Patents by Inventor Chao-Wen (Kevin) Chen

Chao-Wen (Kevin) Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Portable electronic device and pivoting assembly
    Patent number: 10281958
    Abstract: A portable electronic device includes a first body, a second body, a pivoting mechanism, a linking mechanism, and a first speaker unit. The pivoting mechanism is pivoted between the first body and the second body and includes a first rotating shaft, a second rotating shaft, and a third rotating shaft, and the third rotating shaft has a mounting portion. The linking mechanism includes a first rolling member and a second rolling member. The first rolling member is connected to the third rotating shaft of the pivoting mechanism, and the second rolling member is connected to the second rotating shaft of the pivoting mechanism. The first rolling member and the second rolling member roll relative to each other within an angle range. The first speaker unit is fixed to the mounting portion.
    Type: Grant
    Filed: August 24, 2018
    Date of Patent: May 7, 2019
    Assignee: PEGATRON CORPORATION
    Inventors: Chia-Liang Chiang, Yu-Ju Lin, Ching-Hao Yu, Hui-Hsiu Hsu, Yuan-Cyuan Wei, Chao-Wen Lai
  • RADIO FREQUENCY APPARATUS AND RADIO FREQUENCY IDENTIFICATION TAG DETECTION METHOD THEREOF
    Publication number: 20190130144
    Abstract: A radio frequency apparatus and a radio frequency identification (RFID) tag detection method are provided. The radio frequency apparatus includes a reader and an RFID tag. The reader includes a first coil and a plurality of second coils. The first coil supports a first frequency band. Each second coil supports a second frequency band. The second frequency band is different from the first frequency band, and the second coils are spaced away from each other and do not overlap each other. The RFID tag includes a first and a second radio frequency circuits which supports the first frequency band and the second frequency band respectively. The first radio frequency circuit can communicate with the first coil by using the first frequency band. The second radio frequency circuit can communicate with at least one of the second coils by using the second frequency band.
    Type: Application
    Filed: April 19, 2016
    Publication date: May 2, 2019
    Applicant: Nyquest Corporation Limited
    Inventors: Ying-Jie HUANG, Chao-Wen CHI, Bang-Jian CHIANG
  • Managing dynamic connection intervals for implantable and external devices
    Patent number: 10278217
    Abstract: A method, system and external instrument are provided. The method initiates a communication link between an external instrument (EI) and an implantable medical device (IMD), established a first connection interval for conveying data packets between the EI and IMD and monitors a connection criteria that includes at least one of a data throughput requirement. A battery indicator or link condition of the communications link is between the IMD and EI. The method further changes from the first connection interval to a second connection interval based on the connection criteria.
    Type: Grant
    Filed: August 14, 2017
    Date of Patent: April 30, 2019
    Assignee: Pacesetter, Inc.
    Inventors: Yongjian Wu, Chao-Wen Young, Jun Yang, Xing Pei, Reza Shahandeh
  • Package structure, electronic device and method of fabricating package structure
    Patent number: 10276920
    Abstract: In accordance with some embodiments, a package structure includes an RFIC chip. an insulating encapsulation, a redistribution circuit structure, an antenna and a microwave director. The insulating encapsulation encapsulates the RFIC chip. The redistribution circuit structure is disposed on the insulating encapsulation and electrically connected to the RFIC chip. The antenna is disposed on the insulating encapsulation and electrically connected to the RFIC chip through the redistribution circuit structure. The antenna is located between the microwave director and the RFIC chip. The microwave director has a microwave directivity enhancement surface located at a propagating path of a microwave received or generated by the antenna.
    Type: Grant
    Filed: September 28, 2017
    Date of Patent: April 30, 2019
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Min-Chien Hsiao, Chen-Hua Yu, Chung-Shi Liu, Chao-Wen Shih, Shou-Zen Chang
  • Semiconductor structure and manufacturing method thereof
    Patent number: 10269904
    Abstract: The present disclosure provides a semiconductor structure. The semiconductor structure includes a circuit region, a seal ring region and an assembly isolation region. The circuit region includes a first conductive layer. The seal ring region includes a second conductive layer. The assembly isolation region is between the circuit region and the seal ring region. The first conductive layer and the second conductive layer respectively include a portion extending into the assembly isolation region thereby forming an electric component in the assembly isolation region.
