Abstract: Methods and systems for transferring a host image of a first machine to a second machine, such as during disaster recovery or migration, are disclosed. In one example, a first profile of a first machine of a first type is compared to a second profile of a second machine of a second type different from the first type, to which the host image is to be transferred. The first and second profiles each comprise at least one property of the first type of first machine and the second type of second machine, respectively. At least one property of a host image of the first machine is conformed to at least one corresponding property of the second machine. The conformed host image is provided to the second machine, via a network. The second machine is configured with at least one conformed property of the host image.

Abstract: An optical component packaging structure is provided. The optical component packaging structure includes a substrate, a far-infrared sensor chip, a metal covering cap and a light filter. The far-infrared sensor chip is disposed on the substrate and electrically connected to the substrate. The metal covering cap is disposed on the substrate and accommodating the far-infrared sensor chip. The metal covering cap has an opening exposing the far-infrared sensor chip. The light filter is disposed out of the opening and on the inner surface for covering the opening to filter the far-infrared light passing through. The far-infrared sensor chip is surrounded by the metal covering cap, the substrate and the light filter, and the metal covering cap is directly connected with the substrate.

Abstract: A temperature measuring device and a temperature measuring method for providing light spot marks of different colors are provided. The temperature measuring device includes a temperature measuring main body, a signal-providing module, a temperature-sensing module, and a first and a second color projection module. The signal-providing module and the temperature-sensing module are disposed on the temperature measuring main body. The temperature-sensing module is configured for measuring a temperature of a target area of an object. The first color projection module is disposed on the temperature measuring main body, and configured for projecting a first color light beam onto the target area of the object by control of the signal-providing module. The second color projection module is disposed on the temperature measuring main body, and configured for projecting a second color light beam onto the target area of the object by control of the signal-providing module.

Abstract: A temperature calibration method includes providing a temperature measuring device including a movable shutter module, and a first and a second non-contacting temperature sensing module, and a movable shutter structure of the movable shutter module includes a black substance for generating a predetermined heating temperature; moving the movable shutter structure to a first position by driving of the electric control driver, so as to completely block a first temperature-measuring viewing angle of the first non-contacting temperature sensing module and a second temperature-measuring viewing angle of the second non-contacting temperature sensing module by the black substance; measuring the predetermined heating temperature that is generated by the black substance by the second non-contacting temperature sensing module at the second temperature-measuring viewing angle so as to obtain black body temperature information of the black substance; and calibrating the first non-contacting temperature sensing module acco

Abstract: A computer device and a multi-computer system are provided. The computer device includes a central processing unit (CPU), a wireless connection circuit, and a switch circuit. The CPU is coupled to a display to provide an enabling display signal to the display according to a hot plug detection signal provided from the display. The wireless connection circuit receives one of a wireless connection signal and a wireless disconnection signal from a wireless input device. The switch circuit is coupled between the display and the CPU and coupled to the wireless connection circuit. The switch circuit provides the hot plug detection signal to the CPU when the wireless connection circuit receives the wireless connection signal, and masks the hot plug detection signal from the CPU when the wireless connection circuit receives the wireless disconnection signal.

Abstract: An electrical connector includes an insulating body having a mating slot and multiple accommodating slots are in communication with the mating slot. Multiple terminals are accommodated in the accommodating slots. The terminals include ground terminals. Each terminal includes a connecting portion, an elastic arm, a tail portion, and an extending portion located between the connecting portion and the tail portion. The extending portion of each terminal extends obliquely downward and backward from the connecting portion. A grounding member is provided on the insulating body. The grounding member has a multiple upper and lower extending arms. A length of each upper extending arm is shorter than a length of each lower extending arm in the front-rear direction. The upper and lower extending arms respectively abut the ground terminals, thus shortening the transmission paths of the terminals. The grounding member and the ground terminals are in stable connection, thus reducing the resonance.

