Abstract: The present disclosure provides a system for signal optimization adjustment based on different heat source information. The system includes a plurality of heat source measurers, a first system chip, a second system chip, an electrical interconnection, and a bit error risk evaluator. The first system chip includes a signal transmitter, and the second system chip includes a signal receiver. The second system chip provides an electrical characteristic state of the signal receiver, and a signal adjustment information of the signal transmitter and/or the signal receiver. The bit error risk evaluator performs a signal optimization adjustment for an electrical characteristic of the signal receiver according to the electrical characteristic state. The present disclosure further provides a method for signal optimization adjustment.

Abstract: The present invention provides a multi-degree-of-freedom conductor depositing system for tokamak toroidal field coil winding packs, belongs to the field of development of toroidal field superconducting coils for nuclear fusion. The multi-degree-of-freedom conductor depositing system is mounted on a winding table and distributed along the contour of the toroidal field coil. The optical proximity switches detect the position signals between the winding table and the bending unit and transmit them to an automatic control system. The multi-degree-of-freedom conductor depositing system is distributed in a spiral shape from the top to the bottom from the position of the bending unit along the direction of coil winding. The conductor is deposited onto the track drive mechanism of the multi-degree-of-freedom conductor depositing device, which has a bidirectional moving and rotating function.

Abstract: A semiconductor device and methods of manufacture are discussed herein. A device includes a first semiconductor package including a first semiconductor die encapsulated in an insulating material, a first thermal expansion resistant layer over the first semiconductor die, a bonding layer over the first thermal expansion resistant layer and the insulating material, and a second semiconductor die directly bonded to the bonding layer.

Abstract: Provided in the invention are a catalyst for preparing phosgene and a preparation method therefor, and a method for the preparation of phosgene and the comprehensive utilization of energy thereof. The preparation method comprises the following steps: 1) stirring and soaking activated carbon in a modifying solution, then adding dimethyltin dichloride and chromium oxide powders and carrying out a reaction, and then adding a nickel oxide fine powder and ultrasonically oscillating same to prepare a pre-modified activated carbon; 2) drying the pre-modified activated carbon; and 3) heating and calcinating the dried pre-modified activated carbon from step 2) to prepare the catalyst.

Abstract: A stacking structure including a first die, a second die stacked on the first die, and a third die and a fourth die disposed on the second die. The first die has a first metallization structure, and the first metallization structure includes first through die vias. The second die has a second metallization structure, and second metallization structure includes second through die vias. The first through die vias are bonded with the second through die vias, and sizes of the first through die vias are different from sizes of the second through die vias. The third and fourth dies are disposed side-by-side and are bonded with the second through die vias.

Abstract: Provided is packages and method of fabricating the same. The package includes a first die, a second die, and an inductor. The second die is bonded to the first die through a bonding structure thereof. The inductor is located in the bonding structure. The inductor includes a spiral pattern parallel to top surfaces of the first die and the second die, and the spiral pattern includes at least a turn.

Abstract: The disclosure provides a display panel, a compensation of brightness method and a displaying device. The display panel comprises an array substrate, a luminescent layer, a plurality of optical film layers and a photoelectric sensor, wherein the luminescent layer is located on one side of the array substrate, the array substrate is used for driving the luminescent layer to emit light, the optical film layers are located on a side, away from the array substrate, of the luminescent layer, light emitted by the luminescent layer forms optical waveguide on the array substrate and/or the optical film layers, and the photoelectric sensor is used for acquiring the optical waveguide to perform compensation of brightness on the light emitted by the luminescent layer according to data of the optical waveguide.

Abstract: A package structure including a bottom die, a first die, a second die, an encapsulant and a first dummy structure is provided. The first die and a second die are bonded to a first side of the bottom die. The encapsulant laterally encapsulates the first die and the second die. The first dummy structure is bonded to the first side of the bottom die, wherein a sidewall of the first dummy structure is coplanar with a first sidewall of the bottom die.

Abstract: Computer implemented methods and systems are provided that comprise, under control of one or more processors of a medical device, where the one or more processors are configured with specific executable instructions. The methods and systems include sensing circuitry configured to define a sensing channel to collect biological signals, memory configured to store program instructions, a processor configured to implement the program instructions to at least one of analyze the biological signals, manage storage of the biological signals or deliver a therapy, and communication circuitry configured to wirelessly communicate with at least one other implantable or external device, the communication circuitry configured to transition between a sleep state, a partial awake state and a fully awake state.

Abstract: The present disclosure relates to a differential pressure driven burst-pipeline emergency blocking system. The system includes a valve body with flanges on opposite axial ends, a cylindrical valve sleeve connected with the inner wall of a flange end and having a through-hole in the valve sleeve wall. The wall of the valve sleeve is in movable fit with a valve spool having a U-shaped section. The working fluid through-hole in the valve sleeve is communicated with the inner chamber of the valve body and can be closed by a cylindrical surface of the valve spool. A horizontal push rod is in movable fit with a central hole at the left end of the valve spool, and opposite ends of the horizontal push rod are in movable fit with axial orifices of left and right support seats in the valve body respectively.

