Abstract: This invention discloses a system and method for detecting a cover with an abnormal condition. The system includes a transport track for defining a sliding direction of at least one cover with a detection surface. The transport track has a detection area and a cover removal area, and includes a pair of bottom rails and a pair of side rails. The pair of bottom rails support the cover at an inclination angle so that the cover slides on the pair of bottom rails. The cover is located between the pair of side rails, and the sliding direction of the cover is defined by the pair of side rails. The detection area is used for detecting the detection surface of the cover, and the cover removal area has an outlet for removing a cover with an abnormal condition determined based on a detection result of the detection surface thereof.

Abstract: Nail gel curing devices emitting ultraviolet light, as well as methods of their making and use are disclosed. The devices are useful for curing, inter alia, acrylic compositions, more particularly, acrylic nail gel compositions, and typically employ ultraviolet and/or visible light emitting diodes (“LED”) to cure such ultraviolet and/or visible light curable nail gel resins.

Abstract: A wire retracting device includes a base having a platform, a limiting board disposed on the base, a cover including a top surface and a side wall, a slide block slidably disposed on a sliding area, and a transmission wire disposed in an accommodating space formed between the cover and the base. An annular wall is arranged on the platform, and has a limiting portion that has a first stop portion and a second stop portion respectively formed on two sides thereof. A gap, in which the cover is limited to being movable, is formed between the limiting board and the platform. The top surface has a grooved opening, and a lever is arranged on an inner edge thereof. The side wall is disposed along an edge of the top surface. The sliding area is formed between the inner edge of the grooved opening and the annular wall.

Abstract: A laser diode includes a light-emitting stack, and a distributed Bragg reflection (DBR) cover layer in contact with the light-emitting stack. The light-emitting stack includes an N-type layer, an active layer, and a P-type layer that has a ridged member. The ridged member has an end face including a first inclined surface that inclines with respect to a top surface of the ridged member in an outward and downward direction from the top surface. A contact interface between the ridged member and the DBR cover layer includes the first inclined surface. A method for making the laser diode is also disclosed.

Abstract: This invention provides an apparatus for transferring at least one microdevice and a method for transferring at least one microdevice, which is characterized by utilizing the apparatus for transferring at least one microdevice having a magnetic attracting substrate with at least one magnetic attracting head or magnetic attracting position hole to attract at least one microdevice having at least one magnetic layer disposed on a temporary substrate, and transfer the at least one microdevice to the conductive bonding layer of the at least one microdevice bonding region on a target substrate thereafter.

Abstract: This invention provides an apparatus for transferring at least one microdevice and a method for transferring at least one microdevice, which is characterized by utilizing the apparatus for transferring at least one microdevice having a magnetic attracting substrate with at least one magnetic attracting head or magnetic attracting position hole to attract at least one microdevice having at least one magnetic layer disposed on a temporary substrate, and transfer the at least one microdevice to the conductive bonding layer of the at least one microdevice bonding region on a target substrate thereafter.

Abstract: A semiconductor package includes a flexible substrate and a semiconductor device. The flexible substrate includes a device bonding region and a device top metallization structure including a plurality of device signal lines and a plurality of device power lines extended beyond the device bonding region. The semiconductor device is disposed on the device bonding region and includes an interconnecting metallization structure and a passivation layer covering the interconnecting metallization structure and revealing a plurality of interconnect contacts of the interconnecting metallization structure, wherein the plurality of interconnect contacts electrically connected to one another through the device top metallization structure.

Abstract: Embodiments described herein relate to spatial optical differentiators and layer architecture of adjacent functional layers disposed above or below organic light-emitting diode (OLED) display pixels. A functional unit for an electroluminescent (EL) device pixel includes a spatial optical differentiator disposed adjacent the EL device pixel. The spatial optical differentiator is configured to selectively reflect and transmit light based on an incident angle of light upon the functional unit. For top-emitting OLED, the functional unit includes a thin film encapsulation (TFE) stack disposed over the spatial optical differentiator. For bottom-emitting OLED, the functional unit includes the spatial optical differentiator disposed above at least one of a planar layer or an isolation layer. Also described herein are methods for fabricating the functional unit.

Abstract: A planar antenna module includes a plurality of planar antennas, a first transmission line electrically connected to the planar antennas, and at least one gain enhancement structure formed on the first transmission line. Each gain enhancement structure has a plurality of toothed portions spaced apart. With the design of the gain enhancement structure, the gain of the planar antenna module could be enhanced.

Abstract: Example of systems with rotatable port units are described. In an example, a system includes a control unit, a first port unit with a first set of ports coupled to the control unit, and a second port unit with a second set of ports coupled to the control unit. The second port unit is mounted on the first port unit and is rotatable with respect to the first port unit. The control unit is to enable a subset of ports from the second set of ports and the first set of ports based on a rotational position of the second port unit with respect to the first port unit.

Abstract: The present invention provides a mobile device connection device and a mobile device remote plug-and-play system. The mobile device connection device includes a USB port connected to a mobile device and a communication module for wireless communication with a WiFi access point (AP), and the mobile device connection device performs wireless communication through the WiFi AP. Instant plugging and unplugging can be achieved, the distance limitation can also be overcome, and the user experience is good.

