Abstract: A vertical memory device and a method of manufacturing a vertical memory device are disclosed. The vertical memory device includes a substrate, a plurality of channels, a charge storage structure, a plurality of gate electrodes, a first semiconductor structure, and a protection layer pattern. The substrate includes a first region and a second region. The plurality of channels is disposed in the first region. The plurality of channels extends in a first direction substantially perpendicular to a top surface of the substrate. The charge storage structure is disposed on a sidewall of each channel. The plurality of gate electrodes is arranged on a sidewall of the charge storage structure and is spaced apart from each other in the first direction. The first semiconductor structure is disposed in the second region. The protection layer pattern covers the first semiconductor structure. The protection layer pattern has a thickness substantially similar to a thickness of a lowermost gate electrode.

Abstract: A nonvolatile memory device comprises a channel pattern, a first interlayer dielectric film and a second interlayer dielectric film spaced apart from each other and stacked over each other, a gate pattern disposed between the first interlayer dielectric film and the second interlayer dielectric film, a trap layer disposed between the gate pattern and the channel pattern and a charge spreading inhibition layer disposed between the channel pattern and the first interlayer dielectric film and between the channel pattern and the second interlayer dielectric film. The charge spreading inhibition layer may include charges inside or on its surface. The charge spreading inhibition layer includes at least one of a metal oxide film or a metal nitride film or a metal oxynitride film having a greater dielectric constant than a silicon oxide film.

Abstract: A vertical memory device includes a channel and gate electrodes. The channel extends in a vertical direction with respect to a top surface of a substrate. The gate electrodes are disposed on an outer sidewall of the channel. The gate electrodes includes a ground selection line (GSL), a word line, a string selection line (SSL) and a first dummy word line sequentially stacked from the top surface of the substrate in the vertical direction to be spaced apart from each other. The channel includes an impurity region at a portion adjacent to the SSL.

Abstract: A nonvolatile memory device includes: a plurality of cell strings disposed on a substrate, wherein at least one of the plurality of cell strings comprises a plurality of cell transistors and at least one ground select transistor stacked in a direction substantially perpendicular to the substrate, and the substrate and a channel region of the plurality of cell strings have a same conductivity type; a substrate bias circuit configured to provide an erase voltage to the substrate in an erase operation; and a ground select line voltage generator configured to provide a ground select line saturation voltage to the at least one ground select transistor in the erase operation.

Abstract: A vertical structure nonvolatile memory device can include a channel layer that extends in a vertical direction on a substrate. A memory cell string includes a plurality of transistors that are disposed on the substrate in the vertical direction along a vertical sidewall of the channel layer. At least one of the plurality of transistors includes at least one recess in a gate of the transistor into which at least one protrusion, which includes the channel layer, extends.

Abstract: A non-volatile memory device may include a semiconductor substrate and an isolation layer on the semiconductor substrate wherein the isolation layer defines an active region of the semiconductor substrate. A tunnel insulation layer may be provided on the active region of the semiconductor substrate, and a charge storage pattern may be provided on the tunnel insulation layer. An interface layer pattern may be provided on the charge storage pattern, and a blocking insulation pattern may be provided on the interface layer pattern. Moreover, the block insulation pattern may include a high-k dielectric material, and the interface layer pattern and the blocking insulation pattern may include different materials. A control gate electrode may be provided on the blocking insulating layer so that the blocking insulation pattern is between the interface layer pattern and the control gate electrode. Related methods are also discussed.

Abstract: A vertical structure nonvolatile memory device can include a channel layer that extends in a vertical direction on a substrate. A memory cell string includes a plurality of transistors that are disposed on the substrate in the vertical direction along a vertical sidewall of the channel layer. At least one of the plurality of transistors includes at least one recess in a gate of the transistor into which at least one protrusion, which includes the channel layer, extends.

Abstract: A non-volatile memory device may include a semiconductor substrate and an isolation layer on the semiconductor substrate wherein the isolation layer defines an active region of the semiconductor substrate. A tunnel insulation layer may be provided on the active region of the semiconductor substrate, and a charge storage pattern may be provided on the tunnel insulation layer. An interface layer pattern may be provided on the charge storage pattern, and a blocking insulation pattern may be provided on the interface layer pattern. Moreover, the block insulation pattern may include a high-k dielectric material, and the interface layer pattern and the blocking insulation pattern may include different materials. A control gate electrode may be provided on the blocking insulating layer so that the blocking insulation pattern is between the interface layer pattern and the control gate electrode. Related methods are also discussed.

Abstract: A vertical structure nonvolatile memory device can include a channel layer that extends in a vertical direction on a substrate. A memory cell string includes a plurality of transistors that are disposed on the substrate in the vertical direction along a vertical sidewall of the channel layer. At least one of the plurality of transistors includes at least one recess in a gate of the transistor into which at least one protrusion, which includes the channel layer, extends.

