Abstract: A manufacturing method of silatrane with thiol group and a preservation method thereof are disclosed. (3-Mercaptopropyl)trimethoxysilane and triethanolamine are reacted for a pre-determined time at a pre-determined temperature under nitrogen atmosphere in presence or absence of catalyst, and then a recrystallization process is performed with a solvent to obtain silatrane with thiol group of formula (1). Silatrane with thiol group is dissolved in an organic solvent to preserve the silatrane with thiol group.

Abstract: A system and method are provided for initiating a secured bi-directional communication session with an implantable medical device. The system and method include configuring a pulse generator (PG) device and an external device to establish a communication link there between through a wireless protocol with a defined bonding procedure. The system and method also include transmitting a static identification and dynamic seed from the PG device through a dedicated advertisement channel to the external device and generating a passkey from a pre-defined algorithm based on the dynamic seed and a static identification. Further, the system and method include starting the defined bonding procedure.

Abstract: A semiconductor device includes a first substrate including a surface, and a pad array on the surface of the substrate, wherein the pad array comprises a first type pad and a second type pad located on a same level. The semiconductor device further includes a conductive bump connecting either the first type pad or the second type pad to a second substrate and a via connected a conductive feature at a different level to the first type pad and the via located within a projection area of the first type pad and directly contacting the first type pad. The semiconductor device also has a dielectric in the substrate and directly contacting the second type pad, wherein the second type pad is floated on the dielectric.

Abstract: A centrifugal fan includes an impeller and a housing. The housing includes an upper plate, a lower plate and a side wall, wherein the upper plate axially corresponds to the lower plate, a side wall is formed between the upper plate and the lower plate, an axial inlet is formed on the upper plate, a lateral outlet is formed on the side wall, the impeller is disposed in the housing and corresponds to the inlet, and a flow path communicates the inlet to the outlet. The housing further includes a guiding groove, and at least one auxiliary inlet is formed in the guiding groove.

Abstract: Techniques are provided for use with implantable medical devices or trial medical devices for wirelessly connecting the devices to external instruments such as tablet computers or smartphones. In an example where the medical device is an implantable neurostimulator, the neurostimulator passively detects wireless wake-up signals generated by the external instrument, i.e. the neurostimulator “sniffs” for advertisement signals generated by the external instrument. In response to passive detection of a wake-up signal, the implantable neurostimulator determines if a response is warranted and, if so, the neurostimulator activates its wireless transmission components to transmit an acknowledgement signal to the external instrument so as to complete a wake-up and handshake protocol.

Abstract: A semiconductor structure includes a substrate including a front side, a conductive bump disposed over the front side, and an opaque molding disposed over the front side and around a periphery portion of an outer surface of the conductive bump, wherein the opaque molding includes a recessed portion disposed above a portion of the front side adjacent to a corner of the substrate and extended through the opaque molding to expose the portion of the front side and an alignment feature disposed within the portion of the front side.

Abstract: The method of manufacturing a semiconductor device includes receiving a substrate. The substrate comprises at least one chip region and at least one scribe line next to the chip region, and each chip region comprises an active region. The method further includes disposing a buffer layer at least covering the scribe line, disposing a dielectric layer including an opening over each chip region, and disposing a bump material to the opening of the dielectric layer and electrically connecting to the active region. The method further includes forming a mold over the substrate, covering the buffer layer and cutting the substrate along the scribe line. Furthermore, the buffer layer includes an elastic modulus less than that of the mold, or the buffer layer includes a coefficient of thermal expansion less than that of the mold.

Abstract: The invention provides a semiconductor device including a substrate, a dielectric layer, a dummy bonding pad, a bonding pad, a redistribution layer, and a metal interconnect. The substrate includes a non-device region and a device region. The dielectric layer is on the non-device region and the device region. The dummy bonding pad is on the dielectric layer of the non-device region. The metal interconnect is in the dielectric layer of the non-device region and connected to the dummy bonding pad. The bonding pad is on the dielectric layer of the device region. The buffer layer is between the bonding pad and the dielectric layer. The buffer layer includes metal, metal nitride, or a combination thereof. The redistribution layer is on the dielectric layer and connects the dummy bonding pad and the bonding pad.

