Patents by Inventor Chao-Wen (Kevin) Chen

Chao-Wen (Kevin) Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9953942
    Abstract: The present disclosure provides a semiconductor package, which includes a substrate, a passivation layer, a post-passivation interconnect (PPI) having a top surface; and a conductive structure. The top surface of the PPI includes a first region receiving the conductive structure, and a second region surrounding the first region. The second region includes metal derivative transformed from materials made of the first region. The present disclosure provide a method of manufacturing a semiconductor package, including forming a first flux layer covering a portion of a top surface of a PPI; transforming a portion of the top surface of the PPI uncovered by the first flux layer into a metal derivative layer; removing the first flux layer; forming a second flux layer on the first region of the PPI; dropping a solder ball on the flux layer; and forming electrical connection between the solder ball and the PPI.
    Type: Grant
    Filed: November 10, 2016
    Date of Patent: April 24, 2018
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Chao-Wen Shih, Kai-Chiang Wu, Ching-Feng Yang, Ming-Kai Liu, Shih-Wei Liang, Yen-Ping Wang
  • Publication number: 20180104153
    Abstract: An automatic medicine retrieving device includes a medicine tray, a medicine box, and a driving mechanism. The medicine tray includes a bearing plate defining an exit port and a medicine separating member rotatably positioned on the bearing plate. The medicine separating member has medicine separating areas and a positioning area. Medications in the form of pills are positioned on the bearing plate and received in the medicine separating areas. The medicine box is opposite to the exit port. The driving mechanism drives the medicine separating member to rotate from being opposite to the exit port, bringing the medicine separating area to a position opposite to the exit port. A pill in the medicine separating area then passes through the exit port to fall into an accepting mechanism.
    Type: Application
    Filed: December 5, 2016
    Publication date: April 19, 2018
    Inventors: YU-TING WANG, KING-LUNG HUANG, CHAO-WEN SHIH, PANG-YEN JAO
  • Publication number: 20180096878
    Abstract: A vacuum suction apparatus includes a semiconductor substrate with a top portion having grooves and a bottom portion having through holes, wherein each said groove correspondingly connects with at least one said through hole, and the groove has a width greater than a width of the through hole; and a cover plate disposed on a top surface of the semiconductor substrate. At least one edge of the vacuum suction apparatus has a vacuum chamber, which connects with the grooves. In another embodiment, the cover plate is replaced with a vacuum cover disposed above the semiconductor substrate, wherein the vacuum cover and the semiconductor substrate construct a vacuum chamber.
    Type: Application
    Filed: September 26, 2017
    Publication date: April 5, 2018
    Inventors: Biing-Seng Wu, Chao-Wen Wu, Tzung-Ren Wang
  • Publication number: 20180078777
    Abstract: A method and device for managing establishment of a communications link between an external instrument (EI) and an implantable medical device (IMD) are provided. The method stores, in a memory in at least one of the IMD or the EI, a base scanning schedule that defines a pattern for scanning windows over a scanning state. The method enters the scanning state during which a receiver scans for advertisement notices during the scanning windows. At least a portion of the scanning windows are grouped in a first segment of the scanning state. The method stores, in the memory, a scan reset pattern for restarting the scanning state. Further, the method automatically restarts the scanning state based on the scan reset pattern to form a pseudo-scanning schedule that differs from the base scanning schedule and establishes a communication session between the IMD and the EI.
    Type: Application
    Filed: September 18, 2017
    Publication date: March 22, 2018
    Inventors: Yongjian Wu, Jyoti Bhayana, Chao-Wen Young, Tejpal Singh, Samir Shah
  • Patent number: 9903415
    Abstract: A motor includes a shaft, a rotor shell, a bushing, a bearing, and a thrust plate. The rotor shell is connected with the shaft. The bushing has an accommodating space. The bearing is disposed in the accommodating space, and the shaft is disposed through the bearing. The thrust plate is connected with the shaft, and is disposed between a bottom of the accommodating space and a bottom of the bearing. At least one surface of the thrust plate is formed with a plurality of grooves tapering off from an edge to a center.
    Type: Grant
    Filed: October 10, 2014
    Date of Patent: February 27, 2018
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Cheng-Hsien Yeh, Chih-Wei Chan, Chao-Wen Lu
  • Publication number: 20180049251
    Abstract: Systems and methods are provided for establishing a bi-directional communication link with an implantable medical device. The systems and methods include an implantable medical device (IMD) and an external instrument configured to establish a wireless bi-directional communication link there between over a wireless protocol. The wireless bi-directional communication link is established based on a scanning interval. The external instrument includes one or more processors electrically coupled to a radio frequency (RF) circuit and a memory device. The one or more processors are configured to define the scanning interval based on an advertising schedule received from the IMD.