Abstract: A display may have an array of pixels. Each pixel may have a light-emitting diode such as an organic light-emitting diode. The organic light-emitting diodes may each have an anode that is coupled to a thin-film transistor pixel circuit for controlling the anode. Transparent windows may be formed in the display. The windows may be formed by replacing data storage capacitors and other pixel circuit structures in a subset of the pixels with transparent window structures, by selectively removing portions of light-emitting diode anodes, and by shifting anodes. An array of electrical components such as an array of light sensors may be aligned with the transparent windows and may be used to measure light passing through the transparent windows.

Abstract: A display may have an array of pixels each of which has a light-emitting diode such as an organic light-emitting diode. A drive transistor and an emission transistor may be coupled in series with the light-emitting diode of each pixel between a positive power supply and a ground power supply. The pixels may include first and second switching transistors. A data storage capacitor may be coupled between a gate and source of the drive transistor in each pixel. Signal lines may be provided in columns of pixels to route signals such as data signals, sensed drive currents from the drive transistors, and predetermined voltages between display driver circuitry and the pixels. The switching transistors, emission transistors, and drive transistors may include semiconducting-oxide transistors and silicon transistors and may be n-channel transistors or p-channel transistors.

Abstract: A method of adjusting brightness of a display device is provided. The method includes steps of: generating a synchronization signal having a plurality of periods each of which is a frame time; determining bit values of dithering data according to target brightness data; and determining how many pulse waves in the pulse wave width modulation signal need to be modulated within the frame time according to the bit values of the dithering data, and accordingly modulating widths of the pulse waves of the pulse wave width modulation signal.

Abstract: An electrical connecting assembly includes an electrical connector including a first terminal assembly, and a mating connector including a second terminal assembly. The first terminal assembly includes a first shielding shell covering outside a pair of first signal terminals. Each first signal terminal has a first contact portion. The second terminal assembly includes a second shielding shell covering outside a pair of second signal terminals. Each second signal terminal has a second contact portion. The first shielding shell is provided with at least one naked spacing region. When mating of the electrical connector and the mating connector is complete, the second shielding shell covers outside the first shielding shell and shields the naked spacing region, the first contact portion and the corresponding second contact portion are mated, and at least one of the first and second contact portions is exposed in the naked spacing region.

Abstract: In an embodiment, an apparatus includes: a susceptor including substrate pockets; a gas injector disposed over the susceptor, the gas injector having first process regions, the gas injector including a first gas mixing hub and first distribution valves connecting the first gas mixing hub to the first process regions; and a controller connected to the gas injector and the susceptor, the controller being configured to: connect a first precursor material and a carrier gas to the first gas mixing hub; mix the first precursor material and the carrier gas in the first gas mixing hub to produce a first precursor gas; rotate the susceptor to rotate a first substrate disposed in one of the substrate pockets; and while rotating the susceptor, control the first distribution valves to sequentially introduce the first precursor gas at each of the first process regions as the first substrate enters each first process region.

Abstract: In some embodiments, the present disclosure relates to a method of forming a display device, comprising: forming a first reflector electrode and a second reflector electrode over an interconnect structure, wherein the first reflector electrode is laterally separated from the second reflector electrode; depositing a first isolation layer over the first and second reflector electrodes; forming a first masking layer directly overlying the first reflector electrode; depositing a second isolation layer over the first isolation layer and over the first masking layer; forming a second masking layer over the second isolation layer and directly overlying the second reflector electrode; performing a first removal process to remove portions of the first and second isolation layers that do not directly underlie the first or second masking layers; and performing a second removal process to remove the first and second masking layers.

Abstract: The instant disclosure provides an optical component packaging structure which includes a far-infrared sensor chip, a first metal layer, a packaging housing and a covering member. The far-infrared sensor chip includes a semiconductor substrate and a semiconductor stack structure. The semiconductor substrate has a first surface, a second surface which is opposite to the first surface, and a cavity. The semiconductor stack structure is disposed on the first surface of the semiconductor substrate, and a part of the semiconductor stack structure is located above the cavity. The first metal layer is disposed on the second surface of the semiconductor substrate, the packaging housing is used to encapsulate the far-infrared sensor chip and expose at least a part of the far-infrared sensor chip, and the covering member is disposed above the semiconductor stack structure.

