Abstract: A cotton stuffing machine includes a roller conveyance device, a rotation device, an upward pushing device, and a downward pressing device. The roller conveyance device inputs cotton and presses and pulls the cotton to deliver a cotton section. The rotation device includes a plurality of rotation arms. Each rotation arm has a holding barrel on two ends thereof, and undergoes a 180-degree rotation displacement between a feeding position and an outputting position. The upward pushing device is disposed beneath the feeding position for pushing the cotton section upward into the holding barrel. The downward pressing device is disposed above the outputting position for pushing out the cotton section and inserting it into the bottle. Thus, the present invention improves the efficiency of stuffing operation for stuffing the cotton into the bottles.

Abstract: A novel 3D package configuration is provided by stacking a folded flexible circuit board structure on a package substrate and electrically connected therewith based on the foldable characteristics of the flexible circuit board, and the high temperature resistance of the flexible circuit board which is suitable for insulating layer process, metal layer process, photolithography process, etching and development process, to make conventional semiconductor dies of various functions be bonded on one die and/or two side of a flexible circuit board and electrically connected therewith in advance.

Abstract: A High-Definition Multimedia Interface (HDMI) signal detection method is provided. The HDMI signal detection method may be applied to an apparatus (e.g., a sink device). The HDMI signal detection method may include the following steps. The apparatus may receive input data from a source apparatus through an HDMI standard, wherein the input data comprises a plurality of data sets. Then, the apparatus may compare each data set to a predefined reference pattern according to a slide window with the predefined reference pattern to generate a comparison result. Then, the apparatus may determine whether the total match count corresponding to the comparison result is less than a threshold to determine the HDMI standard corresponding to the input data.

Abstract: A packaging machine structure for wet paper towels having a sterilizing functionality has at least one rolling unit, a cutting unit attached behind the rolling unit, and a packing unit attached behind the cutting unit; a plurality of wet paper towels passing through the rolling unit, the cutting unit, and the packing unit to become a plurality of wet paper towel packs; wherein at least one germicidal lamp is disposed between the rolling unit and the cutting unit to sterilize the wet paper towels.

Abstract: A secure web gateway for a cloud computing environment comprises a data plane component, comprising: a front-end domain name service (DNS) configured to receive an inbound DNS request and map an IP address of the DNS request to a policy identification value corresponding to a customer policy and a plurality of plugin modules utilized by the front-end DNS to process the DNS request according to the mapping of the IP address from which the DNS request originates to the policy identification value. The secure web gateway further comprises a control plane component that provides the customer policy to the front-end DNS and configures the IP address to permit access to a DNS service according to the customer policy.

Abstract: A cotton stuffing machine includes a roller conveyance device, a rotation device, an upward pushing device, and a downward pressing device. The roller conveyance device inputs cotton and presses and pulls the cotton to deliver a cotton section. The rotation device includes a plurality of rotation arms. Each rotation arm has a holding barrel on two ends thereof, and undergoes a 180-degree rotation displacement between a feeding position and an outputting position. The upward pushing device is disposed beneath the feeding position for pushing the cotton section upward into the holding barrel. The downward pressing device is disposed above the outputting position for pushing out the cotton section and inserting it into the bottle. Thus, the present invention improves the efficiency of stuffing operation for stuffing the cotton into the bottles.

Abstract: A novel 3D package configuration is provided by stacking a plurality of semiconductor package units or a folded flexible circuit board structure on a package substrate and electrically connected therewith based on the foldable characteristics of the flexible circuit board, and the high temperature resistance of the flexible circuit board which is suitable for insulating layer process, metal layer process, photolithography process, etching and development process, to make conventional semiconductor dies of various functions be bonded on one die and/or two side of a flexible circuit board and electrically connected therewith in advance.

Abstract: A method of assembling a waterproof structure includes the following operations. Connect a first input/output connector of a circuit board to a first positioning fixture. A first elastic adhesive is combined with a first rigid board. An end of the first positioning fixture away from the first input/output connector is passed out of the first rigid board, and the first input/output connector and the first elastic adhesive are separated on two sides of the first rigid board. The circuit board is arranged in the casing, wherein the first positioning fixture is inserted from the first input/output opening on the first wall inside the casing, so that the first elastic adhesive adheres the first rigid board to the first wall of the casing, and the first elastic adhesive fills a spacing between the first positioning fixture and the first input/output opening.

Abstract: A method to form a transistor device with a recessed gate structure is provided. In one embodiment, a gate structure is formed overlying a device region and an isolation structure. The gate structure separates a device doping well along a first direction with a pair of recess regions disposed on opposite sides of the device region in a second direction perpendicular to the first direction. A pair of source/drain regions in is formed the device region on opposite sides of the gate structure. A sidewall spacer is formed extending along sidewalls of the gate structure, where a top surface of the sidewall spacer is substantially flush with the top surface of the gate structure. A resistive protection layer is then formed on the sidewall spacer and covering the pair of recess regions.

Abstract: A clock control method for a High Definition Multimedia Interface (HDMI) receiver operating in a power-saving mode in a sink device is provided. The HDMI receiver has a first module, a second module, and a third module. The clock control method includes the following stages. A clock signal is enabled to be sent to the first module and the third module during a first region of received data. The clock signal is disabled to be sent to the second module during the first region of the received data. The clock signal is enabled to be sent to the third module and the clock signal is disabled to be sent to the first module and the second module during a second region of the received data.

