Patents by Inventor Chan Lim

Chan Lim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Current collector for battery comprising metal mesh layer and manufacturing method therefor
    Patent number: 10276873
    Abstract: Provided are a current collector for a battery, including: a base material; adhesive layers positioned on the base material; and metal mesh layers positioned on the adhesive layers, in which the metal mesh layer includes a plurality of metal mesh patterns, and holes positioned between the metal mesh patterns, and a method of manufacturing the same. An active material is applied onto the metal mesh layer through the holes of the metal mesh layer, and thus a contact area of the metal mesh layer and the active material is increased, so that it is possible to restrict the active material from being deintercalated from the current collector and improve a cycle lifespan property of a battery.
    Type: Grant
    Filed: April 22, 2013
    Date of Patent: April 30, 2019
    Assignee: KOREA INSTITUTE OF MACHINERY & MATERIALS
    Inventors: Man Kim, Joo Yul Lee, Sang Yeoul Lee, Yong Soo Jeong, Do Yon Chang, Kyu Hwan Lee, Cheol Nam Yang, Chang Rae Lee, Seong Bong Yim, Dong Chan Lim, Jae Hong Lim, Young Sup Song, Sung Mo Moon, Su Sub Cha
  • Device and method for generating channel letters
    Patent number: 10220426
    Abstract: The disclosure provides a method and apparatus for forming a channel letter box using a profile. The method can include determining an incision position on one surface of the profile where at least one surface incision is to be made. The profile can be surface incised at the determined position. The profile can be folded at the incision position to form the channel letter box. The profile can have at least one rib on one surface. The method can also include cutting and attaching a top plate to the channel letter box, wherein a thickness of the top plate is substantially close to a distance from the top of the profile to the top of a top rib of the at least one rib.
    Type: Grant
    Filed: April 21, 2015
    Date of Patent: March 5, 2019
    Assignees: SEOUL LASER DIEBOARD SYSTEM CO., LTD, SEOUL LASER DIEBOARD SYSTEM CO., LTD LLP
    Inventor: Kyong-Chan Lim
  • SEMICONDUCTOR DEVICES, SEMICONDUCTOR PACKAGES, AND METHODS OF MANUFACTURING THE SEMICONDUCTOR DEVICES
    Publication number: 20190027450
    Abstract: A semiconductor device includes a conductive component on a substrate, a passivation layer on the substrate and including an opening that exposes at least a portion of the conductive component, and a pad structure in the opening and located on the passivation layer, the pad structure being electrically connected to the conductive component. The pad structure includes a lower conductive layer conformally extending on an inner sidewall of the opening, the lower conductive layer including a conductive barrier layer, a first seed layer, an etch stop layer, and a second seed layer that are sequentially stacked, a first pad layer on the lower conductive layer and at least partially filling the opening, and a second pad layer on the first pad layer and being in contact with a peripheral portion of the lower conductive layer located on the top surface of the passivation layer.
    Type: Application
    Filed: January 12, 2018
    Publication date: January 24, 2019
    Inventors: Ju-il Choi, Kwang-jin Moon, Ju-bin Seo, Dong-chan Lim, Atsushi Fujisaki, Ho-jin Lee
  • ADDING CUTTING STATIONS TO BENDING SYSTEMS
    Publication number: 20180244011
    Abstract: A system for generating rules inserted into at least one pattern board including: a controller configured to generate at least one shape diagram, the controller also configured to determine number and measurement of crease rules to be generated based on the at least one shape diagram; a cutting station configured to receive and cut a first crease rule into the number and measurement of the crease rules; and a sorter configured to receive the crease rules from the cutting station and sort the crease rules according to the measurement of the crease rules, wherein the sorted crease rules are inserted into each of the at least one pattern board along with a cutting rule shaped by each of at least one bender.