    Type: Grant
    Filed: October 31, 2014
    Date of Patent: April 23, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Chen-Hua Yu, Mirng-Ji Lii, Hung-Yi Kuo, Hao-Yi Tsai, Tsung-Yuan Yu, Min-Chien Hsiao, Chao-Wen Shih
  • SEMICONDUCTOR PACKAGES AND MANUFACTURING MEHTODS THEREOF
    Publication number: 20190115271
    Abstract: Sensor packages and manufacturing methods thereof are disclosed. One of the sensor packages includes a semiconductor chip and a redistribution layer structure. The semiconductor chip has a sensing surface. The redistribution layer structure is arranged to form an antenna transmitter structure aside the semiconductor chip and an antenna receiver structure over the sensing surface of the semiconductor chip.
    Type: Application
    Filed: December 14, 2018
    Publication date: April 18, 2019
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yung-Ping Chiang, Chao-Wen Shih, Shou-Zen Chang, Albert Wan, Yu-Sheng Hsieh
  • PORTABLE ELECTRONIC DEVICE AND PIVOTING ASSEMBLY
    Publication number: 20190107867
    Abstract: A portable electronic device includes a first body, a second body, a pivoting mechanism, a linking mechanism, and a first speaker unit. The pivoting mechanism is pivoted between the first body and the second body and includes a first rotating shaft, a second rotating shaft, and a third rotating shaft, and the third rotating shaft has a mounting portion. The linking mechanism includes a first rolling member and a second rolling member. The first rolling member is connected to the third rotating shaft of the pivoting mechanism, and the second rolling member is connected to the second rotating shaft of the pivoting mechanism. The first rolling member and the second rolling member roll relative to each other within an angle range. The first speaker unit is fixed to the mounting portion.
    Type: Application
    Filed: August 24, 2018
    Publication date: April 11, 2019
    Applicant: PEGATRON CORPORATION
    Inventors: Chia-Liang Chiang, Yu-Ju Lin, Ching-Hao Yu, Hui-Hsiu Hsu, Yuan-Cyuan Wei, Chao-Wen Lai
  • PACKAGE STRUCTURE
    Publication number: 20190103652
    Abstract: A package structure including an insulating encapsulation, at least one semiconductor die, at least one first antenna and at least one second antenna is provided. The insulating encapsulation includes a first portion, a second portion and a third portion, wherein the second portion is located between the first portion and the third portion. The at least one semiconductor die is encapsulated in the first portion of the insulating encapsulation, and the second portion and the third portion are stacked on the at least one semiconductor die. The at least one first antenna is electrically connected to the at least one semiconductor die and encapsulated in the third portion of the insulating encapsulation. The at least one second antenna is electrically connected to the at least one semiconductor die and encapsulated in the second portion of the insulating encapsulation.
    Type: Application
    Filed: January 25, 2018
    Publication date: April 4, 2019
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Nan-Chin Chuang, Chen-Hua Yu, Chung-Shi Liu, Chao-Wen Shih, Shou-Zen Chang
  • SEMICONDUCTOR PACKAGE STRUCTURE
    Publication number: 20190096828
    Abstract: A semiconductor package structure including an encapsulation body, an RFIC chip, a first antenna structure, and a second antenna structure is provided. The RFIC chip may be embedded in the encapsulation body. The first antenna structure may be disposed at a lateral side of the RFIC chip, electrically connected to the RFIC chip, and include a first conductor layer and a plurality of first patches opposite to the first conductor layer. The second antenna structure may be stacked on the RFIC chip, electrically connected to the RFIC chip, and include a second conductor layer and a plurality of second patches opposite to the second conductor layer. The first patches and the second patches are located at a surface of the encapsulation body. A first distance between the first conductor layer and the first patches is different from a second distance between the second conductor layer and the second patches.
