Abstract: An apparatus for sharing contents includes: a touch screen to sense a user's touch input for one or more contents; a processor to detect the user's touch input, and generate a transmission image according to instructions corresponding to the detected user's touch input to share the one or more contents with an external device; and a communication unit to establish connection with the external device, and transmit the transmission image to the external device, where the processor is configured to display a device list including an area corresponding to the external device, connect the apparatus to the external device according to a user input of dragging a first content of the one or more contents and dropping the first content onto an area corresponding to the external device on the device list, generate the transmission image, and transmit the transmission image to the external device through the communication unit.

Abstract: Method for identifying a bacterial infection The present application concerns a method for identifying the nature of a bacterial infection from a peritoneal sample, in particular, whether it is a Gram-negative or Gram-positive infection, based upon the determination of one or more cellular and/or humoral markers in a sample.

Abstract: An electronic device includes a display member rotatably coupled to a base member. A touchpad is located on a working surface of the base member. The touchpad includes a first touch area, a second touch area, and a third touch area. When the first touch area detects a palm touch gesture, the first touch area is disabled from sensing and recognizing any touch gestures and the second touch area and the third touch area are enabled to sense and recognize touch gestures. A human-computer interaction method is also disclosed.

Abstract: A charge system includes a main body and a wireless keyboard removably mounted on the main body. The wireless keyboard includes a connecting module, a battery charge module, a detecting module and a solar charge module. When the wireless keyboard is mounted on the main body, the main body charges the wireless keyboard, and the battery charge module is charged by the main body. When the wireless keyboard is removed from the main body, the detecting module detects an energy dump of the battery charge module. When the energy dump is not lower than a preset energy, the wireless keyboard is powered by the battery charge module. When the dump energy is lower than the preset energy, the solar charge module powers the wireless keyboard. The patent further discloses a charge method.

Abstract: A microelectronic component package includes a plurality of electrical leads which are coupled to a microelectronic component and which have exposed lengths extending outwardly beyond a peripheral edge of an encapsulant. A plurality of terminals may be positioned proximate a terminal face of the encapsulant and these terminals may be electrically coupled to the same leads. This can facilitate connection of the microelectronic component to a substrate using the leads as a conventional leaded package. The terminals, however, can facilitate stacking of the leaded package with one or more additional microelectronic components, e.g., a BGA package.

Abstract: Methods for forming an edge contact on a die and edge contact structures are described. The edge contacts on the die do not increase the height of the die. The edge contacts are positioned on the periphery of a die. The edge contacts are positioned in the saw streets. Each edge contact is connected to one bond pad of each die adjacent the saw street. The edge contact is divided into contacts for each adjacent die when the dies are separated. In an embodiment, a recess is formed in the saw street. In an embodiment, the recess is formed by scribing the saw street with a mechanical cutter. The recess is patterned and contact material is deposited to form the edge contacts.

Abstract: The present invention is to provide a water-and-dust proof structure for a notebook computer heat sink having a chip set and a heat sink module, characterized by comprising (between the chip set and the heat sink module): a separation plate comprising a receptacle having a prescribed hole therein, the separation plate cooperating with a casing of the notebook computer to form a space inside the notebook computer so that the heat sink module and the chip set on the main board of the notebook computer are separatedly located in different spaces inside the notebook computer and closely contact each other through the receptacle of the separation plate; a resilient frame formed to cooperate with the receptacle of the separation plate and having a prescribed hole therein; a resilient piece formed to cooperated with the prescribed hole and having multiple resilient curve portions; and arranging the resilient frame into the receptacle of the separation plate, the heat sink module cooperating with the resilient piece

Abstract: Methods of forming a semiconductor assembly are described which include a leadframe with leads having offset portions exposed at an outer surface of a material package to form a grid array. An electrically conductive compound, such as solder, may be disposed or formed on the exposed lead portions to form a grid array such as a ball grid array (“BGA”) or other similar array-type structure of dielectric conductive elements. The leads may have inner bond ends including a contact pad thermocompressively bonded to a bond pad of the semiconductor chip to enable electrical communication therewith and a lead section with increased flexibility to improve the thermocompressive bond. The inner bond ends may also be wirebonded to the bond pads.