    Type: Application
    Filed: February 27, 2018
    Publication date: August 30, 2018
    Inventor: Kyong Chan LIM
  • DIEBOARD PADDING
    Publication number: 20180236683
    Abstract: Applying padding material around shaped cutting blades includes: receiving a blade shape diagram and a rule of blade; bending the rule of blade according to the blade shape diagram to produce the shaped cutting blades; and applying the padding material around the shaped cutting blades using the blade shape diagram to produce a padded shaped cutting blade, wherein the padding material provides a spring action to quickly detach the shaped cutting blades from a plate matter.
    Type: Application
    Filed: February 23, 2018
    Publication date: August 23, 2018
    Inventor: Kyong Chan LIM
  • METHOD AND DEVICE FOR TRANSMITTING SIGNAL IN COMMUNICATION SYSTEM SUPPORTING MULTI-USER ACCESS
    Publication number: 20180205591
    Abstract: Disclosed is a 5G or pre-5G communication system to be provided so as to support a data transmission rate higher than that of a 4G communication system such as long term evolution (LTE). According to the present disclosure, a method for transmitting a signal in a communication system supporting multi-user access comprises the steps of: transmitting, to a receiving device, information indicating a codebook formed on the basis of at least two signal constellations for sparse code multiple access (SCMA) transmissions; and transmitting signals on the basis of the codebook, wherein the at least two signal constellations are generated on the basis of energy values of symbols of a pre-given mother signal constellation and sizes of the symbols of the mother signal constellation.
    Type: Application
    Filed: July 27, 2016
    Publication date: July 19, 2018
    Inventors: Woo-Wan WANG, Hyeon-Cheol PARK, Seung-Chan LIM, Sang-Wook SUH
  • HEATING WIRE AND PLANAR HEATING SHEET INCLUDING THE SAME
    Publication number: 20180199400
    Abstract: The present invention relates to a planar heating sheet, including a linear heating member including a single fiber body and a plurality of heating wires surrounding the single fiber body, wherein the heating wire includes a metal wire, an organic compound layer applied on the metal wire, and a metal oxide layer applied on the organic compound layer. Since the planar heating sheet is realized by a plurality of linear heating members each formed by coating a single fiber body with heating wires, each including a metal nanowire, an organic compound layer applied on the metal nanowire, and a metal oxide layer applied on the organic compound layer, this planar heating sheet can be naturally folded or bent like a general woven fabric, and thus can be used in a wide range.
    Type: Application
    Filed: June 9, 2017
    Publication date: July 12, 2018
    Applicant: Korea Institute of Machinery & Materials
    Inventors: Dong Chan LIM, Ki Hyon HONG, Min Kyung KIM, Jae Hong LIM, Jae Hoon JEONG, Sung Mook CHOI, Joo Yul LEE
  • SEMICONDUCTOR MEMORY DEVICE AND METHOD OF OPERATING THE SAME
    Publication number: 20180190356
    Abstract: Provided herein may be a semiconductor memory device and a method of operating the same. The semiconductor memory device may include a plurality of pages each including a plurality of memory cells, peripheral circuits configured to perform a program operation of a selected page among the plurality of pages and a control logic configured to control the peripheral circuits such that a main program operation is performed on the selected page and, when the main program operation is completed, a compensation program operation is performed on memory cells having lower threshold voltage retention characteristics compared to remaining memory cells, among the memory cells included in the selected page.
    Type: Application
    Filed: July 17, 2017
    Publication date: July 5, 2018
    Applicant: SK hynix Inc.
    Inventors: Hye Lyoung LEE, Bong Hoon LEE, Chan LIM
  • REVERSE LIQUIFORM CHANNEL LETTER
    Publication number: 20180182265
    Abstract: Methods and apparatus for allowing a light beam to shine through top front and top sides of a channel letter while substantially reducing dark spots on a front surface of the channel letter, including: forming the channel letter using a profile with at least one rib; coupling a face plate to a position above the at least one rib, wherein the face plate is formed to allow the light beam to shine through the top front and the top sides; and filling a space above the face plate with a resin material after the channel letter including the face plate is flipped over.
