Abstract: A carrier head includes a housing configured to enclose a wafer and a retainer ring attached to the housing. The retainer ring includes a body and an abrasive structure. The body includes an inner periphery configured to surround the wafer, an outer periphery, and a surface connecting the inner periphery and the outer periphery. The abrasive structure is attached to the surface of the body.

Abstract: A brush cleaning apparatus includes a wafer support configured to support a wafer, and at least one cleaning brush moveable relative to the wafer support. The at least one cleaning brush has opposite first and second sides, and, on the first side, a planar cleaning surface configured to come into contact with the wafer supported by the wafer support to remove contaminants from the wafer.

Abstract: A status indicating device for a power nail gun includes a trigger adapted to be disposed on a gun body and having at least one transparent portion, and a light emitting module adapted to be disposed between the gun body and the trigger for emitting light through the transparent portion.

Abstract: A firing-operation totalizing device for a gas nail gun includes two pressure areas, a pressure feedback unit mounted in a body, and an electric control unit. The pressure areas are constituted by an interior of a combustion chamber and an interior of a cylinder body. The pressure feedback unit outputs a pressure signal in response to each pressure change of at least one of the pressure areas. The electric control unit includes a control circuit that totalizes the number of the firing operations based on the pressure signals received thereby. As such, the totalized number of the firing operations is increased only when a pressure change of the at least one of the pressure areas occurs due to an explosion to totalize accurately the number of effective firing operations.

Abstract: Provided is a method of planarizing a semiconductor device. A dielectric layer is formed over a substrate. A plurality of openings is formed in the dielectric layer. The openings have varying distribution densities. The openings are filled with a metal material. A first chemical-mechanical-polishing (CMP) process is performed to remove portions of the metal material over the dielectric layer. Thereafter, a sacrificial layer is formed over the dielectric layer and the metal material. The sacrificial layer has a planar surface. The sacrificial layer is formed through one of: a spin-on process or a flowable chemical vapor deposition (FCVD) process. A second CMP process is then performed to remove the sacrificial layer and portions of the dielectric layer and the metal material therebelow. The second CMP process uses a slurry configured to have a substantially similar polishing selectivity between the sacrificial layer, the dielectric layer, and the metal material.

Abstract: In a combustion-type power tool, when a safety unit is pressed against a workpiece to cause a valve sleeve to close a combustion chamber, a power region of a lever is actuated to permit a weight region of the lever to displace a holding member holding a fuel canister from a normal position to a pressed position. When the holding member is in the pressed position, a valve stem of the fuel canister is forced into pressing engagement with an intake port of a fuel canister actuation unit to permit delivery of a measured dose of fuel to the combustion chamber through the intake port.

Abstract: A metering valve includes a valve main body consisting of a body and a cover, a sliding rod and an elastic member. The body has a positioning hole, a metering chamber, a containing space, and two sealing pads disposed on two end portions of the metering chamber. The containing space is for assembling the gas cylinder A groove is disconnected with the positioning hole, the metering chamber and the containing space. The sliding rod has two ends, wherein a gas channel is formed from one end toward an inner of the sliding rod, the sliding rod has a flange and a through hole, the through hole under the flange is for connecting the gas channel, and the sliding rod blocks a gas from the metering chamber by cooperating with the sealing pads. The elastic member in the groove is connected to the flange and the groove.

Abstract: Provided is a method of planarizing a semiconductor device. A dielectric layer is formed over a substrate. A plurality of openings is formed in the dielectric layer. The openings have varying distribution densities. The openings are filled with a metal material. A first chemical-mechanical-polishing (CMP) process is performed to remove portions of the metal material over the dielectric layer. Thereafter, a sacrificial layer is formed over the dielectric layer and the metal material. The sacrificial layer has a planar surface. The sacrificial layer is formed through one of: a spin-on process or a flowable chemical vapor deposition (FCVD) process. A second CMP process is then performed to remove the sacrificial layer and portions of the dielectric layer and the metal material therebelow. The second CMP process uses a slurry configured to have a substantially similar polishing selectivity between the sacrificial layer, the dielectric layer, and the metal material.

Abstract: Provided is a method of planarizing a semiconductor device. A dielectric layer is formed over a substrate. A plurality of openings is formed in the dielectric layer. The openings have varying distribution densities. The openings are filled with a metal material. A first chemical-mechanical-polishing (CMP) process is performed to remove portions of the metal material over the dielectric layer. Thereafter, a sacrificial layer is formed over the dielectric layer and the metal material. The sacrificial layer has a planar surface. The sacrificial layer is formed through one of: a spin-on process or a flowable chemical vapor deposition (FCVD) process. A second CMP process is then performed to remove the sacrificial layer and portions of the dielectric layer and the metal material therebelow. The second CMP process uses a slurry configured to have a substantially similar polishing selectivity between the sacrificial layer, the dielectric layer, and the metal material.

Abstract: A method and system for planarizing or polishing a semiconductor wafer. The system includes a carrier adaptable to hold a semiconductor wafer, a polishing pad, and a platen having a substantially planar surface in contact with the polishing pad, the planar surface having a distribution of holes. The distributed holes are operatively connected to a vacuum system providing a vacuum pressure to hold the polishing pad against the platen during operation of the system. Relative movement between the carrier and polishing pad acts to planarize a surface of the wafer.

