Patents by Inventor Chan Yu

Chan Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070120247
    Abstract: Methods of forming a semiconductor assembly are described which include a leadframe with leads having offset portions exposed at an outer surface of a material package to form a grid array. An electrically conductive compound, such as solder, may be disposed or formed on the exposed lead portions to form a grid array such as a ball grid array (“BGA”) or other similar array-type structure of dielectric conductive elements. The leads may have inner bond ends including a contact pad thermocompressively bonded to a bond pad of the semiconductor chip to enable electrical communication therewith and a lead section with increased flexibility to improve the thermocompressive bond. The inner bond ends may also be wirebonded to the bond pads.
    Type: Application
    Filed: January 26, 2007
    Publication date: May 31, 2007
    Inventors: Chan Yu, Ser Leng, Low Waf, Chia Poo, Eng Koon
  • Publication number: 20060262507
    Abstract: The present invention is to provide a water-and-dust proof structure for a notebook computer heat sink having a chip set and a heat sink module, characterized by comprising (between the chip set and the heat sink module): a separation plate comprising a receptacle having a prescribed hole therein, the separation plate cooperating with a casing of the notebook computer to form a space inside the notebook computer so that the heat sink module and the chip set on the main board of the notebook computer are separatedly located in different spaces inside the notebook computer and closely contact each other through the receptacle of the separation plate; a resilient frame formed to cooperate with the receptacle of the separation plate and having a prescribed hole therein; a resilient piece formed to cooperated with the prescribed hole and having multiple resilient curve portions; and arranging the resilient frame into the receptacle of the separation plate, the heat sink module cooperating with the resilient piece
    Type: Application
    Filed: March 21, 2006
    Publication date: November 23, 2006
    Applicant: Twinhead International Corp.
    Inventors: Wen-Chan Yu, Shu-Shian Liau
  • Publication number: 20060208350
    Abstract: A support structure for a semiconductor device with peripherally disposed contacts includes a support substrate and at least one conductive column protruding from the support substrate. The at least one conductive column is configured to contact an outer connector on a peripheral edge of a semiconductor device that may be carried by the support structure. Optionally, the at least one conductive column may engage a feature of (e.g., a recess in) the peripherally disposed outer connector. The at least one conductive column may facilitate alignment of one or more semiconductor devices with the support substrate alignment of semiconductor devices relative to one another, or electrical connection between multiple semiconductor devices of other components.
    Type: Application
    Filed: May 8, 2006
    Publication date: September 21, 2006
    Inventors: Chia Poo, Boon Jeung, Low Waf, Chan Yu, Neo Loo, Chua Kwang
  • Publication number: 20060208351
    Abstract: A semiconductor device package includes outer connectors that are located along at least one peripheral edge thereof and that extend substantially across the height of the peripheral edge. Each outer connector is formed by forming a conductive via that extends substantially through a substrate blank and laterally across a street located adjacent to an outer periphery of at least one semiconductor device. Upon severing the substrate along the street and through the conductive via, at least one outer connector is formed at an outer edge of the semiconductor device. An outer connector may include a recess that at least partially receives a conductive column protruding from a support substrate. Assemblies may include the packages in stacked arrangement, without height-adding connectors.
    Type: Application
    Filed: May 8, 2006
    Publication date: September 21, 2006
    Inventors: Chia Poo, Boon Jeung, Low Waf, Chan Yu, Neo Loo, Chua Kwang
  • Publication number: 20060211242
    Abstract: A method of forming a plug is provided. First, a substrate comprising at least a dielectric layer is provided, and a patterned hard mask is formed on the dielectric layer to define a position of at least a plug hole. Subsequently, the dielectric layer is etched for forming the plug hole. A barrier layer and a conductive layer are formed on the substrate, and the plug hole is filled by the conductive layer. Thereafter, first, second, and third chemical mechanical polishing processes are performed in turn. Finally, a fourth chemical mechanical polishing process is performed to remove portions of the conductive layer.
    Type: Application
    Filed: March 17, 2006
    Publication date: September 21, 2006
    Inventors: Chia-Lin Hsu, Chih-Chan Yu, Chien-Chung Huang
  • Publication number: 20060084240
    Abstract: Methods for forming an edge contact on a die and edge contact structures are described. The edge contacts on the die do not increase the height of the die. The edge contacts are positioned on the periphery of a die. The edge contacts are positioned in the saw streets. Each edge contact is connected to one bond pad of each die adjacent the saw street. The edge contact is divided into contacts for each adjacent die when the dies are separated. In an embodiment, a recess is formed in the saw street. In an embodiment, the recess is formed by scribing the saw street with a mechanical cutter. The recess is patterned and contact material is deposited to form the edge contacts.
