Abstract: Provided herein is a method for manufacturing a semiconductor device. A substrate including a MEMS region and a connection region thereon is provided; a dielectric layer disposed on the substrate in the connection region is provided; a poly-silicon layer disposed on the dielectric layer is provided, wherein the poly-silicon layer serves as an etch-stop layer; a connection pad disposed on the poly-silicon layer is provided; and a passivation layer covering the dielectric layer is provided, wherein the passivation layer includes an opening that exposes the connection pad and a transition region between the connection pad and the passivation layer, and a conductive layer conformally covering the connection pad and the poly-silicon layer in the transition region is provided.

Abstract: The present disclosure provides a method for determining an ultrasound focus location in a thermal image. In one aspect, the method includes obtaining a magnetic resonance thermal image of a tissue heated by a focused ultrasound and correcting a chemical shift and a k-space shift of a monitored ultrasound focus location in the magnetic resonance thermal image such that the monitored ultrasound focus location is aligned with a real physical ultrasound focus location. Correcting the chemical shift includes correcting a first spatial error of the monitored ultrasound focus location caused by resonance frequency changes of hydrogen nuclei due to environmental differences of water molecules. Correcting the k-space shift includes correcting a second spatial error of the monitored ultrasound focus location caused by temperature error due to spatial variations of a primary magnetic field.

Abstract: A virtual reality wearable device and an obstacle detecting method thereof are disclosed. The virtual reality wearable device includes an environment capture module, an image integration module, a detection module and a warning module. The environment capture module is used for capturing an external image. The image integration module is used for receiving the external image in real time as a real-time environment image, and integrating the external images captured around one circle into an initial environment image. The detection module is used for detecting whether there is a difference between the initial environment image and the real-time environment image. When there is a difference between the initial environment image and the real-time environment image, the detection module generates a notification signal. The warning module is used for sending a warning signal according to the notification signal.

Abstract: An optical transceiver includes a photoelectric converter, an interposer and a circuit board. The interposer is disposed on the photoelectric converter. The interposer includes a board member and a flexible electrically conductive member disposed on the board member, and the photoelectric converter is electrically connected to the flexible electrically conductive member. The circuit board is disposed on a side of the interposer. The flexible electrically conductive member is remove-ably pressed against the circuit board so that the flexible conductive member is electrically connected to the circuit board.

Abstract: The present invention provides a structure of a gas sensor, comprising: a support, having a front side, a back side opposite to the front side, a cell region, and a peripheral region circling the cell region; a cavity, formed on the back side of the support in the cell region; a heater, disposed on the front side of the support covering the cavity; a sensing element, disposed on the heater; and a sealing layer, formed on the back side of the support covering inside the cavity.

Abstract: The present disclosure, in some embodiments, relates to a method of operating a resistive random access memory (RRAM) array. The method includes applying a word-line voltage to a selected word-line during a read operation. A non-zero voltage is applied to a selected bit-line during the read operation. A first voltage is applied to a selected source-line during the read operation. The first voltage is smaller than a second voltage applied to an unselected source-line during the read operation.

Abstract: The present disclosure, in some embodiments, relates to a polishing system. The polishing system includes a carrier head configured to enclose a wafer. The carrier head has a retainer ring configured to laterally surround the wafer and an abrasive structure that partially covers a lower surface of the retainer ring. A membrane support is surrounded by the retainer ring and defines one or more ports. One or more chambers are coupled to the one or more ports and are defined by the membrane support and a flexible membrane having a lower surface configured to contact the wafer.

Abstract: Some embodiments relate to a method of using a polishing system. In this method, a wafer is secured in a carrier head. The carrier head includes a housing, which includes a retaining ring recess, enclosing the wafer. A retaining ring is positioned in the retaining ring recess. The retaining ring surrounds the wafer, and has a hardness ranging from about 5 shore A to about 80 shore D. The wafer is pressed against a polishing pad, and at least one of the carrier head or the polishing pad is moved relative to the other.

Abstract: An object surface managing method comprising: (a) emitting detecting light to the groove via alight source; (b) receiving first reflected detecting light from the surface and second reflected detecting light from a bottom of the groove via a light sensor; and (c) calculating a groove depth of the groove according to the first reflected detecting light and the second reflected detecting light.

Abstract: A pericardium puncture needle assembly includes a puncture needle and a guide wire capable of sliding in the puncture needle; or includes an outer sleeve and a guide wire capable of sliding in the outer sleeve; or includes an outer sleeve and a puncture needle and a guide wire capable of sliding in the outer sleeve, wherein after the puncture needle is pulled out of the outer sleeve, the guide wire is capable of sliding in the outer sleeve. The guide wire is made of a highly elastic material and includes a far-end bent segment. The far-end bent segment is formed by bending the guide wire and has a preset bending shape, and is suitable for being recovered from a stretching state to the preset bending shape. The tip of the far-end bent segment has a pointed structure.

