Abstract: Amine substituted reverse pyrimidine compounds and forms thereof that inhibit the function and reduce the level of B-cell specific Moloney murine leukemia virus integration site 1 (Bmi-1) protein and methods for their use to inhibit Bmi-1 function and reduce the level of Bmi-1 to treat a cancer mediated by Bmi-1 are described herein.

Abstract: A crampon includes a crampon base for fitting to an underside of an item of footwear, such as a shoe or a boot. A harness extends from the crampon base and may be attached to the crampon base using rivets. The harness and the crampon base define a space for receiving the item of footwear. The crampon base comprises at least one cleat assembly with a cleat base embedded within the crampon base. One or more spikes extend from the cleat base.

Abstract: A resource display method includes: obtaining one or more target sub-videos of a target video; obtaining at least one key frame of any target sub-video based on image frames of the any target sub-video; dividing any key frame of the any target sub-video into a plurality of regions according to color clustering, and using a region that meets an area requirement in the plurality of regions as a candidate region of the any key frame; using candidate regions of key frames of the any target sub-video as candidate regions of the any target sub-video; and selecting a target region from candidate regions of the target sub-videos, and displaying a resource in the target region.

Abstract: A semiconductor device includes a semiconductor substrate, a semiconductor fin extending from the semiconductor substrate, a gate structure extending across the semiconductor fin, and source/drain semiconductor layers on opposite sides of the gate structure. The source/drain semiconductor layers each have a first thickness over a top side of the semiconductor fin and a second thickness over a lateral side of the semiconductor fin. The first thickness and the second thickness have a difference smaller than about 20 percent of the first thickness.

Abstract: The present invention relates to a method for preparing spherical cured polymer particles from a curable composition. The method comprises the steps of: dropping a curable composition onto a substrate having a water contact angle of 150° to 170° at 25° C. to form droplets of the curable composition; and curing the droplets to form the polymer particles.

Abstract: A semiconductor structure includes a substrate including a first region and a second region, a first channel layer disposed in the first region and a second channel layer disposed in the second region, a first dielectric layer disposed on the first channel layer and a second dielectric layer disposed on the second channel layer, and a first gate electrode disposed on the first dielectric layer and a second gate electrode disposed on the second dielectric layer. The first channel layer in the first region includes Ge compound of a first Ge concentration, the second channel layer in the second region includes Ge compound of a second Ge concentration. The first Ge concentration in the first channel layer is greater than the second Ge concentration in the second channel layer.

Abstract: The present disclosure relates to the field of wearable devices, and in particular to a connector for a wearable device, an assistive device, a wearable device, and a kit. The connector comprises a first connecting component and a second connecting component, wherein the first connecting component comprises a first engaging member, the second connecting component comprises a second engaging member, and the first connecting component and the second connecting component are connected to each other by means of the mating between the first engaging member and the second engaging member and can rotate relative to each other into a separable position and an engaged position. The connector of the present disclosure can solve the technical problem that the mounting angle of the assistive device relative to the wearable device cannot be flexibly and conveniently adjusted and cannot be maintained in each adjustment shift.

Abstract: A cooking apparatus and a control method thereof, and more particularly, technology for determining the type of vessel placed in the cooking apparatus and controlling power in response to a state change of the placed vessel or a temperature change of a coil. In accordance with one aspect, a cooking apparatus includes: a coil on which a vessel is placed, configured to form a magnetic field upon application of a current; a detection sensor configured to detect a magnitude of an input current applied differently according to a type of the vessel and a magnitude of an input voltage of the cooking apparatus; and a controller configured to determine a type of the placed vessel according to a power value calculated based on the detected input current and input voltage, and to determine a heating mode of the cooking apparatus based on the determined type of vessel.

Abstract: A semiconductor device includes a stacked structure on a substrate. The stacked structure includes stepped regions and a central region between the stepped regions, an upper insulation layer on the stacked structure, and a capping insulation layer on the stepped regions of the stacked structure. The capping insulation layer includes a first upper end portion and a second upper end portion that are adjacent to the upper insulation layer. The upper insulation layer is between the first upper end portion and the second upper end portion. The first upper end portion and the second upper end portion extends a first height relative to the substrate that is different from a second height relative to the substrate of the second upper end portion.

Abstract: The present invention relates to a super absorbent polymer and a method for preparing the same. According to the method for preparing a super absorbent polymer of the present invention, the super absorbent polymer +having improved absorption capacity and permeability can be prepared.

Abstract: The present disclosure discloses an atmospheric-pressure plasma equipment for fabric functional finishing and its application, and belongs to the field of textile printing and dyeing engineering. The atmospheric-pressure plasma equipment, including a discharging system, a grafting instrument and a cloth guider, can conduct continuous plasma treatment on fabrics under an atmospheric pressure, including plasma etching and plasma grafting, which breaks through the disadvantage of batch processing of vacuum plasma equipment. The equipment and method of the present disclosure realize functional finishing of the fabrics in the absence of water, and this finishing process is cost efficient, environmentally friendly, uniform, shorter treatment time and higher reactivity, and applicable to many materials and can keep the bulk properties of the treated substances.