Abstract: In one example in accordance with the present disclosure, a wearable communication device is described. The device includes a housing to be worn by a user and an antenna structure disposed within the housing. The antenna structure includes a substrate, a first antenna array disposed on a first surface of the substrate, and a second antenna array disposed on a second surface of the substrate. The antenna structure also includes a reflective wall facing the second surface.

Abstract: An ultrasonic vibration assisted machining device is applied to a cutting tool and includes a vibrating component and a spinning component. The vibrating component includes a main body including a first end surface, a second end surface and a central axis. The vibrating component is configured to receive electrical power and generate a vibration with a vibrating frequency in the central axis direction according to the electrical power. The spinning component includes a first surface connected to the second end surface of the vibrating component. The area of the first surface is greater than that of the second end surface. The spinning component generates a spinning motion centered on the central axis according to the vibration with the vibrating frequency generated by the vibrating component. Wherein, the spinning component transmits the vibration and the spinning motion to the cutting tool.

Abstract: A semiconductor device and method for forming the semiconductor device are provided. In some embodiments, a semiconductor substrate comprises a device region. An isolation structure extends laterally in a closed path to demarcate the device region. A first source/drain region and a second source/drain region are in the device region and laterally spaced. A sidewall of the first source/drain region directly contacts the isolation structure at a first isolation structure sidewall, and remaining sidewalls of the first source/drain region are spaced from the isolation structure. A selectively-conductive channel is in the device region, and extends laterally from the first source/drain region to the second source/drain region. A plate comprises a central portion and a first peripheral portion. The central portion overlies the selectively-conductive channel, and the first peripheral portion protrudes from the central portion towards the first isolation structure sidewall.

Abstract: A photolithography method includes dispensing a first liquid onto a first target layer formed over a first wafer through a nozzle at a first distance from the first target layer; capturing an image of the first liquid on the first target layer; patterning the first target layer after capturing the image of the first liquid; comparing the captured image of the first liquid to a first reference image to generate a first comparison result; responsive to the first comparison result, positioning the nozzle and a second wafer such that the nozzle is at a second distance from a second target layer on the second wafer; dispensing a second liquid onto the second target layer formed over the second wafer through the nozzle at the second distance from the second target layer; and patterning the second target layer after dispensing the second liquid.

Abstract: In some embodiments, a semiconductor device is provided. The semiconductor device includes an isolation structure disposed in a semiconductor substrate, where an inner perimeter of the isolation structure demarcates a device region of the semiconductor substrate. A gate is disposed over the device region, where an outer perimeter of the gate is disposed within the inner perimeter of the isolation structure. A first source/drain region is disposed in the device region and on a first side of the gate. A second source/drain region is disposed in the device region and on a second side of the gate opposite the first side. A silicide blocking structure partially covers the gate, partially covers the first source/drain region, and partially covers the isolation structure, where a first sidewall of the silicide blocking structure is disposed between first opposite sidewalls of the gate.

Abstract: The present invention relates to a computer back control system and method. The system includes a first communication device and at least one second communication device. The first communication device includes a first interface configured to receive control information, a second interface configured to send interface information, and a first wireless transceiving module configured to send the control information and receive the interface information; the second communication device includes a second wireless transceiving module configured to receive the control information from the first wireless transceiving module, and send the interface information to the first wireless transceiving module, a third interface configured to send the control information to the computer, and a fourth interface configured to receive the currently displayed interface information from the computer.

Abstract: A semiconductor package includes a flexible substrate and a semiconductor device. The flexible substrate includes a device bonding region and a device top metallization structure including a plurality of device signal lines and a plurality of device power lines extended beyond the device bonding region. The semiconductor device is disposed on the device bonding region and includes an interconnecting metallization structure and a passivation layer covering the interconnecting metallization structure and revealing a plurality of interconnect contacts of the interconnecting metallization structure, wherein the plurality of interconnect contacts electrically connected to one another through the device top metallization structure.

Abstract: A temperature controlling apparatus includes a platen, a first and a second conduits, and a first and a second outlet thermal sensors. The first conduit includes a first inlet, a first outlet, and a first heater. A first fluid enters the first inlet and exits the first outlet, the first heater heats the first fluid to a first heating temperature, and the first fluid is dispensed on the platen. The second conduit includes a second inlet, a second outlet, and a second heater. A second fluid enters the second inlet and exits the second outlet, the second heater heats the second fluid to a second heating temperature, and the second fluid is dispensed on the platen. The first and the second outlet thermal sensors are respectively disposed at the first and the second outlets to sense temperatures of the first and the second fluid.

Abstract: A semiconductor structure is disclosed. The semiconductor structure includes: a substrate; a gate structure formed over the substrate; a source region and a drain region formed in the substrate on either side of the gate structure, the source region and the drain region both having a first type of conductivity; and a field plate formed over the substrate between the gate structure and the drain region; wherein the field plate is coupled to the source region or a bulk electrode of the substrate. An associated method for fabricating the semiconductor structure is also disclosed.