Abstract: A fatigue alarm apparatus having a fatigue detector, a control unit and a stimulus alarm generator is illustrated. The fatigue detector detects whether a driver is drowsy. The control unit is electrically connected to the fatigue detector and the stimulus alarm generator. When the fatigue detector detects that the driver is drowsy, the stimulus alarm generator controlled by the control unit to generate two stimulus alarms having a rest time period therebetween, and then, after an interval period elapses, the control unit determines whether an alarming procedure of generating the two stimulus alarms is to be interrupted or repeated, wherein the rest time period is less than the interval period.

Abstract: A chemical-mechanical planarization (CMP) system includes a platen, a pad, a polish head, a rotating mechanism, a light source, and a detector. The pad is disposed on the platen. The polish head is configured to hold a wafer against the pad. The rotating mechanism is configured to rotate at least one of the platen and the polish head. The light source is configured to provide incident light to an end-point layer on the wafer. The detector is configured to detect absorption of the incident light by the end-point layer.

Abstract: The present application relates to the structure of a load-bearing column and a factory using the same. The load-bearing columns comprise a first column, a second column and a third column. The first column is a reinforced concrete column and is arranged on the underground floor. The second column is a pre-fabricated reinforced concrete column on the ground floor and is fixed to the top of the first column. The third column is fixed to the top of the second column, wherein the third column comprises a steel column and a third reinforcing bar assembly which surrounds the circumference of the steel column and extends from the bottom of the steel column in an axial direction to a predetermined distance.

Abstract: Embodiments of the present invention disclose a method, computer program product, and system for exposing more dissatisfied service requests through survey sample selection. The computer builds a user dissatisfaction model based on a plurality of historical survey results, and a plurality of historical service request information. The plurality of historic service request information includes at least one dissatisfaction metric, wherein the at least one dissatisfaction metric includes a total time spent resolving a problem, a total travel time, a total onsite time, a at least one part used, and/or a plurality of other metrics. The computer determines a probability of dissatisfaction for each of a plurality of service requests. The computer selects a survey sample that includes a plurality of dissatisfied users based on the determined probability of dissatisfaction for each of the plurality of service requests. The computer transmits a survey to each user of the survey sample.

Abstract: Systems and methods for obtaining vehicle operational data and driving context data from one or more monitoring systems, including converting the obtained vehicle operational data and driving context data into sequential vehicle operational feature data and sequential driving context feature data, calibrating the sequential vehicle operational feature data and the sequential driving context feature data temporally to form calibrated sequential vehicle operational feature data and calibrated sequential driving context feature data, constructing a sequence table of temporal sample points based on the calibrated sequential vehicle operational feature data and the calibrated sequential driving context feature data, feeding the sequence table into a deep neural network model for applying network learning to form a trained deep neural network model, extracting driving behavior features from the trained deep neural network model and analyzing the extracted driving behavior features to determine driving behavior char

Abstract: Provided herein is a method for manufacturing a semiconductor device. A substrate including a MEMS region and a connection region thereon is provided; a dielectric layer disposed on the substrate in the connection region is provided; a poly-silicon layer disposed on the dielectric layer is provided, wherein the poly-silicon layer serves as an etch-stop layer; a connection pad disposed on the poly-silicon layer is provided; and a passivation layer covering the dielectric layer is provided, wherein the passivation layer includes an opening that exposes the connection pad and a transition region between the connection pad and the passivation layer, and a conductive layer conformally covering the connection pad and the poly-silicon layer in the transition region is provided.

Abstract: A verification apparatus and a verification method are suitable for a touch display panel which comprises multiple partitions. The verification apparatus includes signal generating circuit and verification switch circuit. The signal generating circuit is configured to generate a verification voltage. The verification switch circuit comprises multiple switch units which are separately coupled to the partitions and the signal generating circuit, and are configured to deliver verification voltage simultaneously to at least two of multiple partitions.

Abstract: The methods, systems, and computer program products described herein provide optimized provisioning of replacement parts for service calls through the use of machine learning. In some aspects, historical hardware maintenance tickets may be processed to generate symptoms vectors identifying sets of symptoms associated with the hardware maintenance tickets. The symptoms vectors and corresponding parts usage records of the historical hardware maintenance tickets may be used train a decision model to predict a probability that a particular part will be used to fulfill the new hardware maintenance ticket. The predicted probability may be used by the system when generating a parts provisioning plan for the new hardware maintenance ticket.

Abstract: A chemical-mechanical planarization (CMP) system includes a platen, a pad, a polish head, a rotating mechanism, a light source, and a detector. The pad is disposed on the platen. The polish head is configured to hold a wafer against the pad. The rotating mechanism is configured to rotate at least one of the platen and the polish head. The light source is configured to provide incident light to an end-point layer on the wafer. The detector is configured to detect absorption of the incident light by the end-point layer.

Abstract: A apparatus includes a susceptor and a non-reactive gas source. The susceptor has through holes and a wafer support surface. Each through hole includes a lift pin and a lift pin head. The lift pin has a vertical degree of motion in the through hole to lift up or place a wafer on the susceptor. The lift pin head has at least one flow channel structure running from its first surface at least partially exposed to a bottom side of the susceptor through its second surface exposed to a top side of the susceptor wherein the lift pin. The non-reactive gas source is configured to flow a gas to a backside of the wafer through the flow channel structure through the bottom side of the susceptor.

