Abstract: A chip structure is provided. The chip structure includes a substrate. The chip structure includes a first conductive line over the substrate. The chip structure includes an insulating layer over the substrate and the first conductive line. The chip structure includes a conductive pillar over the insulating layer. The chip structure includes a solder bump on the conductive pillar. The solder bump is in direct contact with the conductive pillar.

Abstract: A system and method for safe use of an optics assembly with an external light source and an optically coupled optics module is disclosed. The system includes an external light module emitting a continuous wave laser through an output port. An optics module has an input port and a memory. The optics module generates a modulated optical signal. The memory stores the power level of the continuous wave laser signal received by the optics module. An optical jumper is provided for coupling the output port with the input port. A communication bus is coupled between a controller and the external light source module. The controller sets the external light source at a low power level and transitions the external light source to a high power level when the stored power level of the continuous wave laser signal received by the optics module exceeds a predetermined level.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a semiconductor substrate and a first conductive structure over the semiconductor substrate. The first conductive structure has a first protruding portion extending towards the semiconductor substrate from a lower surface of the first conductive structure. The semiconductor device structure also includes a second conductive structure over the semiconductor substrate. The second conductive structure is substantially as wide as the first conductive structure, and the second conductive structure has a second protruding portion extending towards the semiconductor substrate from a lower surface of the second conductive structure. The first conductive structure is closer to a center point of the semiconductor substrate than the second conductive structure.

Abstract: A driving device for a nail gun includes a striking unit and an air storage unit. The striking unit includes a striking cylinder connected to the nail gun and defining a cylinder chamber having an opening, and a piston disposed in and making an air-tight contact with the striking cylinder. The air storage unit includes an air storage cylinder including a protrusion that protrudes toward the opening and cooperating with the striking cylinder to define an air storage chamber that is in fluid communication with the cylinder chamber via the opening. When the piston moves in a pressure-generating direction, air in the air storage chamber is pressurized. The air storage unit further includes a lubricant disposed in the cylinder chamber and the air storage chamber, and flowing along the protrusion into the cylinder chamber to lubricate the piston.

Abstract: The present disclosure, in some embodiments, relates to a polishing system. The polishing system includes a carrier head configured to enclose a wafer. The carrier head has a retainer ring configured to laterally surround the wafer and an abrasive structure that partially covers a lower surface of the retainer ring. A membrane support is surrounded by the retainer ring and defines one or more ports. One or more chambers are coupled to the one or more ports and are defined by the membrane support and a flexible membrane having a lower surface configured to contact the wafer.

Abstract: A system and method for safe use of an optics assembly with an external light source and an optically coupled optics module is disclosed. The system includes an external light module emitting a continuous wave laser through an output port. An optics module has an input port and a memory. The optics module generates a modulated optical signal. The memory stores the power level of the continuous wave laser signal received by the optics module. An optical jumper is provided for coupling the output port with the input port. A communication bus is coupled between a controller and the external light source module. The controller sets the external light source at a low power level and transitions the external light source to a high power level when the stored power level of the continuous wave laser signal received by the optics module exceeds a predetermined level.

Abstract: An electric nail gun includes a main body unit, a hammer unit, and a motor unit. The hammer unit includes a hammer member that is adapted for striking a nail, and a resilient member that has two opposite ends respectively abutting against the hammer member and the main body unit. The resilient member of the hammer unit constantly provides a hammer restoring force for the hammer member to move in a striking direction for striking the nail. The motor unit is mounted to the main body unit, and includes a lifting wheel. The lifting wheel has at least one pushing portion that separably engages the hammer member, and that is operable to push the hammer member to move in an energy storage direction opposite to the striking direction such that the resilient member of the hammer unit is compressed and provides the hammer restoring force to the hammer member.

Abstract: A driving device for a nail gun includes a striking unit and an air storage unit. The striking unit includes a striking cylinder connected to the nail gun and defining a cylinder chamber having an opening, and a piston disposed in and making an air-tight contact with the striking cylinder. The air storage unit includes an air storage cylinder including a protrusion that protrudes toward the opening and cooperating with the striking cylinder to define an air storage chamber that is in fluid communication with the cylinder chamber via the opening. When the piston moves in a pressure-generating direction, air in the air storage chamber is pressurized. The air storage unit further includes a lubricant disposed in the cylinder chamber and the air storage chamber, and flowing along the protrusion into the cylinder chamber to lubricate the piston.

Abstract: A method for manufacturing a package structure includes providing a carrier board; providing at least one die having a top surface, a bottom surface, and a side surface on the carrier board; and forming a protective layer to cover at least a portion of the side surface of the die. The die includes a substrate, a semiconductor layer, a gate structure, a source structure and a drain structure, at least one dielectric layer, and at least one pad. The semiconductor layer is disposed on the substrate. The gate structure is disposed on the semiconductor layer. The source and the drain structures are disposed on opposite sides of the gate structure. The dielectric layer covers the gate, source, and drain structures. The pad is disposed on the dielectric layer and penetrates through the dielectric layer to electrically contact with the gate, source or drain structure.

Abstract: A pneumatic electric nail gun includes a muzzle unit, a striking cylinder that is connected to the muzzle unit, a piston rod subunit that extends movably from the striking cylinder into the muzzle unit, an electric unit that drives movement of the piston rod subunit from a standby position to a nail-striking position for striking a nail, and a connecting unit that includes a plurality of fasteners and a plurality of buffer members. The fasteners extend through the electric unit and secure the electric unit to the muzzle unit. Each of the buffer members surrounds a respective one of the fasteners and fills a space between the respective one of the fasteners, the electric unit and the muzzle unit for shock absorption during a nail-striking process.