    Type: Application
    Filed: August 10, 2016
    Publication date: February 15, 2018
    Inventors: Heidi Hellman, Tejpal Singh, Yongjian Wu, Reza Shahandeh, Youjing Huang, Chao-Wen Young
  • Publication number: 20180047664
    Abstract: A method of manufacturing a semiconductor device includes: receiving a first substrate with a surface; receiving a second substrate; determining a pad array on the surface of the first substrate, wherein the pad array includes a first type pad and a second type pad; forming a via pattern underlying the pad array in the first substrate according to the location of each via, wherein the first type pad in the pad array is directly contacting a via of the via pattern and the second type pad in the pad array is clear of any via of the via pattern; laterally connecting the second type pad with a conductive trace, wherein the conductive trace connects to another via that is same level with the via contacting the first type pad; and disposing a first conductive bump and a second conductive bump between the first substrate and the second substrate.
    Type: Application
    Filed: August 15, 2016
    Publication date: February 15, 2018
    Inventors: TSUNG-YUAN YU, HAO-YI TSAI, CHAO-WEN SHIH, HUNG-YI KUO, PI-LAN CHANG
  • Patent number: 9894691
    Abstract: Systems and methods are provided for establishing a bi-directional communication link with an implantable medical device. The systems and methods include an implantable medical device (IMD) and an external instrument configured to establish a wireless bi-directional communication link there between over a wireless protocol. The wireless bi-directional communication link is established based on a scanning interval. The external instrument includes one or more processors electrically coupled to a radio frequency (RF) circuit and a memory device. The one or more processors are configured to define the scanning interval based on an advertising schedule received from the IMD.
    Type: Grant
    Filed: August 10, 2016
    Date of Patent: February 13, 2018
    Assignee: Pacesetter, Inc.
    Inventors: Heidi Hellman, Tejpal Singh, Yongjian Wu, Reza Shahandeh, Youjing Huang, Chao-Wen Young
  • Patent number: 9894466
    Abstract: A transmission method comprises: connecting a first wireless device to a second wireless device; determining by the first wireless device whether a silence time is assigned to the second wireless device; setting a communication period with the second wireless device according to the assigned silence time if the silence time assigned to the second wireless device is recorded in the first wireless device; and determining by the first wireless device the silence time according to a traffic transmitted from the second wireless device if the silence time assigned to the second wireless device is not recorded in the first wireless device.
    Type: Grant
    Filed: July 6, 2015
    Date of Patent: February 13, 2018
    Assignee: MEDIATEK INC.
    Inventors: Yu-Ju Lee, Po-Hsun Huang, Chao-Wen Chou
  • Publication number: 20180021589
    Abstract: Methods and devices for managing establishment of a communications link between an external instrument (EI) and an implantable medical device (IMD) are provided. The methods and devices comprise storing, in memory in at least one of the IMD or the EI an advertising schedule defining a pattern for advertisement notices. The advertisement notices are distributed un-evenly and separated by unequal advertisement intervals. The method transmits, from a transmitter in at least one of the IMD or the EI the advertisement notices. The advertisement notices are distributed as defined by the advertising schedule. The method establishes a communication session between the IMD and the EI.
    Type: Application
    Filed: July 21, 2016
    Publication date: January 25, 2018
    Inventors: Yongjian Wu, Samir Shah, Heidi Hellman, Reza Shahandeh, Tejpal Singh, Youjing Huang, Chao-Wen Young
  • Publication number: 20180026494
    Abstract: A micro fan is provided. The micro fan includes a rotor and a stator. The stator includes a plurality of axial induced coil units and a circuit board. The axial induced coil units are respectively preformed as a plurality of stator magnetic pole units, and are coupled to the circuit board. At least one of the coil units includes a coil and insulation material. The insulation material is block-shaped and covers at least a portion of the coil, and the central axis of the coil is parallel to the shaft of the rotor.
    Type: Application
    Filed: February 23, 2017
    Publication date: January 25, 2018
    Inventors: Chin-Chun LAI, Kun-Fu CHUANG, Chao-Wen LU
  • Publication number: 20180026495
    Abstract: A micro fan is provided. The micro fan includes a rotor and a stator. The stator includes an axial induced coil unit and a circuit board. The axial induced coil unit is made by twining a coil in an axial direction for at least two layers and in a radial direction for at least two layers.
    Type: Application
    Filed: March 23, 2017
    Publication date: January 25, 2018
    Inventors: Chao-Wen LU, Che-Wei LEE, Chung-Chiao TAN
  • Patent number: 9846461
    Abstract: A heat dissipating apparatus includes a frame, an elastic body, a magnetic member and a coil. The frame has an opening. The elastic body is disposed on the frame, and the frame and the elastic body define a space. The magnetic member is located corresponding to the space and disposed at one side of the elastic body. The coil is located corresponding to the periphery of the space and disposed on the frame. An electronic device with the heat dissipating apparatus is also disclosed.
    Type: Grant
    Filed: February 7, 2014
    Date of Patent: December 19, 2017
    Assignee: Delta Electronics, Inc.
    Inventors: Chung-Hung Tang, Shih-Chou Chen, Chun-Lung Chiu, Chao-Wen Lu, Chun-Nan Lin, Fu-Mei Hsu
  • Publication number: 20170345731
    Abstract: Sensor packages and manufacturing methods thereof are disclosed. One of the sensor packages includes a semiconductor chip and a redistribution layer structure. The semiconductor chip has a sensing surface. The redistribution layer structure is arranged to form an antenna transmitter structure aside the semiconductor chip and an antenna receiver structure over the sensing surface of the semiconductor chip.
