, La and combination thereof. The mixture is shaped and to form a porous green shape which is heated under an atmosphere having a fluorine containing gas to a temperature sufficient to form a mullite composition comprised substantially of acicular mullite grains that are essentially chemically bound.

Abstract: A method for removing dissolved contaminants from solution using a surface-activated crystalline titanium oxide product having a high adsorptive capacity and a high rate of adsorption with respect to dissolved contaminants, in particular, arsenate and arsenite. Preferably, the titanium oxide product includes crystalline anatase having primary crystallite diameters in the range of 1-30 nm. The surface-activated titanium oxide is combined with other filter media to further improve the removal of dissolved contaminants.

Abstract: A method for removing dissolved contaminants from solution using a surface-activated crystalline titanium oxide product having a high adsorptive capacity and a high rate of adsorption with respect to dissolved contaminants, in particular, arsenate and arsenite. Preferably, the titanium oxide product includes crystalline anatase having primary crystallite diameters in the range of 1-30 nm. The surface-activated titanium oxide is combined with other filter media to further improve the removal of dissolved contaminants.

Abstract: The present invention is a method for a biochip detecting limited cells. The present invention comprises steps of: obtaining a nylon membrane chip having required nucleotide fragments arranged in a dot matrix way by using a manual spotter; naturally drying by heat and fixing the nucleotide fragments on the nylon membrane chip by a rapid nucleic acid cross-linker when preparing a chip; collecting some normal whole blood to be linearly amplified; synthesizing required amount of cDNA by a reverse transcription to obtain a marker as a probe; processing labeling, hybridization and post-hybridization to the chip and the marker; processing chemical color reaction; and automatically analyzing the result image after the chemical color reaction. Accordingly, a gene biochip operation technology platform with low cost, easy operation and high efficiency is obtained.

Abstract: A ceramic-metal composite that is tough and stiff has been prepared and is comprised of an inert ceramic (e.g., alumina) embedded and dispersed in a matrix comprised of a metal (e.g., aluminum), a reactive ceramic (e.g., boron carbide) and a reactive ceramic-metal reaction product (e.g., AlB2, Al4BC, Al3B48C2, AlB12, Al4C3, AlB24C4 or mixtures thereof) wherein grains of the inert ceramic have an average grain size greater than or equal to the average grain size of grains of the reactive ceramic. The ceramic-metal composite may be prepared by forming a mixture comprised of an inert ceramic powder (e.g., alumina) and a reactive ceramic powder (e.g., boron carbide), the inert ceramic powder having an average particle size equal to or greater than the average particle size of the reactive ceramic powder, forming the mixture into a porous body and consolidating the porous body in the presence of a metal (e.g., aluminum) to form the ceramic-metal composite.

Abstract: Stable aqueous dispersions of prepolymers or preformed polymers or redisperable powder polymers that are film-forming at processing temperatures of concrete or mortar can be blended with concrete or mortar to impart desirable low water permeability and Ready-Mix truck deliverability to the modified concrete or mortar.

Abstract: A novel heat sink structure for being mounted to a module board to which semiconductor chips are attached and for dissipating or spreading heat generated from the semiconductor chips is disclosed. The heat sink comprises a heat sink base, and a coupling means for coupling the heat sink base to the module board. The coupling means passes through the heat sink base. The coupling means includes integrally formed upper and lower body portions, an orifice formed at least through the lower body portion, and a flanged base formed integral with the lower body portion. The flanged base fixes the coupling means to the heat sink base. The outer dimension of the upper body portion is smaller than the inner dimension of the lower body portion. As a result, many heat sinks can be stacked stably.

Abstract: A novel heat sink structure for being mounted to a module board to which semiconductor chips are attached and for dissipating or spreading heat generated from the semiconductor chips is disclosed. The heat sink comprises a heat sink base, and a coupling means for coupling the heat sink base to the module board. The coupling means passes through the heat sink base. The coupling means includes integrally formed upper and lower body portions, an orifice formed at least through the lower body portion, and a flanged base formed integral with the lower body portion. The flanged base fixes the coupling means to the heat sink base. The outer dimension of the upper body portion is smaller than the inner dimension of the lower body portion. As a result, many heat sinks can be stacked stably.

Abstract: A ceramic-metal composite that is tough and stiff has been prepared and is comprised of an inert ceramic (e.g., alumina) embedded and dispersed in a matrix comprised of a metal (e.g., aluminum), a reactive ceramic (e.g., boron carbide) and a reactive ceramic-metal reaction product (e.g., AlB2, Al4BC, Al3B48C2, AlB12, Al4C3, AlB24C4 or mixtures thereof) wherein grains of the inert ceramic have an average grain size greater than or equal to the average grain size of grains of the reactive ceramic. The ceramic-metal composite may be prepared by forming a mixture comprised of an inert ceramic powder (e.g., alumina) and a reactive ceramic powder (e.g., boron carbide), the inert ceramic powder having an average particle size equal to or greater than the average particle size of the reactive ceramic powder, forming the mixture into a porous body and consolidating the porous body in the presence of a metal (e.g., aluminum) to form the ceramic-metal composite.

Abstract: A process for preparing complex-shaped, ceramic-metal composite articles, comprising: (a) contacting a non-wettable powder that is non-wetting to a metal to be used for infiltration with a shaped ceramic body to form a layer of the non-wettable powder on one or more surfaces of the shaped ceramic body, wherein the shaped ceramic body has a region where there is no layer of the non-wettable powder, and (b) infiltration the shaped ceramic body with the metal through the region or regions where there is no layer of the non-wettable powder, such that a complex-shaped ceramic-metal composite comprising one or more metal phases and one or more ceramic phases is formed, wherein the article has substantially the net shape of the shaped ceramic body and undesirable regions of excess metal on the surface and undesirable phases within the complex-shaped ceramic-metal composite article near the surface are located only in the region or regions where there is no layer of the non-wettable powder.

Abstract: A method for loading sub-processors in system having a plurality of sub-processors connected with main processor via a repeater and utilizing broadcasting function is disclosed. The method comprises the Steps of inspecting a transfer path communicating the main processor and the plural sub-processors; collecting a loading request signal transmitted from the sub-processors at predetermined time period; and loading simultaneously the sub-processors using broadcasting function after interconnecting the sub-processors which request the collected loading during the collecting Step with the main processor via the repeater in multipoint base. The sub-processors having the collected signal are simultaneously loaded using broadcasting function, it has the effect for reducing loading time.

Abstract: An apparatus for automatic loading or unloading printed circuit boards (PCBs) for semiconductor modules is disclosed. The apparatus employs an elastic jig carrier into which the PCBs are loaded. The jig carrier includes movable clamps for fixing the PCBs by elastic force. A jig opener of the apparatus applies opening force, in the reverse direction of the elastic force, to the movable clamps so that the PCBs can be loaded into or unloaded from the jig carrier by a picker. The jig carrier is transferred along a conveyor belt, while the PCBs are supplied from a PCB stage such as a tray to the jig carrier. The apparatus may further comprise a gripper and a rotator. The gripper grips the upright PCBs and the rotator rotates them to be horizontal, so that the picker can pick up the horizontal PCBs. The apparatus may also comprise an aligner for exact alignment of the PCBs in the jig carrier. A method for loading or unloading the PCBs into or from the jig carrier is also disclosed in connection with the apparatus.