Abstract: An oscillation reducing suspension device for a fan motor of a combustion-powered tool includes a rigid axial-play setting unit mounted on an upper major surface of a cylinder head, and having upper and lower limit defining members that are spaced apart from each other by an axial play route, a suspending mount configured to keep the fan motor oriented in a rotary axis, and having a lug which extends radially into the axial play route to divide the axial play route into proximate and distal regions, and an elastomeric damper unit having upper and lower damping members respectively disposed in the distal and proximate regions. By virtue of the rigid mount supporting the fan motor, and the resilient damper unit coupling the mount and the cylinder head, the fan motor is firmly secured to the cylinder head, and axial oscillation of the fan motor is reduced.

Abstract: A status indicating device for a power nail gun includes a trigger adapted to be disposed on a gun body and having at least one transparent portion, and a light emitting module adapted to be disposed between the gun body and the trigger for emitting light through the transparent portion.

Abstract: A dual safety combustion powered tool device includes a push member disposed to be pressed against a targeted surface to bring a lever to turn to be closer to an actuating unit. A trigger body is pulled to move the actuating unit so as to permit an actuating region to abut against the lever and to turn the actuating unit to an orientation where an actuating region is engageable with an ignition switch. Subsequently, a further movement of the trigger body to a final-stage position permits the actuating region to switch on the ignition switch so as to ignite combustion for initiation of a stroke movement of a driver blade. With such construction, undesired firing of the combustion powered tool device can be avoided.

Abstract: A mounting system for a gas gun, for mounting a motor, is disclosed. The mounting system includes a cylinder, a rigid carrier for carrying the motor such that the motor is disposed through the cylinder and is floatingly movable along an axis, a fixing member, fixedly arranged at an end plane of the cylinder and limited the carrier in the cylinder, and at least one elastic element embedded into the embedding hole of the carrier. The elastic element has a first buffering body extending between one side of the carrier and the fixing member for absorbing a positive vibrating energy of the motor and a second buffering body extending between the other side of the carrier and the cylinder for absorbing a negative vibrating energy of the motor. Dynamic energy generated during vibration of the motor is absorbed by the first and second buffering bodies to achieve the damping effect.

Abstract: A dual safety combustion powered tool device includes a push member disposed to be pressed against a targeted surface to bring a lever to turn to be closer to an actuating unit. A trigger body is pulled to move the actuating unit so as to permit an actuating region to abut against the lever and to turn the actuating unit to an orientation where an actuating region is engageable with an ignition switch. Subsequently, a further movement of the trigger body to a final-stage position permits the actuating region to switch on the ignition switch so as to ignite combustion for initiation of a stroke movement of a driver blade. With such construction, undesired firing of the combustion powered tool device can be avoided.

Abstract: A fan motor is adapted to be mounted in a combustion-powered tool. The combustion-powered tool has a housing. The fan motor includes a fan unit, a motor for driving the fan unit, a vibration-absorbing unit, and a clamping unit. The vibration-absorbing unit includes a rigid support that is adapted to be mounted fixedly in the housing of the combustion-powered tool, and an elastic member sleeved over the motor and molded on the rigid support such that the rigid support is disposed around the elastic member. The elastic member is disposed between the rigid support and the motor for absorbing vibrations generated by the motor. The clamping unit includes at least one clamping member sleeved over the elastic member for clamping and retaining the elastic member on the motor.

Abstract: An oscillation reducing suspension device for a fan motor of a combustion-powered tool includes a rigid axial-play setting unit mounted on an upper major surface of a cylinder head, and having upper and lower limit defining members that are spaced apart from each other by an axial play route, a suspending mount configured to keep the fan motor oriented in a rotary axis, and having a lug which extends radially into the axial play route to divide the axial play route into proximate and distal regions, and an elastomeric damper unit having upper and lower damping members respectively disposed in the distal and proximate regions. By virtue of the rigid mount supporting the fan motor, and the resilient damper unit coupling the mount and the cylinder head, the fan motor is firmly secured to the cylinder head, and axial oscillation of the fan motor is reduced.

Abstract: A fan motor is adapted to be mounted in a combustion-powered tool. The combustion-powered tool has a housing. The fan motor includes a fan unit, a motor for driving the fan unit, a vibration-absorbing unit, and a clamping unit. The vibration-absorbing unit includes a rigid support that is adapted to be mounted fixedly in the housing of the combustion-powered tool, and an elastic member sleeved over the motor and molded on the rigid support such that the rigid support is disposed around the elastic member. The elastic member is disposed between the rigid support and the motor for absorbing vibrations generated by the motor. The clamping unit includes at least one clamping member sleeved over the elastic member for clamping and retaining the elastic member on the motor.

Abstract: The present invention provides a compound of the general formula Ar1—R1—Ar2 ??(I) wherein Ar1 and Ar2 independently represent triphenylenyl or pyrenyl, and R1 represent a bond, aryl, or heteroaryl. The present invention also provides a process for the preparation of the compound formula (?), and an organic electroluminescence device utilizing luminescent material comprising the compound of formula (?) as an emitting layer.