Abstract: An apparatus includes a susceptor and a non-reactive gas source. The susceptor has through holes and a wafer support surface. Each through hole includes a lift pin and a lift pin head. The lift pin has a vertical degree of motion in the through hole to lift up or place a wafer on the susceptor. The lift pin head has at least one flow channel structure running from its first surface at least partially exposed to a bottom side of the susceptor through its second surface exposed to a top side of the susceptor wherein the lift pin. The non-reactive gas source is configured to flow a gas to a backside of the wafer through the flow channel structure through the bottom side of the susceptor.

Abstract: A method for controlling a display device includes establishing a data link between the display device and a hardware dongle, generating a second interface by the display device through the hardware dongle after the data link is established, generating a control signal by the display device through the second interface, and executing at least one function according to the control signal. A first interface is stored in the display device. The first interface and the second interface are different. At least one first function is supported by the display device. At least one second function is supported by the hardware dongle. The at least one first function and the at least one second function are integrated for generating the second interface by the display device after the data link is established.

Abstract: Techniques for neural network training are provided. One computer-implemented method comprises: obtaining, by an electronic device operatively coupled to a processing unit, based on a similarity between two images, a first image and a second image. The computer-implemented method also comprises training, by the electronic device, a neural network based on the first image and the second image such that a distance between a first vector and a second vector generated respectively from the first image and the second image in the trained neural network is associated with the similarity.

Abstract: Embodiments are described for minimizing a wait time for a rider after sending a ride request for a vehicle. An example computer-implemented method includes receiving a ride request, the request being for travel from a starting location to a zone in a geographic region during a specified timeslot. The method further includes predicting travel demand based on a number of ride requests in the zone during the specified timeslot. The method further includes requesting transport of one or more vehicles to the zone in response to the predicted number of ride requests when the travel demand is predicted to exceed a number of vehicles in the zone during the specified timeslot.

Abstract: Embodiments are described for minimizing a wait time for a rider after sending a ride request for a vehicle. An example computer-implemented method includes receiving a ride request, the request being for travel from a starting location to a zone in a geographic region during a specified timeslot. The method further includes predicting travel demand based on a number of ride requests in the zone during the specified timeslot. The method further includes requesting transport of one or more vehicles to the zone in response to the predicted number of ride requests when the travel demand is predicted to exceed a number of vehicles in the zone during the specified timeslot.

Abstract: The present disclosure, in some embodiments, relates to a method of operating a resistive random access memory (RRAM) array. The method includes applying a word-line voltage to a selected word-line during a read operation. A non-zero voltage is applied to a selected bit-line during the read operation. A first voltage is applied to a selected source-line during the read operation. The first voltage is smaller than a second voltage applied to an unselected source-line during the read operation.

Abstract: A microelectromechanical system structure and a method for fabricating the same are provided. A method for fabricating a MEMS structure includes the following steps. A first substrate is provided, wherein a transistor, a first dielectric layer and an interconnection structure are formed thereon. A second substrate is provided, wherein a second dielectric layer and a thermal stability layer are formed on the second substrate. The first substrate is bonded to the second substrate, and the second substrate removed. A conductive layer is formed within the second dielectric layer and electrically connected to the interconnection structure. The thermal stability layer is located between the conductive layer and the interconnection structure. A growth temperature of a material of the thermal stability layer is higher than a growth temperature of a material of the conductive layer and a growth temperature of a material of the interconnection structure.

Abstract: A slurry solution for a Chemical Mechanical Polishing (CMP) process includes a wetting agent, a stripper additive that comprises at least one of: N-methyl-2-pyrrolidone (NMP), dimethyl sulfoxide (DMSO), sulfolane, and dimethylformamide (DMF), and an oxidizer additive comprising at least one of: hydrogen peroxide (H2O2), ammonium persulfate ((NH4)2S2O8), peroxymonosulfuric acid (H2SO5), ozone (O3) in de-ionized water, and sulfuric acid (H2SO4).

Abstract: A method for fabricating an integrated circuit is provided. The method includes depositing a first polish stop layer above a memory device, in which the first polish stop layer has a first portion over the memory device and a second portion that is not over the memory device; removing the second portion of the first polish stop layer; depositing an inter-layer dielectric layer over the first polish stop layer after removing the second portion of the first polish stop layer; and polishing the inter-layer dielectric layer until reaching the first portion of the first polish stop layer.