Abstract: A semiconductor device and a method of fabricating the same are provided. The semiconductor device includes a first dielectric pattern, a data storage pattern and a second dielectric pattern, which are sequentially stacked on a semiconductor substrate. A first conductive pattern is provided on the second dielectric pattern. A second conductive pattern having a greater width than the first conductive pattern is provided on the first conductive pattern.

Abstract: A nonvolatile memory device comprises a channel pattern, a first interlayer dielectric film and a second interlayer dielectric film spaced apart from each other and stacked over each other, a gate pattern disposed between the first interlayer dielectric film and the second interlayer dielectric film, a trap layer disposed between the gate pattern and the channel pattern and a charge spreading inhibition layer disposed between the channel pattern and the first interlayer dielectric film and between the channel pattern and the second interlayer dielectric film. The charge spreading inhibition layer may include charges inside or on its surface. The charge spreading inhibition layer includes at least one of a metal oxide film or a metal nitride film or a metal oxynitride film having a greater dielectric constant than a silicon oxide film.

Abstract: A flash memory device provided here comprises a user data area storing user data; and a security data area storing security data. The security data area stores a security data pattern in which first groups of memory cells storing security data are arranged respectively between second groups of memory cells storing dummy data.

Abstract: A vertical structure nonvolatile memory device can include a channel layer that extends in a vertical direction on a substrate. A memory cell string includes a plurality of transistors that are disposed on the substrate in the vertical direction along a vertical sidewall of the channel layer. At least one of the plurality of transistors includes at least one recess in a gate of the transistor into which at least one protrusion, which includes the channel layer, extends.

Abstract: Non-volatile memory devices are provided including a control gate electrode on a substrate; a charge storage insulation layer between the control gate electrode and the substrate; a tunnel insulation layer between the charge storage insulation layer and the substrate; a blocking insulation layer between the charge storage insulation layer and the control gate electrode; and a material layer between the tunnel insulation layer and the blocking insulation layer, the material layer having an energy level constituting a bottom of a potential well.

Abstract: A cell array includes a semiconductor substrate including an active region comprising a first region, a second region, and a transition region, the second region being separated from the first region by the transition region, wherein a top surface of the second region is at a different level than a top surface of the first region. The cell array also includes a plurality of word lines crossing over the first region. The cell array also includes a selection line crossing over the active region, wherein at least a portion of the selection line is located over the transition region.

Abstract: A semiconductor device has a gate contact structure, including a semiconductor substrate, a polycrystalline silicon layer used as a gate electrode of a transistor, a middle conductive layer, a top metal layer having an opening exposing the polycrystalline silicon layer, and a contact plug directly contacting the polycrystalline silicon layer through the opening.

Abstract: A non-volatile memory device may include a semiconductor substrate and an isolation layer on the semiconductor substrate wherein the isolation layer defines an active region of the semiconductor substrate. A tunnel insulation layer may be provided on the active region of the semiconductor substrate, and a charge storage pattern may be provided on the tunnel insulation layer. An interface layer pattern may be provided on the charge storage pattern, and a blocking insulation pattern may be provided on the interface layer pattern. Moreover, the block insulation pattern may include a high-k dielectric material, and the interface layer pattern and the blocking insulation pattern may include different materials. A control gate electrode may be provided on the blocking insulating layer so that the blocking insulation pattern is between the interface layer pattern and the control gate electrode. Related methods are also discussed.

Abstract: A non-volatile memory device may include a semiconductor substrate and an isolation layer on the semiconductor substrate wherein the isolation layer defines an active region of the semiconductor substrate. A tunnel insulation layer may be provided on the active region of the semiconductor substrate, and a charge storage pattern may be provided on the tunnel insulation layer. An interface layer pattern may be provided on the charge storage pattern, and a blocking insulation pattern may be provided on the interface layer pattern. Moreover, the block insulation pattern may include a high-k dielectric material, and the interface layer pattern and the blocking insulation pattern may include different materials. A control gate electrode may be provided on the blocking insulating layer so that the blocking insulation pattern is between the interface layer pattern and the control gate electrode. Related methods are also discussed.

Abstract: A vertical structure nonvolatile memory device can include a channel layer that extends in a vertical direction on a substrate. A memory cell string includes a plurality of transistors that are disposed on the substrate in the vertical direction along a vertical sidewall of the channel layer. At least one of the plurality of transistors includes at least one recess in a gate of the transistor into which at least one protrusion, which includes the channel layer, extends.

Abstract: Non-volatile memory devices are provided including a control gate electrode on a substrate; a charge storage insulation layer between the control gate electrode and the substrate; a tunnel insulation layer between the charge storage insulation layer and the substrate; a blocking insulation layer between the charge storage insulation layer and the control gate electrode; and a material layer between the tunnel insulation layer and the blocking insulation layer, the material layer having an energy level constituting a bottom of a potential well.