Abstract: Controlling power consumption at an IHS, including receiving electrical power associated with an initial voltage at a first time; determining that the IHS is to enter a low-power state, and in response: adjusting an UVP parameter for the electrical power from a first voltage to a second voltage, the second voltage less than the first voltage, the second voltage based on the low-power state; adjusting an OCP parameter for the electrical power from a first amperage to a second amperage, the second amperage less than the first amperage, the second amperage based on the low-power state; trimming the initial voltage of the electrical power to a trimmed voltage, the trimmed voltage less the initial voltage and greater than the second voltage; adjusting the power state of the IHS to the low-power state; receiving the electrical power having the trimmed voltage at a second time after the first time.

Abstract: Controlling power consumption at an IHS, including receiving electrical power associated with an initial voltage at a first time; determining that the IHS is to enter a low-power state, and in response: adjusting an UVP parameter for the electrical power from a first voltage to a second voltage, the second voltage less than the first voltage, the second voltage based on the low-power state; adjusting an OCP parameter for the electrical power from a first amperage to a second amperage, the second amperage less than the first amperage, the second amperage based on the low-power state; trimming the initial voltage of the electrical power to a trimmed voltage, the trimmed voltage less the initial voltage and greater than the second voltage; adjusting the power state of the IHS to the low-power state; receiving the electrical power having the trimmed voltage at a second time after the first time.

Abstract: Various embodiments of the present disclosure are directed towards a method for forming an image sensor in which a device layer has high crystalline quality. According to some embodiments, a hard mask layer is deposited covering a substrate. A first etch is performed into the hard mask layer and the substrate to form a cavity. A second etch is performed to remove crystalline damage from the first etch and to laterally recess the substrate in the cavity so the hard mask layer overhangs the cavity. A sacrificial layer is formed lining cavity, a blanket ion implantation is performed into the substrate through the sacrificial layer, and the sacrificial layer is removed. An interlayer is epitaxially grown lining the cavity and having a top surface underlying the hard mask layer, and a device layer is epitaxially grown filling the cavity over the interlayer. A photodetector is formed in the device layer.

Abstract: Disclosed is a method for manufacturing a reinforced synthetic product with a curved geometry, which includes forming a fabric made of at least one filament bundle including a reinforcing fiber material and at least one thermoplastic filament woven with the filament bundle; and combining a heat-formable material with the fabric to form a bendable fabric preform sheet. Also disclosed is a method for manufacturing a reinforced synthetic product with a curved geometry, which includes positioning the bendable fabric preform sheet into a mold with a curved geometry to form a bended fabric preform sheet; and molding the bended fabric preform sheet by heating to form a cured product.

Abstract: An electronic device may include a display having display pixels formed in an active area of the display. The display further includes display driver circuitry for driving gate lines that are routed across the display. A hole such as a through hole, optical window, or other inactive region may be formed within the active area of the display. Multiple gate lines carrying the same signal may be merged together prior to being routed around the hole to help minimize the routing line congestion around the border of the hole. Dummy circuits may be coupled to the merged segment portion to help increase the parasitic loading on the merged segments. The hole may have a tapered shape to help maximize the size of the active area. The hole may have an asymmetric shape to accommodate multiple sub-display sensor components.

Abstract: Various embodiments of the present disclosure are directed towards an integrated chip including an optical device disposed on a substrate. A dielectric structure overlies the substrate. The dielectric structure comprises one or more sidewalls defining a light channel over a region of the optical device. A protective structure is above the optical device and disposed on opposing sides of the light channel.

Abstract: A computer device and a multi-computer system are provided. The computer device includes a central processing unit (CPU), a wireless connection circuit, and a switch circuit. The CPU is coupled to a display to provide an enabling display signal to the display according to a hot plug detection signal provided from the display. The wireless connection circuit receives one of a wireless connection signal and a wireless disconnection signal from a wireless input device. The switch circuit is coupled between the display and the CPU and coupled to the wireless connection circuit. The switch circuit provides the hot plug detection signal to the CPU when the wireless connection circuit receives the wireless connection signal, and masks the hot plug detection signal from the CPU when the wireless connection circuit receives the wireless disconnection signal.

Abstract: A temperature calibration method for an ear thermometer with a probe cover is provided. The temperature calibration method includes: providing the ear thermometer with the probe cover, the ear thermometer including a plurality of activation elements which are configured to sense an infrared transmittance of the probe cover to obtain a measured transmittance value; using the ear thermometer to measure an object to be tested to obtain an uncalibrated temperature; obtaining an infrared radiation energy emitted by the object to be tested, according to the uncalibrated temperature, the measured transmittance value, a preset transmittance value, and a radiation energy measurement formula; and calibrating the uncalibrated temperature to a calibrated temperature, according to a temperature calibration function.

Abstract: An electrical connector includes at least one electrical module, which includes an insulating body and a plurality of transmission modules. Each transmission module includes a terminal assembly and a cable assembly. Each terminal assembly includes two terminals and a shielding shell. Each terminal has a contact portion, a wire connecting portion and an intermediate portion. A first shielding portion of the shielding shell is provided outside the two wire connecting portions of the two terminals, and the first shielding portion is provided with an open area exposing the two wire connecting portions. A conductive sheet is electrically connected to the shielding shells of the terminal assemblies in a same row. The conductive sheet shields the open areas of the shielding shells in the same row. Each first shielding portion and the conductive sheet collectively form a shielding space and are surroundingly provided outside the two corresponding wire connecting portions.