Abstract: A dual sensor module includes a substrate, a light source, a first encapsulant, a second encapsulant, a photodetector, and an electrode. The light source is disposed on the substrate. The first encapsulant is formed over the light source. The photodetector is disposed on the substrate. The second encapsulant is formed over the photodetector. The electrode is electrically connected to the substrate and is entirely located between the light source and the photodetector. A dual sensing accessory and a dual sensing device having the dual sensor module for detecting optical and electrical properties are also provided.

Abstract: Articles having a thermal imprinted adhesive on a substrate of a plurality of certain conicals have improved bonding strength.

Abstract: A method for controlling projectors includes identifying a first projector and a second projector by using a database, acquiring a first control code of the first projector and a second control code of the second projector after the first projector and the second projector are identified, and generating at least one control signal to the first projector and the second projector for controlling operational actions of the first projector and the second projector according to the first control code and the second control code.

Abstract: A apparatus includes a susceptor and a non-reactive gas source. The susceptor has through holes and a wafer support surface. Each through hole includes a lift pin and a lift pin head. The lift pin has a vertical degree of motion in the through hole to lift up or place a wafer on the susceptor. The lift pin head has at least one flow channel structure running from its first surface at least partially exposed to a bottom side of the susceptor through its second surface exposed to a top side of the susceptor wherein the lift pin. The non-reactive gas source is configured to flow a gas to a backside of the wafer through the flow channel structure through the bottom side of the susceptor.

Abstract: a dilatable balloon catheter, comprising: a guide wire inserted and disposed in the inside of the catheter, an operation portion is fixedly connected to one end of the catheter, a balloon is disposed at the outer side of the catheter remote from the operation portion, the lumen of the catheter and the inner cavity of the balloon are connected by a communication structure provided on the catheter, the guide wire includes a first guide wire and a second guide wire which are separated from each other, the rear end of the first guide wire is connected to insertion-extraction structure in the rear end of the operation portion, the second guide wire is fixed to the inside of the catheter by a fixing process.

Abstract: A MEMS structure includes a substrate, a dielectric layer, a membrane, a backplate, and a blocking layer. The substrate has a through-hole. The dielectric layer is disposed on the substrate and has a cavity in communication with the through-hole. The membrane has at least one vent hole, is embedded in the dielectric layer and together with the dielectric layer defines a first chamber that communicates with the through-hole. The backplate is disposed on the dielectric layer. One end of the blocking layer is embedded in the dielectric layer, and the other end of the blocking layer extends into the cavity; the blocking layer is spatially isolated from the membrane and at least partially overlaps with the at least one vent hole.

Abstract: A method, system, and computer program product, include receiving a plurality of requests for dynamic context information from a plurality of road segments, determining whether the plurality of road segments are included in a same cluster of road segments in a road network generated by clustering road segments in the road network based on connectivity of the road network; and consolidating the plurality of requests to generate a consolidated request in response to determining that the plurality of road segments are included in the same cluster.

Abstract: A method of processing a wafer is disclosed. The method includes, in some embodiments, causing a relative movement between a cleaning brush and a wafer. During the relative movement, a planar cleaning surface of the cleaning brush is brought into contact with a surface of the wafer to remove contaminants from the surface of the wafer. A first size of the cleaning brush, in a plan view, is larger than a second size of the wafer in the plan view.

Abstract: A MEMS structure includes a substrate, a dielectric layer, a membrane, a backplate, and a blocking layer. The substrate has a through-hole. The dielectric layer is disposed on the substrate and has a cavity in communication with the through-hole. The membrane has at least one vent hole, is embedded in the dielectric layer and together with the dielectric layer defines a first chamber that communicates with the through-hole. The backplate is disposed on the dielectric layer. One end of the blocking layer is embedded in the dielectric layer, and the other end of the blocking layer extends into the cavity; the blocking layer is spatially isolated from the membrane and at least partially overlaps with the at least one vent hole.

Abstract: A semiconductor sensor, comprising a gas-sensing device and an integrated circuit is provided. The gas-sensing device includes a substrate having a sensing area and an interconnection area in the vicinity of the sensing area, an inter-metal dielectric (IMD) layer formed above the substrate in the sensing area and in the interconnection area, and an interconnect structure formed in the interconnection area; further includes a sensing electrode, a second TiO2-patterned portion, and a second Pt-patterned portion on the second TiO2-patterned portion in the sensing area. The interconnect structure includes a tungsten layer buried in the IMD layer, wherein part of a top surface of the tungsten layer is exposed by at least a via. The interconnect structure further includes a platinum layer formed in said at least the via, a TiO2 layer formed on the IMD layer, a first TiO2-patterned portion and a first Pt-patterned portion.