Abstract: The present disclosure relates to the field of wearable devices, and in particular to a connector for a wearable device, an assistive device, a wearable device, and a kit. The connector comprises a first connecting component and a second connecting component, wherein the first connecting component comprises a first engaging member, the second connecting component comprises a second engaging member, and the first connecting component and the second connecting component are connected to each other by means of the mating between the first engaging member and the second engaging member and can rotate relative to each other into a separable position and an engaged position. The connector of the present disclosure can solve the technical problem that the mounting angle of the assistive device relative to the wearable device cannot be flexibly and conveniently adjusted and cannot be maintained in each adjustment shift.

Abstract: The super absorbent polymer comprises: a base polymer powder including a first crosslinked polymer of a water-soluble ethylenically unsaturated monomer having at least partially neutralized acidic groups; and a surface crosslinked layer formed on the base polymer powder and including a second crosslinked polymer in which the first crosslinked polymer is further crosslinked via a surface crosslinking agent, wherein the super absorbent polymer has: a fixed height absorption (FHA) of 22.5 g/g to 29 g/g, a saline flow conductivity (SFC) of 35 (·10?7 cm3·s/g) or more, and T-20 of 180 seconds or less.

Abstract: Provided is an apparatus for extracting water from a condenser to the outside for water quality analysis. The apparatus includes an insertion pipe inserted into a condenser, a screw thrust portion including a rotating shaft inserted into the insertion pipe, a screw coupled to one end of the rotating shaft, and a screw thrust portion comprising a power providing portion configured to transmit power to the rotating shaft, and an exhaust pipe provided in the insertion pipe to introduce the water to flow to the outside of the condenser when the water contained in the condenser flows toward a rear side of the screw according to a rotation of the screw.

Abstract: A semiconductor structure includes a substrate including a first region and a second region, a first channel layer disposed in the first region and a second channel layer disposed in the second region, a first dielectric layer disposed on the first channel layer and a second dielectric layer disposed on the second channel layer, and a first gate electrode disposed on the first dielectric layer and a second gate electrode disposed on the second dielectric layer. The first channel layer in the first region includes Ge compound of a first Ge concentration, the second channel layer in the second region includes Ge compound of a second Ge concentration. The first Ge concentration in the first channel layer is greater than the second Ge concentration in the second channel layer.

Abstract: A semiconductor includes a substrate, a semiconductor fin, an STI structure, a fin sidewall spacer, and a doped silicon layer. The semiconductor fin extends from the substrate. The STI structure laterally surrounds a lower portion of the semiconductor fin. The fin sidewall spacer extends along a middle portion of the semiconductor fin that is above the lower portion of the semiconductor fin. The doped silicon layer wraps around three sides of an upper portion of the semiconductor fin that is above the middle portion of the semiconductor fin.

Abstract: A three-dimensional semiconductor memory device including a peripheral circuit structure on a first substrate, the peripheral circuit structure including peripheral circuits, a second substrate on the peripheral circuit structure, an electrode structure on the second substrate, the electrode structure including a plurality of electrodes that are stacked on the second substrate and a penetrating interconnection structure penetrating the electrode structure and the second substrate may be provided. The penetrating interconnection structure may include a lower insulating pattern, a mold pattern structure on the lower insulating pattern, a protection pattern between the lower insulating pattern and the mold pattern structure, and a penetration plug. The penetration plug may penetrate the mold pattern structure and the lower insulating pattern and may be connected to the peripheral circuit structure. The protection pattern may be at a level lower than that of the lowermost one of the electrodes.

Abstract: Provided is a power plant operation history device. The power plant operation history device includes: a communication unit configured to detect RFID of a wearable device and communicate with a signal conversion device; and a control unit configured to determine a power plant control authority of a user based on user identification information obtained through the communication unit, transmit an operation permission signal allowing operation of an input device of a power plant control facility control device to the signal conversion device when it is determined that the user's power plant control authority exists, and normally process a user input from the input device through the signal conversion device.

Abstract: Disclosed herein is a cooking apparatus including a cooking plate, induction heating coils installed under the cooking plate, a vessel sensor configured to detect a cooking vessel while the cooking vessel is placed on the cooking plate, a driving assembly including a driving circuit configured to generate a driving current and distribute the driving current to each of the induction heating coils, and a sub assembly including a vessel sensing circuit configured to determine one or more of the induction heating coils overlapping the cooking vessel based on an output of the vessel sensor. The sub assembly may be separated from the driving assembly.