    Type: Application
    Filed: September 28, 2017
    Publication date: March 28, 2019
    Inventors: Kai-Chiang Wu, Chun-Lin Lu, Chao-Wen Shih, Han-Ping Pu, Nan-Chin Chuang
  • PACKAGE STRUCTURE, ELECTRONIC DEVICE AND METHOD OF FABRICATING PACKAGE STRUCTURE
    Publication number: 20190097304
    Abstract: In accordance with some embodiments, a package structure includes an RFIC chip. an insulating encapsulation, a redistribution circuit structure, an antenna and a microwave director. The insulating encapsulation encapsulates the RFIC chip. The redistribution circuit structure is disposed on the insulating encapsulation and electrically connected to the RFIC chip. The antenna is disposed on the insulating encapsulation and electrically connected to the RFIC chip through the redistribution circuit structure. The antenna is located between the microwave director and the RFIC chip. The microwave director has a microwave directivity enhancement surface located at a propagating path of a microwave received or generated by the antenna.
    Type: Application
    Filed: September 28, 2017
    Publication date: March 28, 2019
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Min-Chien Hsiao, Chen-Hua Yu, Chung-Shi Liu, Chao-Wen Shih, Shou-Zen Chang
  • WAVEFRONT TESTING SYSTEM
    Publication number: 20190086290
    Abstract: An optical wavefront testing system includes a light source, an image capturing unit and a processing unit. The image capturing unit includes a lens array and a sensor module that is configured to detect light rays passing through an optical element and the lens array. The processing unit controls the sensor module to detect the light rays under a plurality exposure conditions for generating a plurality of images each including a plurality of light spots, obtains a plurality of light spot datasets corresponding to the light spots and each including a plurality of pixel coordinate sets and a plurality of pixel values, and obtains wavefront information associated with the light spots based on the light spot datasets of at least two of the images.
    Type: Application
    Filed: August 10, 2018
    Publication date: March 21, 2019
    Inventors: CHAO-WEN LIANG, CHIN-CHANG LIANG
  • FAN DEVICE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20190078573
    Abstract: A fan device is provided, including a housing, a circuit board, a plurality of driving coils, at least one magnetic member, and a metal member. The housing includes a first surface, a second surface corresponding to the first surface, and a hollow protruding portion protruding from the first surface. The circuit board is disposed on the first surface, and the driving coils are disposed on the circuit board. The magnetic member is disposed corresponding to the driving coils. The metal member is disposed on the second surface and corresponds to the magnetic member. A method for manufacturing the fan device is also provided.
    Type: Application
    Filed: April 13, 2018
    Publication date: March 14, 2019
    Inventor: Chao-Wen LU
  • PACKAGE STRUCTURE AND METHOD OF FABRICATING PACKAGE STRUCTURE
    Publication number: 20190067220
    Abstract: A package structure in accordance with some embodiments may include an RFIC chip, a redistribution circuit structure, a backside redistribution circuit structure, an isolation film, a die attach film, and an insulating encapsulation. The redistribution circuit structure and the backside redistribution circuit structure are disposed at two opposite sides of the RFIC chip and electrically connected to the RFIC chip. The isolation film is disposed between the backside redistribution circuit structure and the RFIC chip. The die attach film is disposed between the RFIC chip and the isolation film. The insulating encapsulation encapsulates the RFIC chip and the isolation film between the redistribution circuit structure and the backside redistribution circuit structure. The isolation film may have a coefficient of thermal expansion lower than the insulating encapsulation and the die attach film.
    Type: Application
    Filed: August 30, 2017
    Publication date: February 28, 2019
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Albert Wan, Chung-Shi Liu, Chao-Wen Shih, Han-Ping Pu, Chien-Ling Hwang
  • MicroLED display panel
    Patent number: 10199362
    Abstract: A microLED display panel includes a substrate being divided into a plurality of sub-regions for supporting microLEDs, and a plurality of drivers being correspondingly disposed on surfaces of the sub-regions respectively. In one embodiment, a top surface of the substrate has a recess for accommodating the driver.
