Abstract: A method of correcting distortion caused by fingerprint input sensors of heterogeneous fingerprint recognition systems. The method includes a first step of fabricating a measurement pattern for measuring resolutions of a fingerprint input sensor, a second step of measuring image resolutions of an image, acquired by the fingerprint input sensor, using the fabricated measurement pattern for predetermined locations and directions, a third step of designing control lines for compensating for the distortion caused by the fingerprint input sensor, based on the measured resolutions, a fourth step of obtaining average horizontal and vertical resolutions of the acquired image, a fifth step of modeling the control lines based on a ratio of the average horizontal resolution to the vertical average resolution, and a sixth step of compensating for the distortion of the acquired image based on results of the modeling.

Abstract: The present invention relates to modified geopolymer compositions, geopolymer-coated organic polymer substrates, and methods of manufacturing and articles comprising same.

Abstract: A lead frame unit, a semiconductor package having a lead frame unit, a stacked semiconductor package having a semiconductor package, and methods of manufacturing the same are provided. The lead frame unit in a stacked semiconductor package may include a die pad supporting a semiconductor chip, an inner lead electrically connected to the semiconductor chip, an outer lead extending from the inner lead, and a heat-resistant insulation member surrounding the connection portion. The outer lead may include a connection portion connected to the inner lead and a junction portion connected to the connection portion and a circuit board. An external signal may be applied to the junction portion. If the lead frame unit is used in the stacked semiconductor package, the outer lead and a dummy outer lead in the stacked semiconductor package may have substantially the same shape.

Abstract: A method of manufacturing a semiconductor module is provided. A semiconductor package is formed, having one or more plate units which are bent by heat. The semiconductor package is aligned on a module substrate, and connection members are disposed between the semiconductor package and the module substrate. Heat is applied to the plate units and the connection members to extend a distance between the module substrate and the semiconductor package, and connection patterns are formed. The height of the connection patterns is larger than that of the connection members.

Abstract: A semiconductor packaging device is provided. Semiconductor package groups, a side retainer wall, and a filling layer may be located on a base plate. The side retainer wall may be located around the semiconductor package groups. The filling layer may be located between the side retainer wall and the semiconductor package groups.

Abstract: A semiconductor device includes a semiconductor package, a circuit board and an interval maintaining member. The semiconductor package has a body and a lead protruded from the body. The circuit board has a first land electrically connected to the lead. The interval maintaining member is interposed between the circuit board and the body. The interval maintaining member maintains an interval between the lead and the first land. Thus, an interval between the lead and the land is uniformly maintained, so that a thermal and/or mechanical reliability of the semiconductor device is improved.

Abstract: A polyethylene terephthalate monofilament obtained by spinning a polyethylene terephthalate chip having an intrinsic viscosity of 0.8 to 1.3, which gives a stress-strain curve exhibiting an elongation of less than 2.5% at an initial stress of 2.0 g/d, with an initial modulus value of 80 to 160 g/d, an elongation of 7.5% or less in a stress range of from 2.0 g/d to 9.0 g/d, and an elongation of at least 2.0% or more in a stress range of from 10.0 g/d to the point of break, is provided.

Abstract: A semiconductor device includes a semiconductor package, a circuit board and an interval maintaining member. The semiconductor package has a body and a lead protruded from the body. The circuit board has a first land electrically connected to the lead. The interval maintaining member is interposed between the circuit board and the body. The interval maintaining member maintains an interval between the lead and the first land. Thus, an interval between the lead and the land is uniformly maintained, so that a thermal and/or mechanical reliability of the semiconductor device is improved.

Abstract: An apparatus for electroless plating includes a plating bath containing an aqueous metal salt solution, and a magnetic field generator for generating a magnetic field. An object to be plated is immersed in the solution. The magnetic field generated by the magnetic field generator increases the level at which the metal ions are attracted to a surface of the object. Therefore, a layer of plating of good quality may be formed at a rapid rate.

Abstract: Highly porous acicular mullite bodies are prepared. A green body containing mullite precursors and a porogen is formed using a wet method. The green body is heated to sequentially remove any binder, the porogen and calcine it. The calcined body is mullitized. The process formed a calcined body that has excellent strength and can be handled easily. The mullitized body has very high porosity, small pores and has excellent fracture strength.