Abstract: A microelectromechanical system structure and a method for fabricating the same are provided. A method for fabricating a MEMS structure includes the following steps. A first substrate is provided, wherein a transistor, a first dielectric layer and an interconnection structure are formed thereon. A second substrate is provided, wherein a second dielectric layer and a thermal stability layer are formed on the second substrate. The first substrate is bonded to the second substrate, and the second substrate removed. A conductive layer is formed within the second dielectric layer and electrically connected to the interconnection structure. The thermal stability layer is located between the conductive layer and the interconnection structure. A growth temperature of a material of the thermal stability layer is higher than a growth temperature of a material of the conductive layer and a growth temperature of a material of the interconnection structure.

Abstract: A method of processing a wafer is disclosed. The method includes, in some embodiments, causing a relative movement between a cleaning brush and a wafer. During the relative movement, a planar cleaning surface of the cleaning brush is brought into contact with a surface of the wafer to remove contaminants from the surface of the wafer. A first size of the cleaning brush, in a plan view, is larger than a second size of the wafer in the plan view.

Abstract: A method includes forming a first dielectric layer over a wafer, etching the first dielectric layer to form an opening, filling a tungsten-containing material into the opening, and performing a Chemical Mechanical Polish (CMP) on the wafer. After the CMP, a cleaning is performed on the wafer using a weak base solution.

Abstract: The present disclosure relates to an optical sensing accessory, an optical sensing device, and an optical sensing system. An optical sensing accessory, an optical sensing device, or an optical sensing system comprises a plurality of optical sensor modules and other electronic modules to achieve multi-site measurement. An optical sensor module comprises a light source, a photodetector, and a substrate. The light source is configured to convert electric power into radiant energy and emit light to an object surface. The photodetector is configured to receive the light from an object surface and convert radiant energy into electrical current or voltage. An optical sensing accessory, an optical sensing device, or an optical sensing system and comprise the optical sensor module and other electronic modules to have further applications.

Abstract: In a method of laying out abnormally-shaped grid decks, the abnormally-shaped grid decks refer to grid decks having a cut-out at the corner thereof. It is usually a problem when laying out abnormally-shaped grid decks because they will be off-balance when they are laid on the columns. Support frames are used to support the abnormally-shaped grid decks and keep them balanced and stable on the columns. However, the support frames may obstruct the working route used in construction. The method adopted in the present invention adds temporary beams to maintain the abnormally-shaped grid decks by balancing them on the columns before they are fixed and secured thereon, and thereafter the temporary beams will be removed. This method can prevent using support frames which may obstruct the working route under construction.

Abstract: Embodiments of the present disclosure relate to a new approach for image orientation detection. In the computer-implemented method, at least one character area in an image is sampled. The orientation of the sampled character area is determined, and the orientation of the image is determined based on the determined orientation of the sampled character area.

Abstract: A detecting device for detecting physiological parameters of a biological tissue includes a light source, at least one light detector, a package, an outer cover, and an optical microstructure. The light source is configured to emit a first beam and a second beam. The package is disposed on the light source and the light detector and is located on the transmission paths of the first and second beams. The outer cover covers the light source, the light detector and the package, and includes a top surface. The optical microstructure is located in the transmission paths of the first and second beams, and is arranged in parallel with the top surface of the outer cover. The optical microstructure includes at least one set of circles of different radii, and is made of a diffractive optical element, a holographic optical element, a computer-generated holographic element, a fresnel lens or a lens grating.

Abstract: Determining a characteristic of a configuration file that is used to discover configuration files in a target machine, a computer identifies, using information associated with a configuration item of a machine, a candidate configuration file related to the configuration item of the machine, from among a plurality of files from the machine. The computer extracts a value of a feature of the candidate configuration file and aggregates the candidate configuration file with a second candidate configuration file related to the same configuration item identified from among a plurality of files from a second machine, based on the extracted value. The computer then determines a configuration file related to the configuration item from among the aggregated candidate configuration files based on a result of the aggregation, and determines a characteristic of the configuration file related to the configuration item.

Abstract: Provided herein is a semiconductor device is provided. The semiconductor device includes a substrate including a MEMS region and a connection region thereon; a dielectric layer disposed on the substrate in the connection region; a poly-silicon layer disposed on the dielectric layer, wherein the poly-silicon layer serves as an etch-stop layer; a connection pad disposed on the poly-silicon layer; and a passivation layer covering the dielectric layer, wherein the passivation layer includes an opening that exposes the connection pad and a transition region between the connection pad and the passivation layer.

Abstract: The present disclosure provides a method for controlling a semiconductor deposition operation. The method includes (i) identifying a first target lifetime in a physical vapor deposition (PVD) system; (ii) inputting the first target lifetime into a processor; (iii) outputting, by the processor, a plurality of first operation parameters according to a plurality of compensation curves; and (iv) performing the first operation parameters in the PVD system. The first operation parameters includes, but not limited to, an RF power tuning, a DC voltage tuning, a target to chamber pedestal spacing tuning, an AC bias tuning, an impedance tuning, a reactive gas flow tuning, an inert gas flow tuning, a chamber pedestal temperature tuning, or a combination thereof.