Abstract: A chemical-mechanical planarization (CMP) system includes a platen, a pad, a polish head, a rotating mechanism, a light source, and a detector. The pad is disposed on the platen. The polish head is configured to hold a wafer against the pad. The rotating mechanism is configured to rotate at least one of the platen and the polish head. The light source is configured to provide incident light to an end-point layer on the wafer. The detector is configured to detect absorption of the incident light by the end-point layer.

Abstract: Some embodiments relate to a carrier head. The carrier head includes a housing configured to enclose a wafer, wherein the housing includes a retaining ring recess configured to circumferentially surround the wafer. A retaining ring, which includes a first ring-shaped layer and a second ring-shaped layer, is disposed in the retaining ring recess. The second ring-shaped layer is disposed deeper in the retaining ring recess than the first ring-shaped layer and separates the first ring-shaped layer from a bottom of the retaining ring recess. A hardness of the second ring-shaped layer is less than a hardness of the first ring-shaped layer.

Abstract: An object surface managing method comprising: (a) emitting detecting light to the groove via alight source; (b) receiving first reflected detecting light from the surface and second reflected detecting light from a bottom of the groove via a light sensor; and (c) calculating a groove depth of the groove according to the first reflected detecting light and the second reflected detecting light.

Abstract: An image adjusting method including the following steps is provided. Firstly, the original image is divided into a plurality of image areas by a plurality of mutually intersecting virtual lines, wherein the image areas include a plurality of edge areas, each being defined by at least one original image edge of the original image and at least two of the virtual lines. Then, the coordinate of at least one intersection of at least one of the virtual lines and the original image edge are changed to obtain a deformed image edge. Subsequently, at least one original pixel located in one of the edge regions in the original image is repositioned according to the at least two of the virtual lines and the deformed image edge.

Abstract: A method of determining productive capacity parameters includes steps of: obtaining a plurality of parameters of a production line from a memory. By a productive capacity parameters generating system finishing the following steps of: combining parameters of production line to obtain a plurality of parametric combinations so as to generate a plurality of production capacity values; calculating a plurality of stimulation values according to production capacity values and parameters; when at least one stimulation value of stimulation values is greater than to or equals to a preset threshold, setting up at least one stimulation value of stimulation values as at least one related stimulation value; obtaining parameters of at least one target parametric combination of parametric combinations according to at least one related stimulation value; and providing parameters of at least one target parametric combination as productive capacity parameters of production line.

Abstract: Articles having a thermal imprinted adhesive on a substrate of a plurality of certain conicals have improved bonding strength.

Abstract: An optical fiber routing assembly for interfacing with co-package optical (CPO) modules is disclosed. The optical fiber routing assembly includes a housing, a plurality of terminated optical fibers routed within the housing, a first set of adapters, and a second set of adapters. The first set of adapters is arranged vertically on an upper panel of the housing and facilitates connecting the plurality of terminated optical fibers to the CPO modules via terminated jumper optical fibers. The second set of adapters is arranged horizontally and configured to facilitate connecting the plurality of terminated optical fibers to one or more electronic systems. A combination of the first set of adapters and the second set of adapters facilitates communication between the CPO modules and the electronic systems. The optical fiber routing assembly provides fiber management to alleviate maintenance or heat issues associated with dense fiber routing around electronic components.

Abstract: A system and method of joining remote tables by a federated server is provided. A method includes receiving a data join request from a client device; sending a first block fetch request to a first data source based on the data join request; receiving a first set of block data from the first data source; sending a second block fetch request to a second data source based on the data join request and a bind array containing the data of join column in the first data source; receiving a second set of block data from the second data source; and sending an output to the client device in response to the data join request in the form of rows from an outer table and an inner table.

Abstract: A computer-implemented method reduces the number of character set conversions in a distributed data virtualization system. The method includes receiving, from a first application, a first request for a set of data, including a requested codepage, stored in a first data source of a plurality of data sources. The method includes obtaining, by a connector, from the first data source, a first codepage associated with the first data source, which identifies a character set associated with the set of data. The method also includes adding a virtual coded character set identifier (VCCSID) in a first catalog entry of a catalog, wherein the first VCCSID is added to a nickname column of the catalog. The method includes obtaining and sending the set of data to the data application while allowing maximum of one codepage conversion.

Abstract: A method of forming dice includes the following steps. First, a wafer structure is provides, which includes a substrate and a stack of semiconductor layers disposed in die regions and a scribe line region. Then, the substrate and the stack of the semiconductor layers in the scribe line region are removed to form a groove in the substrate. After the formation of the groove, the substrate is further thinned to obtain the substrate with a reduced thickness. Finally, a separation process is performed on the substrate with the reduced thickness.