    Type: Application
    Filed: December 21, 2017
    Publication date: June 28, 2018
    Inventor: Kyong Chan LIM
  • LIQUIFORM CHANNEL LETTER
    Publication number: 20180182266
    Abstract: Methods and apparatus for substantially reducing dark spots on a front surface of a channel letter, including: forming a channel letter using a profile with at least one rib, the profile having a top and a bottom; coupling a face plate to the at least one rib; and filling a space between the face plate and the top of the profile with a resin material.
    Type: Application
    Filed: December 21, 2017
    Publication date: June 28, 2018
    Inventor: Kyong Chan LIM
  • CUT-CREASE RULE FOR DIEBOARD
    Publication number: 20180178477
    Abstract: A rule to be inserted into a die-board that is pressed onto a plate matter, the rule including: a multi-edge cutting blade having a cutting blade edge, the cutting blade edge divided into multiple sections with multiple spacings between the multiple sections; and a plurality of connecting pieces configured to fit into the multiple spacings and to provide support for the multiple sections of the cutting blade edge when the rule is pressed onto the plate matter.
    Type: Application
    Filed: December 20, 2017
    Publication date: June 28, 2018
    Inventor: Kyong Chan LIM
  • REMOVAL OF METAL
    Publication number: 20180138033
    Abstract: Methods of removing metal from a portion of a substrate include exposing the substrate to a reducing environment comprising at least one reducing agent and at least one oxidizing agent, determining whether metal remaining on the portion of the substrate is less than or equal to a particular level, and exposing the substrate to an oxidizing environment comprising at least one oxidizing agent and at least one reducing agent if the metal remaining on the portion of the substrate is deemed to be greater than the particular level.
    Type: Application
    Filed: January 11, 2018
    Publication date: May 17, 2018
    Applicant: MICRON TECHNOLOGY, INC.
    Inventors: Brian Dolan, Robert J. Hanson, Chan Lim
  • ELECTROPLATING APPARATUS AND ELECTROPLATING METHOD
    Publication number: 20180119302
    Abstract: An electroplating apparatus includes an electroplating bath including an anode installed therein and a plating solution received therein, a substrate holder configured to hold a substrate to be submerged into the plating solution and including a support surrounding the substrate and a cathode on the support to be electrically connected to a periphery of the substrate, a magnetic field generating assembly provided in the support and including at least one electromagnetic coil extending along a circumference of the substrate, and a power supply configured to current to the electromagnetic coil.
    Type: Application
    Filed: October 30, 2017
    Publication date: May 3, 2018
    Inventors: Dong-Chan LIM, Kwang-Jin MOON, Byung-Lyul PARK, Nae-In LEE, Ho-Jin LEE
  • Crosslinked composition comprising ethylene vinyl acetate copolymer and nitrile rubber
    Publication number: 20180100059
    Abstract: A crosslinked composition for use as a sheath layer of cable is obtained from polymer blend having ethylene vinyl acetate copolymer (EVA), nitrile rubber (NBR) and crosslinking agent. The polymer blend further has a reactive polymer containing at least one nucleophilic or electrophilic functional group and a reactive compound selected from amphiphilic compound containing at least one nucleophilic or electrophilic functional group that can chemically react with nucleophilic or electrophilic functional group of the reactive polymer.
    Type: Application
    Filed: October 3, 2017
    Publication date: April 12, 2018
    Inventors: Dae-Up AHN, Jong-Chan LIM
  • PREPARING HOLES ON RULES OR PROFILES USED FOR CHANNEL LETTERS
    Publication number: 20180050381
    Abstract: Preparing holes on rules or profiles used for a channel letter includes: determining a type of the holes to be prepared on the rules or profiles, wherein the type of holes determines a placement of the holes along at least a vertical direction of the rules or profiles; determining and measuring positions along a longitudinal direction for the holes to be prepared on the rules or profiles; making the holes at the positions along the longitudinal direction; and bending the rules or profiles into the channel letter.