Abstract: The present invention is to provide a water-and-dust proof structure for a notebook computer heat sink having a chip set and a heat sink module, characterized by comprising (between the chip set and the heat sink module): a separation plate comprising a receptacle having a prescribed hole therein, the separation plate cooperating with a casing of the notebook computer to form a space inside the notebook computer so that the heat sink module and the chip set on the main board of the notebook computer are separatedly located in different spaces inside the notebook computer and closely contact each other through the receptacle of the separation plate; a resilient frame formed to cooperate with the receptacle of the separation plate and having a prescribed hole therein; a resilient piece formed to cooperated with the prescribed hole and having multiple resilient curve portions; and arranging the resilient frame into the receptacle of the separation plate, the heat sink module cooperating with the resilient piece

Abstract: A support structure for a semiconductor device with peripherally disposed contacts includes a support substrate and at least one conductive column protruding from the support substrate. The at least one conductive column is configured to contact an outer connector on a peripheral edge of a semiconductor device that may be carried by the support structure. Optionally, the at least one conductive column may engage a feature of (e.g., a recess in) the peripherally disposed outer connector. The at least one conductive column may facilitate alignment of one or more semiconductor devices with the support substrate alignment of semiconductor devices relative to one another, or electrical connection between multiple semiconductor devices of other components.

Abstract: A semiconductor device package includes outer connectors that are located along at least one peripheral edge thereof and that extend substantially across the height of the peripheral edge. Each outer connector is formed by forming a conductive via that extends substantially through a substrate blank and laterally across a street located adjacent to an outer periphery of at least one semiconductor device. Upon severing the substrate along the street and through the conductive via, at least one outer connector is formed at an outer edge of the semiconductor device. An outer connector may include a recess that at least partially receives a conductive column protruding from a support substrate. Assemblies may include the packages in stacked arrangement, without height-adding connectors.

Abstract: A method of forming a plug is provided. First, a substrate comprising at least a dielectric layer is provided, and a patterned hard mask is formed on the dielectric layer to define a position of at least a plug hole. Subsequently, the dielectric layer is etched for forming the plug hole. A barrier layer and a conductive layer are formed on the substrate, and the plug hole is filled by the conductive layer. Thereafter, first, second, and third chemical mechanical polishing processes are performed in turn. Finally, a fourth chemical mechanical polishing process is performed to remove portions of the conductive layer.

Abstract: Methods for forming an edge contact on a die and edge contact structures are described. The edge contacts on the die do not increase the height of the die. The edge contacts are positioned on the periphery of a die. The edge contacts are positioned in the saw streets. Each edge contact is connected to one bond pad of each die adjacent the saw street. The edge contact is divided into contacts for each adjacent die when the dies are separated. In an embodiment, a recess is formed in the saw street. In an embodiment, the recess is formed by scribing the saw street with a mechanical cutter. The recess is patterned and contact material is deposited to form the edge contacts.

Abstract: Methods of forming a semiconductor assembly are described which include a leadframe with leads having offset portions exposed at an outer surface of a material package to form a grid array. An electrically conductive compound, such as solder, may be disposed or formed on the exposed lead portions to form a grid array such as a ball grid array (“BGA”) or other similar array-type structure of dielectric conductive elements. The leads may have inner bond ends including a contact pad thermocompressively bonded to a bond pad of the semiconductor chip to enable electrical communication therewith and a lead section with increased flexibility to improve the thermocompressive bond. The inner bond ends may also be wirebonded to the bond pads.

Abstract: A method controls a computing device with an security device wherein a first identification information is stored in said computing device and a second identification information is stored in said security device. The computing device has a BIOS program and an operation system program. The method includes the steps of executing said BIOS program of said computer system; fetching said first identification information and said second identification information; comparing said first identification information with said second identification information; and executing said operation system program if said second identification information matches said first identification information.

Abstract: Methods for forming an edge contact on a die and edge contact structures are described. The edge contacts on the die do not increase the height of the die. The edge contacts are positioned on the periphery of a die. The edge contacts are positioned in the saw streets. Each edge contact is connected to one bond pad of each die adjacent the saw street. The edge contact is divided into contacts for each adjacent die when the dies are separated. In an embodiment, a recess is formed in the saw street. In an embodiment, the recess is formed by scribing the saw street with a mechanical cutter. The recess is patterned and contact material is deposited to form the edge contacts.

Abstract: A microelectronic component package includes a plurality of electrical leads which are coupled to a microelectronic component and which have exposed lengths extending outwardly beyond a peripheral edge of an encapsulant. A plurality of terminals may be positioned proximate a terminal face of the encapsulant and these terminals may be electrically coupled to the same leads. This can facilitate connection of the microelectronic component to a substrate using the leads as a conventional leaded package. The terminals, however, can facilitate stacking of the leaded package with one or more additional microelectronic components, e.g., a BGA package.

Abstract: A reversible thermochromic composition with light fastness feature comprises (a) an electron-donating color former, (b) an electron-accepting compound represented by Formula I, 1

Abstract: A process for the preparation of deuterated methylene chloride. The process comprises contacting methylene chloride with an aqueous phase containing deuteroxide ions in the presence of a phase-transfer catalyst.