Abstract: A non-volatile memory device may include a semiconductor substrate and an isolation layer on the semiconductor substrate wherein the isolation layer defines an active region of the semiconductor substrate. A tunnel insulation layer may be provided on the active region of the semiconductor substrate, and a charge storage pattern may be provided on the tunnel insulation layer. An interface layer pattern may be provided on the charge storage pattern, and a blocking insulation pattern may be provided on the interface layer pattern. Moreover, the block insulation pattern may include a high-k dielectric material, and the interface layer pattern and the blocking insulation pattern may include different materials. A control gate electrode may be provided on the blocking insulating layer so that the blocking insulation pattern is between the interface layer pattern and the control gate electrode. Related methods are also discussed.

Abstract: A method of fabricating a semiconductor device includes forming a fin-shaped active region including opposing sidewalls and a surface therebetween protruding from a substrate, forming a gate structure on the surface of the active region, and performing an ion implantation process to form source/drain regions in the active region at opposite sides of the gate structure. The source/drain regions respectively include a first impurity region in the surface of the active region and second impurity regions in the opposing sidewalls of the active region. The first impurity region has a doping concentration that is greater than that of the second impurity regions. Related devices are also discussed.

Abstract: Methods of forming a memory device include forming a device isolation layer in a semiconductor substrate including a cell array region and a resistor region, the device isolation layer extending into the resistor region and defining an active region in the semiconductor substrate. A first conductive layer is formed on the device isolation layer in the resistor region. The semiconductor substrate is exposed in the cell array region. A cell insulation layer is formed on a portion of the semiconductor substrate including the exposed cell array region, the active region and the device isolation layer in the resistor region. A second conductive layer is formed on the cell insulation layer in the portion of the semiconductor substrate including the exposed cell array region, the active region and the device isolation layer in the resistor region.

Abstract: Methods of forming a memory device include forming a device isolation layer in a semiconductor substrate including a cell array region and a resistor region, the device isolation layer extending into the resistor region and defining an active region in the semiconductor substrate. A first conductive layer is formed on the device isolation layer in the resistor region. The semiconductor substrate is exposed in the cell array region. A cell insulation layer is formed on a portion of the semiconductor substrate including the exposed cell array region, the active region and the device isolation layer in the resistor region. A second conductive layer is formed on the cell insulation layer in the portion of the semiconductor substrate including the exposed cell array region, the active region and the device isolation layer in the resistor region.

Abstract: A nonvolatile memory device includes a semiconductor substrate including a cell region and a peripheral circuit region, a cell gate on the cell region, and a peripheral circuit gate on the peripheral circuit region, wherein the cell gate includes a charge storage insulating layer on the semiconductor substrate, a gate electrode on the charge storage insulating layer, and a conductive layer on the gate electrode, and the peripheral circuit gate includes a gate insulating layer on the semiconductor substrate, a semiconductor layer on the gate insulating layer, an ohmic layer on the semiconductor layer, and the conductive layer on the ohmic layer.

Abstract: A semiconductor device includes a device isolation layer in a semiconductor substrate, an active region defined by the device isolation layer, the active region including a main surface and a recess region including a bottom surface that is lower than the main surface, and a gate electrode formed over the recess region, wherein a top surface of the device isolation layer adjacent to the recess region is lower than the bottom surface of the recess region.

Abstract: A memory device includes a substrate having a cell region, a low voltage region and a high voltage region. A ground selection transistor, a string selection transistor and a cell transistor are in the cell region, a low voltage transistor is in the low voltage region, and a high voltage transistor is in the high voltage region. A common source contact is on the ground selection transistor and a low voltage contact is on the low voltage transistor. A bit line contact is on the string selection transistor, a high voltage contact is on the high voltage transistor, and a bit line is on the bit line contact. A first insulating layer is on the substrate, and a second insulating layer is on the first insulating layer. The common source contact and the first low voltage contact extend to a height of the first insulating layer, and the bit line contact and the first high voltage contact extend to a height of the second insulating layer.

Abstract: Nonvolatile memory devices including device isolation patterns on a semiconductor substrate are provided. The device isolation patterns define a cell active region and a peripheral active region of the semiconductor substrate. Cell gate electrodes are provided that cross over the cell active regions. Memory cell patterns are provided between the cell gate electrodes and the cell active regions and extend toward the device isolation patterns. A tunnel insulation film is provided between the memory cell pattern and the cell active region. Related methods of fabricating nonvolatile memory devices are also provided herein.

Abstract: Methods of forming a non-volatile memory device may include forming a tunnel insulating layer on a semiconductor substrate and forming a charge-trap layer on the tunnel insulating layer. A trench may then be formed extending through the tunnel insulating layer and the charge-trap layer and into the semiconductor substrate so that portions of the charge-trap layer and the tunnel insulating layers remain on opposite sides of the trench. A device isolation layer may be formed in the trench, and a blocking insulating layer may be formed on the device isolation layer and on remaining portions of the charge-trap layer. A gate electrode may be formed on the blocking insulating layer, and the blocking insulating layer and remaining portions of the charge-trap layer may be patterned to provide a blocking insulating pattern and a charge-trap pattern between the gate electrode and the semiconductor substrate. Related structures are also discussed.