    Type: Application
    Filed: June 21, 2017
    Publication date: February 22, 2018
    Inventor: Kyong Chan Lim
  • Removal of metal
    Patent number: 9887077
    Abstract: Methods of removing metal from a portion of a substrate are useful in integrated circuit fabrication. Methods include exposing the substrate to an oxidizing environment comprising at least one oxidizing agent and at least one reducing agent, determining whether metal remaining on the portion of the substrate is less than or equal to a particular level, and if the metal remaining on the portion of the substrate is deemed to be greater than the particular level, exposing the substrate to a reducing environment comprising at least one reducing agent and at least one oxidizing agent.
    Type: Grant
    Filed: March 15, 2016
    Date of Patent: February 6, 2018
    Assignee: Micron Technology, Inc.
    Inventors: Brian Dolan, Robert J. Hanson, Chan Lim
  • Multi-layered noise absorbing and insulating material having air-permeability
    Patent number: 9855902
    Abstract: A multi-layered noise absorbing and insulating material includes a noise insulation material having opposing first and second major surfaces. The noise insulation material includes an adhesive resin including an air permeability-forming material. A first noise absorption material is adhered to the first major surface of the noise insulation material. A second noise absorption material is adhered to the second major surface of the noise insulation material. The multi-layered noise insulation absorbing and insulating material has air-permeability.
    Type: Grant
    Filed: August 25, 2015
    Date of Patent: January 2, 2018
    Assignees: HYUNDAI MOTOR COMPANY, IKSUNG CO., LTD.
    Inventors: Min Su Kim, Jae Chan Lim, Ki Wook Yang, Kue Seok Kang, Bong Jik Lee
  • SHARP ANGLE NOTCHING MARKS
    Publication number: 20170348749
    Abstract: Making a plurality of notching marks on flanges of a rule to enable bending of the rule, including: punching the plurality of notching marks on the flanges of the rule to enable shaping of the rule into a channel letter; and tapering the flanges positioned around sharp notching angles made on the channel letter.
    Type: Application
    Filed: June 5, 2017
    Publication date: December 7, 2017
    Inventor: Kyong Chan Lim
  • MELT-BLOWN FIBER WEB WITH IMPROVED CONCENTRATION FORCE AND ELASTICITY AND METHOD AND APPARATUS FOR MANUFACTURING THE SAME
    Publication number: 20170342615
    Abstract: Disclosed is a melt-blown fiber web with improved concentration force and elasticity, whereby a melt-blown fabric is cut and sealed at predetermined intervals using knives having arbitrary patterns so that concentration force and elasticity of the melt-blown fiber web can be improved without degrading the inherent function of the fiber web. Further disclosed are a method and apparatus for manufacturing the melt-blown fiber web. The melt-blown fiber web includes thermoplastic filaments, wherein cutting portions and sealing portions are arranged on top and bottom surfaces of the fiber web at predetermined intervals along a thickness of the fiber web so that a concentration force and elasticity of the fiber web are improved.
    Type: Application
    Filed: August 8, 2017
    Publication date: November 30, 2017
    Inventors: Min Su Kim, Jung Wook Lee, Jae Chan Lim, Won Jin Seo, Hyeon Ho Kim, Jong Hyuk Cha, Ki Wook Yang, Bong Jik Lee
  • Semiconductor device and method of fabricating the same
    Patent number: 9831164
    Abstract: A semiconductor device includes a via structure and a conductive structure. The via structure has a surface with a planar portion and a protrusion portion. The conductive structure is formed over at least part of the planar portion and not over at least part of the protrusion portion of the via structure. For example, the conductive structure is formed only onto the planar portion and not onto any of the protrusion portion for forming high quality connection between the conductive structure and the via structure.
    Type: Grant
    Filed: February 1, 2013
    Date of Patent: November 28, 2017
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kwang-jin Moon, Pil-kyu Kang, Dae-lok Bae, Gil-heyun Choi, Byung-lyul Park, Dong-chan Lim, Deok-young Jung