Abstract: An apparatus for removing a photoresist layer from at least one alignment mark of a wafer is provided. The apparatus includes a holder, a solvent dispenser, and a suction unit. The holder is used to support the wafer, wherein the alignment mark is formed in a peripheral region of the wafer. The solvent dispenser is used to spray a solvent onto the photoresist layer on the alignment mark of the wafer to generate a dissolved photoresist layer. The suction unit is used to remove the dissolved photoresist layer and the solvent from the wafer through exhausting.

Abstract: An electronic device and a performance optimization method thereof are provided. The electronic device includes a battery module, a processor, and a controller. The battery module is configured to supply power to the electronic device. The processor has a power limit. The controller is configured to monitor a charging and discharging current of the battery module. In a power connection mode, the controller analyzes a status of the battery module and adjusts the power limit of the processor according to the charging and discharging current.

Abstract: An electronic device is provided. The electronic device includes a substrate; a plurality of inorganic light-emitting diodes disposed on the substrate; a connecting line disposed on the substrate; and a printed circuit board. The plurality of inorganic light-emitting diodes are electrically connected to the printed circuit board through the connecting line. The connecting line includes a first part extending in a first direction and a second part extending in a second direction, and the first direction is different from the second direction. The first part has a first width along the second direction, the second part has a second width along the first direction, and the first width and the second width are different.

Abstract: An electrical connector includes multiple terminals formed by cutting from a metal plate and bending. The portion of the metal plate with the terminals being removed is defined as a base plate. Each terminal has a base portion and an elastic arm connected thereto. The base portion is at least partially horizontally provided to be coplanar to the base plate. A cutting slot is formed between the base plate and the base portion. A through slot is formed between the base plate and the elastic arm. An insulating body is provided with through holes running vertically therethrough. A portion of the cutting slot and the through slot are exposed in a corresponding through hole. The terminals include signal terminals and ground terminals. The base plate forms a connecting portion between the through slot and the cutting slot of each ground terminal to be connected to the ground terminal.

Abstract: A method for increasing power supply voltage in an information handling system in a normal mode with a first peak voltage comprises, in response to receiving a request for a higher peak voltage, an embedded controller (EC) receiving information associated with the application including a request for power at a higher peak voltage, a housekeeping IC communicating a signal to a PWM IC to increase voltage supplied to the information handling system to the higher peak voltage, the PWM IC converting from the PSU to the higher peak voltage and starting a timer with a defined time period. If no additional requests for operating at the higher peak voltage are received before the time period expires, the PWM IC communicates a signal that power will stop being supplied at the higher peak voltage, and the information handling system returns to operating in the normal mode at the first peak voltage.

Abstract: The present disclosure relates to an image sensor integrated chip. The image sensor integrated chip includes a photodiode region disposed within a substrate having a first semiconductor material region. A second semiconductor material region is disposed onto the substrate. A patterned doped layer is arranged between the substrate and the second semiconductor material region. The second semiconductor material region includes a sidewall connecting to a bottom surface of the second semiconductor material region. The sidewall extends through the patterned doped layer. A bottom surface of the second semiconductor material region is directly over the photodiode region.

Abstract: A food temperature measuring device includes a device main body, a signal control module, a temperature measuring module, a light emitting display module, and an information display module. The temperature measuring module is configured for measuring a predetermined food so as to obtain measured temperature information of the predetermined food. The light emitting display module includes a first light emitting unit for providing a first food light message, a second light emitting unit for providing a second food light message, and a third light emitting unit for providing a third food light message. The information display module is configured for displaying a measured temperature value of the measured temperature information obtained by the temperature measuring module. Therefore, the light emitting display module can be configured for providing food category corresponding information corresponding to the predetermined food according to the first, the second, and the third food light message.

Abstract: The present application discloses method for fabricating a conductive feature and a method for fabricating a semiconductor device. The method includes providing a substrate; forming a recess in the substrate; conformally forming a first nucleation layer in the recess; performing a post-treatment to the first nucleation layer; and forming a first bulk layer on the first nucleation layer to fill the recess. The first nucleation layer and the first bulk layer configure the conductive feature. The first nucleation layer and the first bulk layer include tungsten. The post-treatment includes a borane-containing reducing agent.

Abstract: In some embodiments, the present disclosure relates to a display device. The display device includes an isolation structure disposed over a reflector electrode, an additional electrode disposed over the isolation structure, and an optical emitter structure disposed over the additional electrode. A via structure includes a lower horizontal segment disposed on the reflector electrode, a vertical segment extending along a sidewall of the isolation structure, and an upper horizontal segment disposed over the isolation structure. The upper horizontal segment is connected to the lower horizontal segment by the vertical segment.

Abstract: Various embodiments of the present disclosure are directed towards a method for forming an integrated chip the method includes forming a waveguide on a first surface of a substrate. A conductive structure is formed at least partially overlying the waveguide. A light pipe structure is formed over the waveguide. A lower surface of the light pipe structure is disposed between a top surface and a bottom surface of the conductive structure. A lower portion of the light pipe structure contacts the conductive structure.

Abstract: An illumination system including a light source, a wavelength conversion device and a first light-uniforming element is provided. The light source emits an excitation beam. A light wavelength conversion region and a transmission region of the wavelength conversion device sequentially insert on the transmission path of the excitation beam at different time periods. When the light wavelength conversion region inserts on the transmission path of the excitation beam, a conversion beam is provided. When the transmission region inserts on the transmission path of the excitation beam, a non-conversion excitation beam is provided. The non-conversion excitation beam and the conversion beam penetrate the first light-uniforming element to form an illumination beam. The conversion beam is reflected for X time(s) and the non-conversion excitation beam is reflected for Y time(s) on the transmission path between the wavelength conversion device and the first light-uniforming element. A projection apparatus is also provided.