Abstract: The present invention generally relates to a geopolymer precursor dry mixture, geopolymer precursor package, a process of preparing a geopolymer composition, and a method of providing a geopolymer composition to a geopolymer composition preparation site.

Abstract: A polyethylene terephthalate monofilament obtained by spinning a polyethylene terephthalate chip having an intrinsic viscosity of 0.8 to 1.3, which gives a stress-strain curve exhibiting an elongation of less than 2.5% at an initial stress of 2.0 g/d, with an initial modulus value of 80 to 160 g/d, an elongation of 7.5% or less in a stress range of from 2.0 g/d to 9.0 g/d, and an elongation of at least 2.0% or more in a stress range of from 10.0 g/d to the point of break, is provided.

Abstract: Provided are a passive device of a semiconductor module, a semiconductor module having the passive device, an electronic circuit board and electronic system having the passive device or semiconductor module, and methods of fabricating and inspecting the semiconductor module. The passive device of the semiconductor module includes a main body and at least two real electrodes disposed on one lateral surface of the main body.

Abstract: In a method of attaching a solder ball, a first material is coated on a solder ball. A second material is coated on a pad of a substrate where the solder ball is to be attached to exothermically react with the first material. The solder ball makes contact with the pad such that the first material and the second material exothermically react with each other to release heat to adhere the solder ball to the pad using the heat.

Abstract: A semiconductor device includes a semiconductor package, a circuit board and an interval maintaining member. The semiconductor package has a body and a lead protruded from the body. The circuit board has a first land electrically connected to the lead. The interval maintaining member is interposed between the circuit board and the body. The interval maintaining member maintains an interval between the lead and the first land. Thus, an interval between the lead and the land is uniformly maintained, so that a thermal and/or mechanical reliability of the semiconductor device is improved.

Abstract: Example embodiments relate to a semiconductor package. The semiconductor package may include a mounting substrate, a semiconductor chip mounted to the mounting substrate, at least one passive component passing therethrough and mounted to the mounting substrate, and a cover covering the mounting substrate, the semiconductor chip and the at least one passive component.

Abstract: An electronic device with a reworkable electronic component, a method of manufacturing the electronic device, and a method of reworking the electronic component are disclosed. The electronic device includes a first cavity provided in a board body. A first metal pattern is provided on the board body and adjacent to the first cavity. A first electronic component is provided in the first cavity. A first connection pattern is provided adjacent to an upper edge portion of the first electronic component and extends to the first metal pattern so that the first metal pattern is electrically connected to the first electronic component.

Abstract: A method of correcting distortion caused by fingerprint input sensors of heterogeneous fingerprint recognition systems. The method includes a first step of fabricating a measurement pattern for measuring resolutions of a fingerprint input sensor, a second step of measuring image resolutions of an image, acquired by the fingerprint input sensor, using the fabricated measurement pattern for predetermined locations and directions, a third step of designing control lines for compensating for the distortion caused by the fingerprint input sensor, based on the measured resolutions, a fourth step of obtaining average horizontal and vertical resolutions of the acquired image, a fifth step of modeling the control lines based on a ratio of the average horizontal resolution to the vertical average resolution, and a sixth step of compensating for the distortion of the acquired image based on results of the modeling.

Abstract: The present invention relates to modified geopolymer compositions, geopolymer-coated organic polymer substrates, and methods of manufacturing and articles comprising same.

Abstract: A lead frame unit, a semiconductor package having a lead frame unit, a stacked semiconductor package having a semiconductor package, and methods of manufacturing the same are provided. The lead frame unit in a stacked semiconductor package may include a die pad supporting a semiconductor chip, an inner lead electrically connected to the semiconductor chip, an outer lead extending from the inner lead, and a heat-resistant insulation member surrounding the connection portion. The outer lead may include a connection portion connected to the inner lead and a junction portion connected to the connection portion and a circuit board. An external signal may be applied to the junction portion. If the lead frame unit is used in the stacked semiconductor package, the outer lead and a dummy outer lead in the stacked semiconductor package may have substantially the same shape.

Abstract: A method of manufacturing a semiconductor module is provided. A semiconductor package is formed, having one or more plate units which are bent by heat. The semiconductor package is aligned on a module substrate, and connection members are disposed between the semiconductor package and the module substrate. Heat is applied to the plate units and the connection members to extend a distance between the module substrate and the semiconductor package, and connection patterns are formed. The height of the connection patterns is larger than that of the connection members.

Abstract: A semiconductor packaging device is provided. Semiconductor package groups, a side retainer wall, and a filling layer may be located on a base plate. The side retainer wall may be located around the semiconductor package groups. The filling layer may be located between the side retainer wall and the semiconductor package groups.

Abstract: A semiconductor device includes a semiconductor package, a circuit board and an interval maintaining member. The semiconductor package has a body and a lead protruded from the body. The circuit board has a first land electrically connected to the lead. The interval maintaining member is interposed between the circuit board and the body. The interval maintaining member maintains an interval between the lead and the first land. Thus, an interval between the lead and the land is uniformly maintained, so that a thermal and/or mechanical reliability of the semiconductor device is improved.

Abstract: A polyethylene terephthalate monofilament obtained by spinning a polyethylene terephthalate chip having an intrinsic viscosity of 0.8 to 1.3, which gives a stress-strain curve exhibiting an elongation of less than 2.5% at an initial stress of 2.0 g/d, with an initial modulus value of 80 to 160 g/d, an elongation of 7.5% or less in a stress range of from 2.0 g/d to 9.0 g/d, and an elongation of at least 2.0% or more in a stress range of from 10.0 g/d to the point of break, is provided.

Abstract: A semiconductor device includes a semiconductor package, a circuit board and an interval maintaining member. The semiconductor package has a body and a lead protruded from the body. The circuit board has a first land electrically connected to the lead. The interval maintaining member is interposed between the circuit board and the body. The interval maintaining member maintains an interval between the lead and the first land. Thus, an interval between the lead and the land is uniformly maintained, so that a thermal and/or mechanical reliability of the semiconductor device is improved.

Abstract: An apparatus for electroless plating includes a plating bath containing an aqueous metal salt solution, and a magnetic field generator for generating a magnetic field. An object to be plated is immersed in the solution. The magnetic field generated by the magnetic field generator increases the level at which the metal ions are attracted to a surface of the object. Therefore, a layer of plating of good quality may be formed at a rapid rate.

Abstract: Highly porous acicular mullite bodies are prepared. A green body containing mullite precursors and a porogen is formed using a wet method. The green body is heated to sequentially remove any binder, the porogen and calcine it. The calcined body is mullitized. The process formed a calcined body that has excellent strength and can be handled easily. The mullitized body has very high porosity, small pores and has excellent fracture strength.

Abstract: An organic additive is removed from a ceramic honeycomb by an improved method by contacting each end of the extruded honeycomb with a member that has a gas permeability no greater than the outer wall, the member essentially covering the ends and heating the honeycomb to a temperature sufficient to remove the organic additive.

Abstract: A semiconductor module including a module body and a shock absorbing member on an exposed surface of the module body is provided. The module body may include at least one semiconductor package on a substrate and the exposed surface of the module body may include exposed surfaces of the substrate and the at least one semiconductor package. In accordance with example embodiments, the module body may also include a heat transfer member on the at least one semiconductor package and an exposed surface of the module body may include an exposed surface of the heat transfer member.

Abstract: A semiconductor package and associated methods, the semiconductor package including a substrate including a socket, and connection terminals including a solder ball and a supporting portion extending from the solder ball into the socket.