    Type: Application
    Filed: August 12, 2016
    Publication date: November 30, 2017
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yung-Ping Chiang, Chao-Wen Shih, Shou-Zen Chang, Albert Wan, Yu-Sheng Hsieh
  • Patent number: 9777734
    Abstract: A thin type fan includes an impeller and a motor. The impeller includes a hub and a blade structure disposed around the hub. The motor includes a stator structure, a magnetic assembly, a bearing structure and a rotational shaft. The motor drives the impeller to rotate. The magnetic assembly is disposed within the hub and around the stator structure. The magnetic assembly includes a magnet and a magnetically permeable shell. The bearing structure includes a bearing seat and a single ball bearing. The single ball bearing is disposed in the bearing seat and forms an accommodating space, and the rotational shaft is disposed in the accommodating space.
    Type: Grant
    Filed: May 20, 2014
    Date of Patent: October 3, 2017
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Chao-Wen Lu, Chun-Chih Wang
  • Publication number: 20170262129
    Abstract: According to an embodiment of the present disclosure, an electrical device may include a substrate, an electrical element, a first barrier structure and a gas barrier layer. The substrate includes an active region and a periphery region surrounding the active region. The electrical element is disposed in the active region. The first barrier structure is disposed in the periphery region and surrounds the electrical element, wherein the first barrier structure includes a first conductive layer. The gas barrier layer covers the electrical element and the first barrier structure.
    Type: Application
    Filed: August 12, 2016
    Publication date: September 14, 2017
    Applicant: Industrial Technology Research Institute
    Inventors: Wei-Yuan Cheng, Chih-Chia Chang, Ruo-Lan Chang, Pei-Pei Cheng, Chao-Wen Chen
  • Publication number: 20170250130
    Abstract: A method includes forming a dielectric layer over a contact pad of a device, forming a first polymer layer over the dielectric layer, forming a first conductive line and a first portion of a second conductive line over the first polymer layer, patterning a photoresist to form an opening over the first portion of the second conductive feature, wherein after patterning the photoresist the first conductive line remains covered by photoresist, forming a second portion of the second conductive line in the opening, wherein the second portion of the second conductive line physically contacts the first portion of the second conductive line, and forming a second polymer layer extending completely over the first conductive line and the second portion of the second conductive line.
    Type: Application
    Filed: May 15, 2017
    Publication date: August 31, 2017
    Inventors: Chao-Wen Shih, Chen-Hua Yu, Han-Ping Pu, Hsin-Yu Pan, Hao-Yi Tsai, Sen-Kuei Hsu
  • Patent number: 9745990
    Abstract: A fan frame includes a first frame and a second frame. The first frame includes at least a first sidewall and a first connecting element, wherein the first connecting element is disposed on the first sidewall. The second frame includes at least a second sidewall and a second connecting element, wherein the second connecting element is disposed on the second sidewall and at least partially overlapped with the first connecting element. The second connecting element includes a first end and a second end in a first direction, wherein the first end and the second end are bent toward the first connecting element, respectively, for grasping the first connecting element. As a result, the accuracy error and the precision error are avoided, the stresses are internally counterbalanced, and the deformation of the fan frame is avoided.
    Type: Grant
    Filed: August 8, 2014
    Date of Patent: August 29, 2017
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Chao-Wen Lu, Chun-Chih Wang, Ding-Wei Chiu
  • Patent number: 9728477
    Abstract: The method of manufacturing a semiconductor device includes receiving a substrate. The substrate comprises at least one chip region and at least one scribe line next to the chip region, and each chip region comprises an active region. The method further includes disposing a buffer layer at least covering the scribe line, disposing a dielectric layer including an opening over each chip region, and disposing a bump material to the opening of the dielectric layer and electrically connecting to the active region. The method further includes forming a mold over the substrate, covering the buffer layer and cutting the substrate along the scribe line. Furthermore, the buffer layer includes an elastic modulus less than that of the mold, or the buffer layer includes a coefficient of thermal expansion less than that of the mold.
    Type: Grant
    Filed: April 27, 2016
    Date of Patent: August 8, 2017
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Nien-Fang Wu, Chao-Wen Shih, Yung-Ping Chiang, Hao-Yi Tsai
  • Publication number: 20170184117
    Abstract: A centrifugal blower is provided. The centrifugal blower includes a hub, a shaft, a motor, a plurality of blades, a rib, and a first fin. The shaft is connected to the hub. The motor rotates the shaft. Each blade includes a rib and a first fin. The rib is connected to the hub, wherein the rib extends from the hub to an end of the blade. The first fin is disposed on a first side of the rib and connected to the hub, wherein the first fin includes a first surface, the rib protrudes from the first surface, and the thickness of the first fin is less than the thickness of the rib.
    Type: Application
    Filed: July 25, 2016
    Publication date: June 29, 2017
    Inventors: Chao-Wen LU, Chun-Chih WANG, Ding-Wei CHIU