    Type: Application
    Filed: November 17, 2005
    Publication date: April 20, 2006
    Inventors: Chia Poo, Boon Jeung, Low Waf, Chan Yu, Neo Loo, Eng Koon, Ser Leng, Chua Kwang, So Chung, Ho Seng
  • Publication number: 20050230808
    Abstract: Methods of forming a semiconductor assembly are described which include a leadframe with leads having offset portions exposed at an outer surface of a material package to form a grid array. An electrically conductive compound, such as solder, may be disposed or formed on the exposed lead portions to form a grid array such as a ball grid array (“BGA”) or other similar array-type structure of dielectric conductive elements. The leads may have inner bond ends including a contact pad thermocompressively bonded to a bond pad of the semiconductor chip to enable electrical communication therewith and a lead section with increased flexibility to improve the thermocompressive bond. The inner bond ends may also be wirebonded to the bond pads.
    Type: Application
    Filed: June 16, 2005
    Publication date: October 20, 2005
    Inventors: Chan Yu, Ser Leng, Low Waf, Chia Poo, Eng Koon
  • Publication number: 20050055566
    Abstract: A method controls a computing device with an security device wherein a first identification information is stored in said computing device and a second identification information is stored in said security device. The computing device has a BIOS program and an operation system program. The method includes the steps of executing said BIOS program of said computer system; fetching said first identification information and said second identification information; comparing said first identification information with said second identification information; and executing said operation system program if said second identification information matches said first identification information.
    Type: Application
    Filed: August 13, 2004
    Publication date: March 10, 2005
    Inventors: Tsu-Ti Huang, Ping-Hung Chen, Cheng-Chan Yu, Yuan-Chun Chou, Yen-Hsing Chen
  • Publication number: 20050029668
    Abstract: Methods for forming an edge contact on a die and edge contact structures are described. The edge contacts on the die do not increase the height of the die. The edge contacts are positioned on the periphery of a die. The edge contacts are positioned in the saw streets. Each edge contact is connected to one bond pad of each die adjacent the saw street. The edge contact is divided into contacts for each adjacent die when the dies are separated. In an embodiment, a recess is formed in the saw street. In an embodiment, the recess is formed by scribing the saw street with a mechanical cutter. The recess is patterned and contact material is deposited to form the edge contacts.
    Type: Application
    Filed: August 30, 2004
    Publication date: February 10, 2005
    Inventors: Chia Poo, Boon Jeung, Low Waf, Chan Yu, Neo Loo, Eng Koon, Ser Leng, Chua Kwang, So Chung, Ho Seng
  • Publication number: 20050026325
    Abstract: A microelectronic component package includes a plurality of electrical leads which are coupled to a microelectronic component and which have exposed lengths extending outwardly beyond a peripheral edge of an encapsulant. A plurality of terminals may be positioned proximate a terminal face of the encapsulant and these terminals may be electrically coupled to the same leads. This can facilitate connection of the microelectronic component to a substrate using the leads as a conventional leaded package. The terminals, however, can facilitate stacking of the leaded package with one or more additional microelectronic components, e.g., a BGA package.
    Type: Application
    Filed: August 19, 2004
    Publication date: February 3, 2005
    Inventors: Eng Koon, Low Waf, Chan Yu, Chia Poo, Ser Leng, Zhou Wei
  • Publication number: 20030121448
    Abstract: A reversible thermochromic composition with light fastness feature comprises (a) an electron-donating color former, (b) an electron-accepting compound represented by Formula I, 1
    Type: Application
    Filed: October 17, 2002
    Publication date: July 3, 2003
    Inventors: Peen-Taurn Chen, Chan-Yu Chen, Chung-Hsin Wu, Jen-Yi Chio
  • Patent number: 4967021
    Abstract: A process for the preparation of deuterated methylene chloride. The process comprises contacting methylene chloride with an aqueous phase containing deuteroxide ions in the presence of a phase-transfer catalyst.
    Type: Grant
    Filed: September 9, 1988
    Date of Patent: October 30, 1990
    Assignee: Southern Illinois University Foundation
    Inventors: Cal Y. Meyers, Roch Chan-Yu-King