Abstract: An electronic device may include a display and a sensor under the display. The display may include pixels having emission transistors that are controlled by emission signals. The emission signals are controlled using a pulse width modulation (PWM) scheme to control the brightness of the display. The emission signals may further include a localized sensor blackout pulse configured to generate a localized sensor blackout region that overlaps with the sensor to reduce any undesired back emission of light emitted from the display. The sensor blackout pulse may be automatically generated periodically or generated in an on-demand basis once per frame, multiple times per frame time, or once every multiple frames. Any luminance degradation caused by the sensor blackout pulse may be compensated by boosting the luminance and/or by extending the duration of each emission on pulse.

Abstract: A method of forming semiconductor structure includes forming a bit line structure on a substrate, forming a first landing pad material lower than the bit line structure between two adjacent bit line structures, shaping a top surface of the bit line structure to form an edge area of the top surface lower than a center area of the top surface, forming a second landing pad material on the bit line structure and the first landing pad material, and removing at least a portion of the second landing pad material to form a landing pad.

Abstract: A method for detecting defects in a GaN high electron mobility transistor is disclosed. The method includes steps of measuring a plurality of electrical characteristics of a GaN high electron mobility transistor, measuring the plurality of electrical characteristics after performing a deterioration test on the GaN high electron mobility transistor, irradiating the GaN high electron mobility transistor in turns with a plurality of light sources with different wavelengths and measuring the plurality of electrical characteristics after each irradiation of the GaN high electron mobility transistor by each of the plurality of light sources, and comparing changes of the plurality of electrical characteristics measured in the above steps to determine the defect location of the GaN high electron mobility transistor.

Abstract: A temperature-measuring device for detecting moving object trajectories is provided. The temperature-measuring device includes a signal control module, a temperature-sensing module and a motion detection module. The temperature-sensing module is electrically connected to the signal control module, for measuring a temperature of each of a plurality of moving objects in an object temperature-measuring range. The motion detection module is electrically connected to the signal control module, for capturing a motion trajectory of each of the moving objects in an object motion detection range. The object temperature-measuring range is smaller than or equal to the object motion detection range, and the object temperature-measuring range falls entirely within the object motion detection range.

Abstract: Various embodiments of the present disclosure are directed towards a method for forming an image sensor in which a device layer has high crystalline quality. According to some embodiments, a hard mask layer is deposited covering a substrate. A first etch is performed into the hard mask layer and the substrate to form a cavity. A second etch is performed to remove crystalline damage from the first etch and to laterally recess the substrate in the cavity so the hard mask layer overhangs the cavity. A sacrificial layer is formed lining cavity, a blanket ion implantation is performed into the substrate through the sacrificial layer, and the sacrificial layer is removed. An interlayer is epitaxially grown lining the cavity and having a top surface underlying the hard mask layer, and a device layer is epitaxially grown filling the cavity over the interlayer. A photodetector is formed in the device layer.

Abstract: An ear thermometer capable of identifying an infrared transmittance of a probe cover is provided and includes an ear thermometer body, a probe, and a plurality of activation elements. The probe is disposed on the ear thermometer body. A closed end of the probe cover is used for infrared transmittance, and the probe cover has different infrared transmittances according to a thickness variation thereof. The activation elements are disposed on the ear thermometer body and configured to detect the infrared transmittance of the probe cover. Each of the activation elements includes an ON state and an OFF state so that the activation elements are arranged to form different sensor combinations, which respectively correspond to different infrared transmittances, and any two of the different sensor combinations have the two corresponding infrared transmittances that are different from one another.

Abstract: A temperature calibration method for an ear thermometer with a probe cover is provided. The temperature calibration method includes: providing the ear thermometer with the probe cover, the ear thermometer including a plurality of activation elements which are configured to sense an infrared transmittance of the probe cover to obtain a measured transmittance value; using the ear thermometer to measure an object to be tested to obtain an uncalibrated temperature; obtaining an infrared radiation energy emitted by the object to be tested, according to the uncalibrated temperature, the measured transmittance value, a preset transmittance value, and a radiation energy measurement formula; and calibrating the uncalibrated temperature to a calibrated temperature, according to a temperature calibration function.