Abstract: A method of bonding a light-emitting diode (LED) with a substrate includes providing a LED disposed on a bottom surface of a LED substrate; forming a first isolating layer entirely on a substrate; forming a second isolating layer on the first isolating layer within a first area corresponding to an N-type contact pad of the LED; forming a first conductive layer on the second isolating layer within the first area; forming a second conductive layer on the first isolating layer within a second area corresponding to a P-type contact pad of the LED; and bonding the LED to the substrate by connecting the N-type contact pad to the first conductive layer within the first area, and connecting the P-type contact pad to the second conductive layer within the second area.

Abstract: A fan device is provided, including a housing, a circuit board, a plurality of driving coils, at least one magnetic member, and a metal member. The housing includes a first surface, a second surface corresponding to the first surface, and a hollow protruding portion protruding from the first surface. The circuit board is disposed on the first surface, and the driving coils are disposed on the circuit board. The magnetic member is disposed corresponding to the driving coils. The metal member is disposed on the second surface and corresponds to the magnetic member. A method for manufacturing the fan device is also provided.

Abstract: A vacuum transfer device includes a semiconductor substrate, which has a first hole disposed in a top portion of the semiconductor substrate; a nozzle disposed in a bottom portion of the semiconductor substrate and protruding downward, the nozzle being aligned with the first hole; and a second hole disposed through the nozzle and in the semiconductor substrate to meet the first hole.

Abstract: A semiconductor package includes a semiconductor chip and a redistribution layer structure. The redistribution layer structure is arranged to form an antenna transmitter structure and an antenna receiver structure over the semiconductor chip, wherein patterns of the antenna receiver structure are located at different levels of the redistribution layer structure, and at least one pattern of the antenna transmitter structure is at the same level of the topmost patterns of the antenna receiver structure.

Abstract: A power over Ethernet device is provided. The power over Ethernet device includes a first Ethernet connector, an Ethernet transformer circuit, and a detection circuit. The first Ethernet connector is coupled to a second Ethernet connector of a network device via an Ethernet cable and has a first reserve pin and a second reserve pin. The Ethernet transformer circuit is coupled to the first Ethernet connector to provide a supply voltage to the Ethernet cable to transfer the supply voltage to the network device. The detection circuit receives the supply voltage and is coupled to the Ethernet transformer circuit, the first reserve pin, and the second reserve pin to provide a reference voltage to the first reserve pin and receives an identification voltage from the second reserve pin to determine whether the network device is a powered device.

Abstract: A semiconductor device including a chip package, a dielectric structure and a first antenna pattern is provided. The dielectric structure disposed on the chip package and includes a cavity and a vent in communication with the cavity. The first antenna pattern disposed on the dielectric structure, wherein the chip package is electrically coupled to the first antenna pattern, and the cavity of the dielectric structure is disposed between the chip package and the first antenna pattern. A manufacturing method of a semiconductor device is also provided.

Abstract: A package structure includes a die, an encapsulant, and a first redistribution structure. The die has an active surface and a rear surface opposite to the active surface. The die includes a ground plane within the die. The encapsulant encapsulates the die. The first redistribution structure is over the active surface of the die. The first redistribution structure includes an antenna pattern electrically coupled with the ground plane. The antenna pattern is electrically connected to the die.

Abstract: A micro device transfer system includes a transfer head having pick-up electrodes for picking micro devices and thin-film transistors (TFTs) corresponding to the pick-up electrodes; a transfer head holder for holding the transfer head; a TFT driver board electrically connected to control the TFTs; a donor or acceptor substrate for carrying the micro devices; and a substrate holder for holding the donor or acceptor substrate.

Abstract: A method for managing power during communication with an implantable medical device, including establishing a communications link, utilizing a power corresponding to a session start power, to initiate a current session between an implantable medical device (IMD) and external device. A telemetry break condition of the communications link is monitored during the current session. The power utilized by the IMD is adjusted between low and high power levels, during the current session based on the telemetry break condition. The number of sessions is counted, including the current session and one or more prior sessions, in which the IMD utilized the higher power level, and a level for the session start power to be utilized to initiate a next session following the current session is adaptively learned based on the counting of the number of sessions.

Abstract: A semiconductor device includes a substrate and a bump. The substrate includes a first surface and a second surface. A notch is at the second surface and at a sidewall of the substrate. A depth of the notch is smaller than about half the thickness of the substrate. The bump is disposed on the first surface of the substrate.