Abstract: A novel 3D package configuration is provided by stacking a folded flexible circuit board structure on a package substrate and electrically connected therewith based on the foldable characteristics of the flexible circuit board, and the high temperature resistance of the flexible circuit board which is suitable for insulating layer process, metal layer process, photolithography process, etching and development process, to make conventional semiconductor dies of various functions be bonded on one die and/or two side of a flexible circuit board and electrically connected therewith in advance.

Abstract: A method to form a transistor device with a recessed gate structure is provided. In one embodiment, a gate structure is formed overlying a device region and an isolation structure. The gate structure separates a device doping well along a first direction with a pair of recess regions disposed on opposite sides of the device region in a second direction perpendicular to the first direction. A pair of source/drain regions in is formed the device region on opposite sides of the gate structure. A sidewall spacer is formed extending along sidewalls of the gate structure, where a top surface of the sidewall spacer is substantially flush with the top surface of the gate structure. A resistive protection layer is then formed on the sidewall spacer and covering the pair of recess regions.

Abstract: A method of making a triple well isolated diode includes growing an epi-layer over a substrate. The method further includes forming a first isolation feature in the epi layer. The method includes implanting a first well in the epi-layer. The method further includes implanting a second well in the epi-layer, wherein a first isolation feature separates a portion of the second well from a portion of the first well. The method further includes implanting a third well in the epi-layer, wherein a sidewall of third well contacts a sidewall of the second well. The method further includes implanting a deep well in the epi-layer, wherein the deep well extends beneath the first well, the deep well extends underneath a first portion of the second well, and a second portion of the second well extends beyond the deep well in a first direction parallel to a top surface of the substrate.

Abstract: A memory structure includes a first memory array having bit lines; a second memory array having bit lines; a first sense amplifier connected to a first bit line of the first memory array and a first bit line of the second memory array; and a second sense amplifier connected to a second bit line of the first memory array and a second bit line of the second memory array. The second bit line of the first memory array is adjacent to the first bit line of the first memory array, and the second bit line of the second memory array is adjacent to the first bit line of the second memory array.

Abstract: The present invention provides an image sensor module, including an integrated circuit substrate, an image sensing chip, a cover plate and an encapsulating material. The image sensing chip is disposed on the integrated circuit substrate. The image sensing chip includes an image sensing area and a non-image sensing area. A dam is disposed between the cover plate and the non-image sensing area of the image sensing chip. The cover plate includes a transparent material and a cushioning material. The encapsulating material covers the periphery of the image sensing chip, the periphery of the dam, part of the integrated circuit substrate and the periphery of the cover plate. The cushioning material is disposed between the transparent material and the dam and between the transparent material and the encapsulating material. The present invention reduces the possibility that the encapsulating material will peel off the cover plate.

Abstract: In some embodiments, an integrated circuit (IC) device includes an active semiconductor layer, a circuitry formed within the active semiconductor layer, a region including conductive layers formed in a back-end-of-line (BEOL) layer above the active semiconductor layer, and a memory module formed in the BEOL layer. The memory device includes a three-dimensional array of memory cells, each adapted to store a weight value, and adapted to generate at each memory cell a signal indicative of a product between the stored weight value and an input signal applied to the memory cell. The memory module is further adapted to transmit the product signals from the memory cell simultaneously in the direction of the active semiconductor layer.

Abstract: Disclosed is a method for manufacturing an image sensor module. The method comprises the steps of: disposing a glass cover on a substrate; sawing the glass cover into a plurality of glass units; forming an individual solidified interface filler between the adjacent glass units; sawing along the centerline of each solidified interface filler to form a plurality of independent electronic semi-finished products for complementary metal oxide semiconductor image sensor (CMOS Image Sensor, CIS) packaging; and performing an image sensor molded ball grid array (ImBGA) process to obtain the image sensor module.

Abstract: A method of preventing drippage in a liquid dispensing system includes generating at least a first proxy signal representing at least a first indirect measure of a position of a first automatic control valve (ACV), wherein the first ACV has positions ranging from fully closed to fully open. The method further includes recognizing, based on at least the first proxy signal, whether a failure state exists in which the first ACV has failed to close. The method further includes causing a second ACV to close when the failure state exists, wherein the second ACV is fluidically connected to the first ACV, and the second ACV has positions ranging from fully closed to fully open.

Abstract: A memory circuit includes a boundary layer, a first circuit positioned on a first side of the boundary layer and including a DRAM array including a plurality of DRAM cells, a second circuit positioned on a second side of the boundary layer opposite the first side and including a computation circuit, the computation circuit including a sense amplifier circuit, and a plurality of bit lines coupled to the plurality of DRAM cells and the sense amplifier circuit. Each bit line of the plurality of bit lines includes a via structure positioned in the boundary layer and the plurality of DRAM cells of the first circuit positioned on the first side of the boundary layer is an entirety of the DRAM cells of the memory circuit coupled to the sense amplifier circuit.

Abstract: An online pairing method and a computer-readable storage medium are proposed. The online pairing method may be applied to a signal source device and a display device. The signal source device may output a display signal to the display device for display. The method may include dual-channel connection, transmitter sending identity identification information, receiver entering pairing mode, transmitter entering pairing mode, receiver sending online information, and communication connection. Various embodiments can make online pairing and its usage easy, and can improve user experience.