Abstract: A semiconductor device has a gate contact structure, including a semiconductor substrate, a polycrystalline silicon layer used as a gate electrode of a transistor, a middle conductive layer, a top metal layer having an opening exposing the polycrystalline silicon layer, and a contact plug directly contacting the polycrystalline silicon layer through the opening.

Abstract: A cell array includes a semiconductor substrate including an active region comprising a first region, a second region, and a transition region, the second region being separated from the first region by the transition region, wherein a top surface of the second region is at a different level than a top surface of the first region. The cell array also includes a plurality of word lines crossing over the first region. The cell array also includes a selection line crossing over the active region, wherein at least a portion of the selection line is located over the transition region.

Abstract: A nonvolatile memory device includes a semiconductor substrate and a device isolation layer on the semiconductor substrate. A fin-shaped active region is formed between portions of the device isolation layer. A sidewall protection layer is formed on the sidewall of the fin-shaped active region where source and drain regions are formed. Thus, it may be possible to reduce the likelihood of an undesirable connection between an interconnection layer connected to the source and drain regions and a lower sidewall of the active region so that charge leakage from the interconnection layer to a substrate can be prevented or reduced. The sidewall protection layer may be formed using the device isolation layer. Alternatively, an insulating layer having an etch selectivity with respect to an interlayer insulating layer may be formed on the device isolation layer so as to cover the sidewall of the active region.

Abstract: Methods of forming a memory device include forming a device isolation layer in a semiconductor substrate including a cell array region and a resistor region, the device isolation layer extending into the resistor region and defining an active region in the semiconductor substrate. A first conductive layer is formed on the device isolation layer in the resistor region. The semiconductor substrate is exposed in the cell array region. A cell insulation layer is formed on a portion of the semiconductor substrate including the exposed cell array region, the active region and the device isolation layer in the resistor region. A second conductive layer is formed on the cell insulation layer in the portion of the semiconductor substrate including the exposed cell array region, the active region and the device isolation layer in the resistor region.

Abstract: The present invention relates to a semiconductor memory device having a voltage driving circuit.

Abstract: An automatic controlled delay circuit for use in a semiconductor memory device capable of detecting and adjusting a variation in delay with PVT variation delays a wordline activating signal by a predetermined time period and outputs the same as a bitline sense amplifier activating signal. The delay circuit is implemented with a plurality of delay blocks that are connected serially. The semiconductor device comprises a delay pulse signal generating block for generating a plurality of delayed pulse signals, each of which has different delay values at a time point at which the wordline activating signal is activated using an internal clock; a signal detecting block for detecting an activation time point of the bitline sense amplifier activating signal to generate a detected pulse signal; and a delay amount adjusting block for comparing the plurality of delayed pulse signals with the detected pulse signal to control the plurality of delay blocks.

Abstract: The present invention relates to an active driver for generating an internal voltage. In an active operation of a semiconductor device, after a voltage drop of a core voltage (VCORE) by consumed current of the core voltage (VCORE) is detected in a multi-step, a corresponding transistor for a driver is variably operated depending on a detected voltage drop level. Therefore, in an active operation, an increase in an active consumption current depending on an increase in the size of an output driver can be minimized.

Abstract: The present invention relates to a semiconductor memory device having a voltage driving circuit.

Abstract: An automatic controlled delay circuit for use in a semiconductor memory device capable of detecting and adjusting a variation in delay with PVT variation delays a wordline activating signal by a predetermined time period and outputs the same as a bitline sense amplifier activating signal. The delay circuit is implemented with a plurality of delay blocks that are connected serially. The semiconductor device comprises a delay pulse signal generating block for generating a plurality of delayed pulse signals, each of which has different delay values at a time point at which the wordline activating signal is activated using an internal clock; a signal detecting block for detecting an activation time point of the bitline sense amplifier activating signal to generate a detected pulse signal; and a delay amount adjusting block for comparing the plurality of delayed pulse signals with the detected pulse signal to control the plurality of delay blocks.

Abstract: The apparatus for generating a driving voltage for a sense amplifier has at least voltage output means, and first and second core voltage step-up means. The voltage output means outputs a voltage for driving the sense amplifier to a node. Each of the first and second core voltage step-up means are connected between a power supply and the node. The first and second core voltage step-up means are turned on in sequence to elevate the voltage level of the node connected with the sense amplifier up to the level of the power supply. This enhances the performance of the sense amplifier as well as the execute detection amplification in a short time period. The first and second core voltage step-up means are turned on in sequence to elevate the core voltage as the driving voltage, reducing the power noise. Each core voltage step-up driver may be installed in each bank to reduce power consumption.

Abstract: A power-up detection apparatus comprises a voltage divider, a potential detector and a buffer. The voltage divider divides an inputted power voltage in a predetermined ratio. The potential detector compares a predetermined potential with a potential outputted from said voltage divider, and outputs the comparison result. The buffer changes the level of said comparison result when said comparison result outputted from said potential detector is maintained at a predetermined potential for a predetermined period. As a result, a semiconductor device can be stably initialized because a power-up signal is generated only when an externally inputted power voltage is maintained at a current state over a predetermined period although the state of the external power voltage is toggled by noise.