Abstract: An organic additive is removed from a ceramic honeycomb by an improved method by contacting each end of the extruded honeycomb with a member that has a gas permeability no greater than the outer wall, the member essentially covering the ends and heating the honeycomb to a temperature sufficient to remove the organic additive.

Abstract: A semiconductor module including a module body and a shock absorbing member on an exposed surface of the module body is provided. The module body may include at least one semiconductor package on a substrate and the exposed surface of the module body may include exposed surfaces of the substrate and the at least one semiconductor package. In accordance with example embodiments, the module body may also include a heat transfer member on the at least one semiconductor package and an exposed surface of the module body may include an exposed surface of the heat transfer member.

Abstract: A semiconductor package and associated methods, the semiconductor package including a substrate including a socket, and connection terminals including a solder ball and a supporting portion extending from the solder ball into the socket.

Abstract: Example embodiments may be directed to a printed circuit board having an insulating substrate, pads disposed on the surface of the insulating substrate, a solder resist, and a solder moving portion. Leads of a semiconductor package may be mounted on the insulating substrate. The pads to which the leads of the semiconductor package are connected may be disposed on the surface of the insulating substrate. The solder resist layer may cover the insulating substrate, but may also contain openings exposing at least a portion of the pads to which the leads of the semiconductor package are connected. During the process by which each semiconductor lead is connected to a pad, the solder moving portion on the pad may allow an adhesion solder coating each of the leads of the semiconductor package to move towards a shoulder portion of the semiconductor package leads.

Abstract: A supporting apparatus for a display device is provided. The apparatus includes a hanger assembly and a supporter assembly. The hanger assembly allows an upper side and a lower side of the display device to move back and forth with the display device fixed. The supporter assembly on which the hanger assembly is mounted and whose horizontal width is controlled to adjust a position of the hanger assembly.

Abstract: A porous mullite composition is made by Forming a mixture of one or more precursor compounds having the elements present in mullite (e.g., clay, alumina, silica) and a property enhancing compound. The property enhancing compound is a compound having an element selected from the group consisting of Mg, Ca, Fe, Na, K, Ce, Pr, Nd, Sm, Eu, Gd, Th, Dy, Ho, Er, Tm, Yb, Lu, B, Y, Sc, La and combination thereof. The mixture is shaped and to form a porous green shape which is heated under an atmosphere having a fluorine containing gas to a temperature sufficient to form a mullite composition comprised substantially of acicular mullite grains that are essentially chemically bound.

Abstract: An improved coating composition including a polymeric component and synthetic clay. The coating composition is particularly useful for coating a polymeric substrate, such as a styrenic polymeric substrate. One particular preferred application involves coating a closed cell foam extruded styrenic polymeric insulation panel with the coating composition, thereby realizing attractive barrier properties and optical characteristics from the coating.

Abstract: A PCB can include an insulating member, a cooling member, and a circuit pattern. The cooling member can be built into the insulating member. The cooling member can have a cooling passageway through which a cooling fluid can flow. The circuit pattern can be formed on the insulating member. Thus, high heat in the circuit pattern can be rapidly dissipated by the cooling fluid flowing through the cooling passageway.

Abstract: A method for removing dissolved contaminants from solution using a surface-activated crystalline titanium oxide product having a high adsorptive capacity and a high rate of adsorption with respect to dissolved contaminants, in particular, arsenate and arsenite. Preferably, the titanium oxide product includes crystalline anatase having primary crystallite diameters in the range of 1-30 nm. The surface-activated titanium oxide is combined with other filter media to further improve the removal of dissolved contaminants.

Abstract: A porous mullite composition is made by forming a mixture of one or more precursor compounds having the elements present in mullite (e.g., clay, alumina, silica) and a property enhancing compound. The property enhancing compound is a compound having an element selected from the group consisting of Mg, Ca, Fe, Na, K, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, B, Y, Sc, La and combination thereof. The mixture is shaped and to form a porous green shape which is heated under an atmosphere having a fluorine containing gas to a temperature sufficient to form a mullite composition comprised substantially of acicular mullite grains that are essentially chemically bound.