Abstract: A semiconductor device includes: a substrate; a seed layer disposed on the substrate; a compound semiconductor stack layer disposed on the seed layer; and a source metal layer and a drain metal layer disposed on the compound semiconductor stack layer. The semiconductor device further includes a conductive layer at least partially covering the source metal layer and the drain metal layer, and covering opposing side surfaces of the seed layer and opposing side surfaces of the compound semiconductor stack layer. The conductive layer electrically connects the seed layer and the source metal layer.

Abstract: An electric power tool includes a motor, a lifter, a firing pin, an electromagnet, a driving circuit, a latch, and a controller. The lifter is driven by the motor to drive the firing pin to perform a firing action. The driving circuit provides electric current to excite the electromagnet. The latch is moved by the electromagnet from a blocking position where the latch blocks the firing pin to move in a firing direction to a non-blocking position where the latch does not block the firing pin when the electromagnet is in an excited state. The controller, during an excitement period, controls the driving circuit to provide constant current for a first time period to excite the electromagnet to the excited state, and provide pulsating current for a second time period to keep the electromagnet in the excited state.

Abstract: A lifting gear assembly for an electric nail gun that strikes a nail in a nail-striking direction includes a muzzle seat connected to the electric nail gun, a sprocket unit including two sprocket wheels spaced apart from each other and rotatably mounted in the electric nail gun, a motor unit for driving rotation of one of the sprocket wheels, and a chain unit including a roller chain trained on the sprocket wheels and a lifting gear device mounted to the roller chain. The lifting gear device includes a pushing member driven movably by the roller chain along a path having a stroke in which the pushing member moves in a pressure-generating direction opposite to the nail-striking direction. The pushing member pushes the striking pin, when moving along the first stroke, to move the striking pin from a post-striking position to a pre-striking position.

Abstract: A method of forming dice includes the following steps. First, a wafer structure is provides, which includes a substrate and a stack of semiconductor layers disposed in die regions and a scribe line region. Then, the substrate and the stack of the semiconductor layers in the scribe line region are removed to form a groove in the substrate. After the formation of the groove, the substrate is further thinned to obtain the substrate with a reduced thickness. Finally, a separation process is performed on the substrate with the reduced thickness.

Abstract: A semiconductor structure is provided. The semiconductor structure includes a lead frame and a sub-substrate disposed on the lead frame, wherein the thickness of the sub-substrate is between 0 and 0.5 ?m. The semiconductor structure also includes an epitaxial layer disposed on the sub-substrate. The epitaxial layer includes a buffer layer, a channel layer and a barrier layer. The buffer layer is disposed between the sub-substrate and the channel layer. The channel layer is disposed between the buffer layer and the barrier layer. The semiconductor structure further includes a device layer disposed on the barrier layer and an interconnector structure electrically connected to the epitaxial layer and/or the device layer by a through hole.

Abstract: The present disclosure, in some embodiments, relates to a brush cleaning apparatus. The brush cleaning apparatus includes a wafer support configured to support a wafer. The brush cleaning apparatus also includes a cleaning brush including a porous material coupled to a core material. An uppermost surface of the porous material defines a planar cleaning surface. A first nozzle is configured to apply a first cleaning liquid directly between the wafer and the planar cleaning surface of the cleaning brush.

Abstract: A method for manufacturing a package structure includes providing a carrier board; providing at least one die having a top surface, a bottom surface, and a side surface on the carrier board; and forming a protective layer to cover at least a portion of the side surface of the die. The die includes a substrate, a semiconductor layer, a gate structure, a source structure and a drain structure, at least one dielectric layer, and at least one pad. The semiconductor layer is disposed on the substrate. The gate structure is disposed on the semiconductor layer. The source and the drain structures are disposed on opposite sides of the gate structure. The dielectric layer covers the gate, source, and drain structures. The pad is disposed on the dielectric layer and penetrates through the dielectric layer to electrically contact with the gate, source or drain structure.

Abstract: A chip structure includes a substrate, a bottom conductive layer, a semiconductor layer, an interlayer dielectric layer, at least one electrode, and at least one top electrode. The substrate includes in order a core layer and a composite material. The bottom conductive layer is disposed on the bottom surface of the core layer, the semiconductor layer is disposed on the substrate, and an interlayer dielectric layer is disposed on the semiconductor layer. The at least one electrode is disposed between the semiconductor layer and the interlayer dielectric layer, and the at least one top electrode is disposed on the interlayer dielectric layer and electrically coupled to the at least one electrode.

Abstract: Some embodiments relate to a carrier head. The carrier head includes a housing configured to enclose a wafer, wherein the housing includes a retaining ring recess configured to circumferentially surround the wafer. A retaining ring, which includes a first ring-shaped layer and a second ring-shaped layer, is disposed in the retaining ring recess. The second ring-shaped layer is disposed deeper in the retaining ring recess than the first ring-shaped layer and separates the first ring-shaped layer from a bottom of the retaining ring recess. A hardness of the second ring-shaped layer is less than a hardness of the first ring-shaped layer.

Abstract: An optical fiber routing assembly for interfacing with co-package optical (CPO) modules is disclosed. The optical fiber routing assembly includes a housing, a plurality of terminated optical fibers routed within the housing, a first set of adapters, and a second set of adapters. The first set of adapters is arranged vertically on an upper panel of the housing and facilitates connecting the plurality of terminated optical fibers to the CPO modules via terminated jumper optical fibers. The second set of adapters is arranged horizontally and configured to facilitate connecting the plurality of terminated optical fibers to one or more electronic systems. A combination of the first set of adapters and the second set of adapters facilitates communication between the CPO modules and the electronic systems. The optical fiber routing assembly provides fiber management to alleviate maintenance or heat issues associated with dense fiber routing around electronic components.