Abstract: An optical fiber routing assembly for interfacing with co-package optical (CPO) modules is disclosed. The optical fiber routing assembly includes a housing, a plurality of terminated optical fibers routed within the housing, a first set of adapters, and a second set of adapters. The first set of adapters is arranged vertically on an upper panel of the housing and facilitates connecting the plurality of terminated optical fibers to the CPO modules via terminated jumper optical fibers. The second set of adapters is arranged horizontally and configured to facilitate connecting the plurality of terminated optical fibers to one or more electronic systems. A combination of the first set of adapters and the second set of adapters facilitates communication between the CPO modules and the electronic systems. The optical fiber routing assembly provides fiber management to alleviate maintenance or heat issues associated with dense fiber routing around electronic components.

Abstract: A federated database-management system receives an SQL query or other type of data-access request. The federated system's host DBMS parses, rewrites, and optimizes the request into an optimal data-access plan, then determines which portions of the plan require access to data stored on the federated systems' remote databases. The federated host partitions the plan into subplans that each represent instructions of the original data-access request that were directed to a corresponding remote database of the federated DBMS. Each subplan is then transmitted to its corresponding remote database, which directly executes the subplan and returns results to the host. If necessary, a subplan is translated from an original generic access-plan format into a database-specific format required by its corresponding remote database.

Abstract: A semiconductor sensor, comprising a gas-sensing device and an integrated circuit is provided. The gas-sensing device includes a substrate having a sensing area and an interconnection area in the vicinity of the sensing area, an inter-metal dielectric (IMD) layer formed above the substrate in the sensing area and in the interconnection area, and an interconnect structure formed in the interconnection area; further includes a sensing electrode, a second TiO2-patterned portion, and a second Pt-patterned portion on the second TiO2-patterned portion in the sensing area. The interconnect structure includes a tungsten layer buried in the IMD layer, wherein part of a top surface of the tungsten layer is exposed by at least a via. The interconnect structure further includes a platinum layer formed in said at least the via, a TiO2 layer formed on the IMD layer, a first TiO2-patterned portion and a first Pt-patterned portion.

Abstract: A vibration sensor senses vibrations generated by an object to generate a noise signal. A processor obtains a structure vibration level spectrum from the noise signal, uses equalization parameters and A_weighting parameters to adjust the structure vibration level spectrum to generate a sound pressure level spectrum, and uses the sound pressure level spectrum to calculate a noise value of the object.

Abstract: A chip structure includes a substrate, a bottom conductive layer, a semiconductor layer, an interlayer dielectric layer, at least one electrode, and at least one top electrode. The substrate includes in order a core layer and a composite material. The bottom conductive layer is disposed on the bottom surface of the core layer, the semiconductor layer is disposed on the substrate, and an interlayer dielectric layer is disposed on the semiconductor layer. The at least one electrode is disposed between the semiconductor layer and the interlayer dielectric layer, and the at least one top electrode is disposed on the interlayer dielectric layer and electrically coupled to the at least one electrode.

Abstract: A slurry solution for a Chemical Mechanical Polishing (CMP) process includes a wetting agent, a stripper additive that comprises at least one of: N-methyl-2-pyrrolidone (NMP), dimethyl sulfoxide (DMSO), sulfolane, and dimethylformamide (DMF), and an oxidizer additive comprising at least one of: hydrogen peroxide (H2O2), ammonium persulfate ((NH4)2S2O8), peroxymonosulfuric acid (H2SO5), ozone (O3) in de-ionized water, and sulfuric acid (H2SO4).

Abstract: A method of forming dice includes the following steps. First, a wafer structure is provides, which includes a substrate and a stack of semiconductor layers disposed in die regions and a scribe line region. Then, the substrate and the stack of the semiconductor layers in the scribe line region are removed to forma groove in the substrate. After the formation of the groove, the substrate is further thinned to obtain the substrate with a reduced thickness. Finally, a separation process is performed on the substrate with the reduced thickness.

Abstract: A system and method for safe use of an optics assembly with an external light source and an optically coupled optics module is disclosed. The system includes an external light module emitting a continuous wave laser through an output port. An optics module has an input port and a memory. The optics module generates a modulated optical signal. The memory stores the power level of the continuous wave laser signal received by the optics module. An optical jumper is provided for coupling the output port with the input port. A communication bus is coupled between a controller and the external light source module. The controller sets the external light source at a low power level and transitions the external light source to a high power level when the stored power level of the continuous wave laser signal received by the optics module exceeds a predetermined level.

Abstract: A patient monitoring system includes a microphone that collects audio data from a patient. The audio data is used to generate audio characteristics for categorization of the audio data and analysis of the audio data to determine a patient health status. The audio characteristics and the patient health status are tracked over time and utilized to monitor a respiratory condition of the patient. The system determines the patient health status based on a comparison of the audio characteristics with a database of audio characteristics associated with recorded health statuses of various patients. The system generates a report of the current patient health status based on the database of audio characteristics and associated health statuses.

Abstract: A method for controlling a display device includes establishing a data link between the display device and a hardware dongle, generating a second interface by the display device through the hardware dongle after the data link is established, generating a control signal by the display device through the second interface, and executing at least one function according to the control signal. A first interface is stored in the display device. The first interface and the second interface are different. At least one first function is supported by the display device. At least one second function is supported by the hardware dongle. The at least one first function and the at least one second function are integrated for generating the second interface by the display device after the data link is established.