Abstract: A method of encoding quantum information on one or several degrees of freedom of coherent states of photons of a baseband input optical signal, a quantum transmitter, and a computer-readable medium. The quantum transmitter comprises a modulator configured to encode quantum information on one or several degrees of freedom of coherent states of photons of a baseband input optical signal using sideband modulation of the baseband optical input signal.

Abstract: The embodiments of the application discloses a method and apparatus for pose estimation, and an electronic device. A specific implementation of the method includes: obtaining an observation information sequence corresponding to a human target part, wherein the human target part comprises at least one of the following: a head and a hand; determining an initial human joint point feature based on the observation information sequence; and performing feature interaction based on the initial human joint point feature, and estimating a human pose using an interaction feature, so as to obtain human pose information. This implementation makes the estimated human pose more accurate and realistic.

Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.

Abstract: A structured light projection system is provided. The structured light projection system includes a condenser lens group, a light source, a mask, an imaging component, and a holder. The condenser lens group includes a first end and a second end. The light source is disposed on the first end of the condenser lens group. The light source emits a light. The imaging component projects the light passing through the mask onto a target element. The holder is disposed on the second end of the condenser lens group. The holder holds the mask and the imaging component. The light emitted by the light source sequentially passes through the condenser lens group, the mask, and the imaging component.

Abstract: A wafer processing system (1) is provided. The system (1) includes a processing tool (10) comprising at least one grinding member (16) used to remove material from a wafer substrate (80). The system (1) also includes an electrolyte supply line (361) used to supply an electrolyte to the wafer substrate (80). The system (1) further includes a holding module (20) for holding the wafer substrate (80). The holding module (20) includes a conductive base (21) and a conductive porous member (22) positioned on the top surface of the conductive base (21). A vacuum source (53) fluidly communicated with fluid channel (214) formed in the conductive base (21) to create a vacuum to hold the wafer substrate (80) on the conductive porous member (22).

Abstract: A work piece processing system includes a grinding wheel (12) configured to remove material from a work piece in a grinding process. The grinding wheel (12) includes a conductive layer (122) surrounding a rotation axis of the grinding wheel (12) and a number of grinding members (123) positioned at an outer surface of the conductive layer (122). The system also includes a holding module (20) and an electrolyte supply line (365). In addition, the system includes an actuator assembly (30) for driving a rotation of the grinding wheel (12) and a rotation of the holding module (20), and a power supply module (45) to apply current to the conductive layer (122) and the holding module (20). The work piece processing system uses electrochemical removal to reduce grinding damage and improve machining efficiency. A work piece processing method is also provided.

Abstract: A stacking structure including a first die and a second die bonded with the first die is provided. The first die has a first region and a second region encircled by the first region. The first die includes first metallization structures having a first seal ring structure and a first bonding structure having first dummy pads located over the first seal ring structure. The second die includes second metallization structures having a second seal ring structure and a second bonding structure having second dummy pads located over the second seal ring structure. The first die and the second die are bonded through bonding of the first and second bonding structures. The first and second seal ring structures are substantially vertically aligned, and the first dummy pads are respectively bonded with the second dummy pads.

Abstract: The disclosed technology is directed to a computing device for detecting and preventing melting of a component of the computing device. In some examples, the computing device includes a cable that connects a power supply unit and an add-on card, and a thermal protection controller. Based on a sensor signal from a temperature sensor of the cable, the thermal protection controller determines that a temperature associated with the cable exceeds a threshold temperature. Responsive to determining that the temperature associated with the cable exceeds the threshold temperature, the thermal protection controller causes the power supply unit to cease supplying power to the add-on card by transmitting an overtemperature signal through the cable.

Abstract: Sacrificial pillars for a semiconductor device assembly, and associated methods and systems are disclosed. In one embodiment, a region of a semiconductor die may be identified to include sacrificial pillars that are not connected to bond pads of the semiconductor die, in addition to live conductive pillars connected to the bond pads. The region with the sacrificial pillars, when disposed in proximity to the live conductive pillars, may prevent an areal density of the live conductive pillars from experiencing an abrupt change that may result in intolerable variations in heights of the live conductive pillars. As such, the sacrificial pillars may improve a coplanarity of the live conductive pillars by reducing variations in the heights of the live conductive pillars. Thereafter, the sacrificial pillars may be removed from the semiconductor die.

Abstract: In some examples, a system detects disabling of a driver of a storage control feature included in a main processor of the system, where the storage control feature to manage access of a storage device. In response to detecting the disabling of the driver of the storage control feature included in the main processor, the system initiates a remediation action to prevent a fault in the system.