Abstract: A light-emitting diode display is provided. The light-emitting diode display includes a substrate, a plurality of wires, a plurality of light-emitting areas, and at least one driver IC. The plurality of wires are formed on the substrate. The plurality of light-emitting areas include a light-emitting diode area and a virtual area. The plurality of light-emitting areas are arranged in a matrix. The virtual area of the plurality of light-emitting areas corresponds to each other. The driver IC is formed on the virtual area of the plurality of the light-emitting areas or on the plurality of the light-emitting areas.

Abstract: Methods and systems are provided to manage display of cardiac signals. The methods and systems receive a first data steam along a first communications path conveyed with first throughput and receiving a second data stream along a second communications path transmitted with second throughput. The first and second throughputs are asynchronous with respect to one another. The first and second data streams carry cardiac signals sensed by external and implanted electrodes, respectively, for one or more common events. The methods and systems store data from the first and second data streams in first and second memory buffers. The methods and systems synchronize the data stored in the first and second memory buffers with one another by performing at least one of: temporally offsetting activation of the storing operation for the first and second data streams with respect to one another; or managing an amount of the data maintained in at least one of the first memory buffer or the second memory buffer.

Abstract: A bottom emission microLED display includes a microLED disposed above a transparent substrate; a light guiding layer surrounding the microLED to controllably guide light generated by the microLED towards the transparent substrate; and a reflecting layer formed over the light guiding layer to reflect the light generated by the microLED downwards and to confine the light generated by the microLED to prevent the light from leaking upwards or sidewards.

Abstract: In one example, touchpad assembly is disclosed, which may include a bottom cover, a horizontal elastic member flexibly positioned on the bottom cover, a balancing bar disposed on the bottom cover and substantially parallel to the horizontal elastic member, and a metal dome. The metal dome may include a first end fixedly connected to the bottom cover via a first fixture, and a second end to hold the horizontal elastic member and the balancing bar such that the balancing bar is flexibly engaged with the bottom cover. The balancing bar, the metal dome, and the horizontal elastic member may control a flexure of a touchpad when the touchpad is pressed.

Abstract: A method of forming semiconductor structure includes attaching backsides of top dies to a front side of a bottom wafer, the bottom wafer comprising a plurality of bottom dies; forming first conductive pillars on the front side of the bottom wafer adjacent to the top dies; forming a first dielectric material on the front side of the bottom wafer around the top dies and around the first conductive pillars; and dicing the bottom wafer to form a plurality of structures, each of the plurality of structures comprising at least one of the top dies and at least one of the bottom dies.

Abstract: A method, system and external instrument are provided. The method initiates a communication link between an external instrument (EI) and an implantable medical device (IMD), established a first connection interval for conveying data packets between the EI and IMD and monitors a connection criteria that includes at least one of a data throughput requirement. A battery indicator or link condition of the communications link is between the IMD and EI. The method further changes from the first connection interval to a second connection interval based on the connection criteria.

Abstract: In accordance with some embodiments, a package structure includes an RFIC chip. an insulating encapsulation, a redistribution circuit structure, an antenna and a microwave director. The insulating encapsulation encapsulates the RFIC chip. The redistribution circuit structure is disposed on the insulating encapsulation and electrically connected to the RFIC chip. The antenna is disposed on the insulating encapsulation and electrically connected to the RFIC chip through the redistribution circuit structure. The antenna is located between the microwave director and the RFIC chip. The microwave director has a microwave directivity enhancement surface located at a propagating path of a microwave received or generated by the antenna.

Abstract: A temperature plate device includes a plate body and a bent supporting structure. The plate body includes a first plate and a second plate. A chamber is defined by the first plate and the second plate. The first plate has a first step section. The second plate has a second step section corresponding to the first step section. The bent supporting structure is connected to and traverses the first step section between the first step section and the second step section.

Abstract: A liquid-cooling device and an air collector thereof are provided. The air collector includes a tank, an inlet channel, an outlet channel, and a barrier plate. The inlet channel is located at one end of the tank and extended into the tank. The outlet channel is located at the other end of the tank and extended into the tank. The barrier plate is located in the tank between the inlet channel and the outlet channel. The diameter of the tank is greater than those of the inlet channel and the outlet channel.

Abstract: A method and device for managing establishment of a communications link between an external instrument (EI) and an implantable medical device (IMD) are provided. The method stores, in a memory in at least one of the IMD or the EI, a base scanning schedule that defines a pattern for scanning windows over a scanning state. The method enters the scanning state during which a receiver scans for advertisement notices during the scanning windows. At least a portion of the scanning windows are grouped in a first segment of the scanning state. The method stores, in the memory, a scan reset pattern for restarting the scanning state. Further, the method automatically restarts the scanning state based on the scan reset pattern to form a pseudo-scanning schedule that differs from the base scanning schedule and establishes a communication session between the IMD and the EI.