Abstract: The present application relates to the structure of a load-bearing column and a factory using the same. The load-bearing columns comprise a first column, a second column and a third column. The first column is a reinforced concrete column and is arranged on the underground floor. The second column is a pre-fabricated reinforced concrete column on the ground floor and is fixed to the top of the first column. The third column is fixed to the top of the second column, wherein the third column comprises a steel column and a third reinforcing bar assembly which surrounds the circumference of the steel column and extends from the bottom of the steel column in an axial direction to a predetermined distance.

Abstract: An account number registration method is provided. Indication information transmitted by a transaction server is received, the indication information including a second business account number of a terminal, a second account name corresponding to the second business account number, and a second recipient account number, a resource being transferred out from the second business account number to the second recipient account number. A registered account number is allocated according to a first account name in response to the second business account number being the same as a first business account number that is pre-stored, the second account name being the same as the first account name that is pre-stored, and the second recipient account number being the same as a first recipient account number that is pre-stored. A notification message indicating a registration success is transmitted to the terminal.

Abstract: The present disclosure generally relates to an optical measurement module, an optical measurement device, and a method for optical measurement. The optical measurement module provides optical architecture to measure the optical properties of an analyte. The optical measurement device comprising the optical measurement module is configured to measure the optical properties of an analyte. The method for the optical measurement provides steps for optical measurement.

Abstract: Chemical-mechanical polishing (CMP) devices, tools, and methods are disclosed. In some embodiments, a device for a CMP tool includes a carrier and an embedded dummy disk coupled to the carrier. The embedded dummy disk comprises a substrate and a film disposed over the substrate. The carrier is coupleable to an arm of a handler of the CMP tool. The carrier and the embedded dummy disk are adapted to be embedded within a housing of the CMP tool. The embedded dummy disk is adapted to be polished by the CMP tool in preparation for a polishing process for a wafer.

Abstract: In some embodiments, the present disclosure relates to a resistive random access memory (RRAM) memory circuit. The memory circuit has a word-line decoder operably coupled to a first RRAM device and a second RRAM device by a word-line. A bit-line decoder is coupled to the first RRAM device by a first bit-line and to the second RRAM device by a second bit-line. A bias element is configured to apply a first non-zero bias voltage to the second bit-line concurrent to the bit-line decoder applying a non-zero voltage to the first bit-line.

Abstract: In some embodiments, the present disclosure relates to a method of performing a planarization process. The method may be performed by placing a wafer between a carrier head and an upper surface of a polishing pad. The carrier head has a retainer ring configured to surround the wafer, and the retainer ring has an abrasive structure configured to contact the upper surface of the polishing pad. Pressures within one or more chambers surrounded by the carrier head are independently regulated. The one or more chambers have one or more interior surfaces having a flexible membrane. The flexible membrane has a lower surface configured to contact the wafer. At least one of the carrier head or the polishing pad are moved relative to the other, and a roughness of the upper surface of the polishing pad is maintained within a predetermined range by using the abrasive structure of the retainer ring.

Abstract: Systems and methods training a model are disclosed. In the method, training data is obtained by a deep neural network (DNN) first, the deep neural network comprising at least one hidden layer. Then features of the training data are obtained from a specified hidden layer of the at least one hidden layer, the specified hidden layer being connected respectively to a supervised classification network for classification tasks and an autoencoder based reconstruction network for reconstruction tasks.

Abstract: A dual sensor module includes a substrate, a light source, a first encapsulant, a second encapsulant, a photodetector, and an electrode. The light source is disposed on the substrate. The first encapsulant is formed over the light source. The photodetector is disposed on the substrate. The second encapsulant is formed over the photodetector. The electrode is electrically connected to the substrate and is entirely located between the light source and the photodetector. A dual sensing accessory and a dual sensing device having the dual sensor module for detecting optical and electrical properties are also provided.

Abstract: A apparatus includes a susceptor and a non-reactive gas source. The susceptor has through holes and a wafer support surface. Each through hole includes a lift pin and a lift pin head. The lift pin has a vertical degree of motion in the through hole to lift up or place a wafer on the susceptor. The lift pin head has at least one flow channel structure running from its first surface at least partially exposed to a bottom side of the susceptor through its second surface exposed to a top side of the susceptor wherein the lift pin. The non-reactive gas source is configured to flow a gas to a backside of the wafer through the flow channel structure through the bottom side of the susceptor.

Abstract: A pericardium puncture needle assembly comprises a puncture needle (12) and a guide wire (13) capable of sliding in the puncture needle (12); or comprises an outer sleeve (22) and a guide wire (13) capable of sliding in the outer sleeve (22); or comprises an outer sleeve (22) and a puncture needle (12) and a guide wire (13) capable of sliding in the outer sleeve (22), wherein after the puncture needle (12) is pulled out of the outer sleeve (22), the guide wire (13) is capable of sliding in the outer sleeve (22). The guide wire (13) is made of a highly elastic material and comprises a far-end bent segment (32). The far-end bent segment (32) is formed by bending the guide wire (13) and has a preset bending shape, and is suitable for being recovered from a stretching state to the preset bending shape. The tip of the far-end bent segment has a pointed structure.