    Type: Grant
    Filed: January 15, 2018
    Date of Patent: February 5, 2019
    Assignee: Prilit Optronics, Inc.
    Inventors: Biing-Seng Wu, Chao-Wen Wu
  • UTILIZING SIGNED CREDENTIALS FOR SECURE COMMUNICATION WITH AN IMPLANTABLE MEDICAL DEVICE
    Publication number: 20190036886
    Abstract: Methods and devices for establishing secure communications with an implantable medical device (IMD) are provided. The method and devices receive a credential from an external instrument (EI). The credential is signed utilizing a private key, and the credential includes at least two of a credential time to live (TTL) indicator, an IMD Identifier (ID), and an EI ID. The method and device authenticate the credential using a public key and verify the at least two of the TTL indicator, the IMD ID, and the EI ID. The method and device establish a secure communications session with the EI based on the verification and authentication.
    Type: Application
    Filed: July 25, 2017
    Publication date: January 31, 2019
    Inventors: Yongjian Wu, Mostafa Sadeghi, Chao-Wen Young, Jun Yang, Samir Shah, Simon Skup
  • PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
    Publication number: 20190027449
    Abstract: A package structure includes at least one die, an antenna element, and at least one through interlayer via. The antenna element is located on the at least one die. The at least one through interlayer via is located between the antenna element and the at least one die, wherein the antenna element is electrically connected to the at least one die through the at least one through interlayer via.
    Type: Application
    Filed: July 18, 2017
    Publication date: January 24, 2019
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Albert Wan, Chao-Wen Shih, Shou-Zen Chang, Nan-Chin Chuang
  • Semiconductor structure and method of manufacturing the same
    Patent number: 10183858
    Abstract: The present disclosure provides a semiconductor structure includes a sensing element configured to receive a signal from a sensing target, a molding surrounding the sensing element, a through via in the molding, a front side redistribution layer disposed at a front side of the sensing element and electrically connected thereto, and a back side redistribution layer disposed at a back side of the sensing element, the front side redistribution layer and the back side redistribution layer are electrically connected by the through via. The present disclosure also provides a method for manufacturing the semiconductor structure described herein.
    Type: Grant
    Filed: March 10, 2017
    Date of Patent: January 22, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Albert Wan, Yu-Sheng Hsieh, Chao-Wen Shih, Shou Zen Chang, Chung-Shi Liu, Chen-Hua Yu
  • Package structure and manufacturing method thereof
    Patent number: 10186492
    Abstract: A package structure includes at least one die, an antenna element, and at least one through interlayer via. The antenna element is located on the at least one die. The at least one through interlayer via is located between the antenna element and the at least one die, wherein the antenna element is electrically connected to the at least one die through the at least one through interlayer via.
    Type: Grant
    Filed: July 18, 2017
    Date of Patent: January 22, 2019
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Albert Wan, Chao-Wen Shih, Shou-Zen Chang, Nan-Chin Chuang
  • Sensor packages and manufacturing mehtods thereof
    Patent number: 10157807
    Abstract: Sensor packages and manufacturing methods thereof are disclosed. One of the sensor packages includes a semiconductor chip and a redistribution layer structure. The semiconductor chip has a sensing surface. The redistribution layer structure is arranged to form an antenna transmitter structure aside the semiconductor chip and an antenna receiver structure over the sensing surface of the semiconductor chip.
    Type: Grant
    Filed: August 12, 2016
    Date of Patent: December 18, 2018
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yung-Ping Chiang, Chao-Wen Shih, Shou-Zen Chang, Albert Wan, Yu-Sheng Hsieh
  • Wheelchair
    Patent number: D840878
    Type: Grant
    Filed: September 6, 2017
    Date of Patent: February 19, 2019
    Assignee: WELL HOME HEALTH PRODUCTS CO.
    Inventors: Chao-Wen Lan, Chien-Wei Chan