Abstract: A control method for a wireless charging system has steps of performing impedance matching on an antenna of the wireless charging system; tracing an optimal frequency point by sending a sensing signal with a default transmission frequency, and calculating a transmission efficiency of the sensing signal; determining whether the transmission efficiency meets a transmission requirement. When the transmission efficiency does not meet the transmission requirement, repeats the previous steps with another default transmission frequency until the transmission efficiency meeting the transmission requirement. When the transmission efficiency meeting the transmission requirement, the default transmission frequency is defined as the optimal frequency point for charging.

Abstract: A package, comprising a substrate having electrical devices disposed at a first side of the substrate, vias extending from the first side of the substrate to a second side of the substrate opposite the first side and metallization layers disposed on the first side of the substrate. Contact pads are disposed over the first metallization layers and a protection layer is disposed over the contact pads. Post-passivation interconnects are disposed over the protection layer and extend to the contact pads through openings in the protection layer. Connectors are disposed on the PPIs and a molding compound extends over the PPIs and around the connectors.

Abstract: In some embodiments in accordance with the present disclosure, a semiconductor device including a semiconductor substrate is received. An interconnect structure is provided over the semiconductor substrate, and a passivation is provided over the interconnect structure. The passivation includes an opening such that a portion of the interconnect structure is exposed. Moreover, a dielectric is provided over the passivation, and a post-passivation interconnect (PPI) is provided over the dielectric. The PPI is configured to connect with the exposed portion of the interconnect structure through an opening in the dielectric. Furthermore, the PPI includes a receiving area for receiving a conductor, and a trench adjacent to the receiving area. In certain embodiments, the receiving area is defined by the trench.

Abstract: A method for fixing metal onto a surface of the substrate. The present method includes steps of: providing a substrate and a mercaptoalkylsilatrane compound; dissolving the mercaptoalkylsilatrane compound in a solvent; performing a condensation reaction of the substrate with and the dissolved mercaptoalkylsilatrane compound to complete the surface modification of the substrate; and performing a covalent bonding process to metal with the mercaptoalkylsilatrane compound already modified onto the surface of the substrate to fix the metal onto the surface of the substrate.

Abstract: A wireless charging system includes a wireless charging device and a power-consuming device installed in a charging area. The wireless charging device has a signal conversion module connected to a controller, a transmitter antenna and a power input terminal. The power-consuming device has a receiver coil connected to a rectifier and outputting generated power through a power output terminal. Before or when the wireless charging device charges the power-consuming device, the controller of the wireless charging device can detect a power consumption status, voltage and current information and phase difference information of the transmitter antenna to instantly determine if any foreign metal object enters the charging area, thereby preventing high temperature generated by the foreign metal object from causing equipment damage and danger and enhancing wireless charging safety.

Abstract: A method of manufacturing a semiconductor structure includes receiving a substrate including a die pad disposed thereon; disposing a passivation over the substrate and around the die pad; disposing a polymer over the passivation; forming a post passivation interconnect (PPI) including an elongated portion and a via portion contacting with the die pad; depositing a metallic paste on the elongated portion of the PPI by a stencil; disposing a conductive bump over the metallic paste; and disposing a molding over the PPI and around the metallic paste and the conductive bump.

Abstract: A semiconductor device and a method of manufacturing the semiconductor device are disclosed. The semiconductor device includes a chip substrate, a mold, and a buffer layer. The mold is disposed over the chip substrate. The buffer layer is externally embedded between the chip substrate and the mold. The buffer layer has an elastic modulus or a coefficient of thermal expansion less than that of the mold. The method includes disposing a buffer layer at least covering scribe lines of a substrate, forming a mold over the substrate and covering the buffer layer, and cutting along the scribe lines and through the mold, the buffer layer and the substrate.

Abstract: In a method for forming a packaging structure, a metal pad is formed on a semiconductor substrate, and a first polymer insulating layer is formed over the semiconductor substrate. An opening passing through the first polymer insulating layer is formed to expose a portion of the metal pad. A copper-containing material is deposited in the opening and over the first polymer insulating layer, thereby forming a copper-containing layer having a first thickness and a first width over the first polymer insulating layer. A conductive bump having a second width is formed over the copper-containing layer, in which the second width is smaller than the first width. An exposed portion of the copper-containing layer is etched using the conductive bump as a mask until the exposed portion is reduced to a second thickness, thereby forming a monolithic copper-containing structure.

Abstract: A method for fabricating a peripheral wiring unit of a touch panel includes the following steps: (a) forming a transparent conductive layer on a substrate, the substrate including a peripheral region and a window region surrounded by the peripheral region, and forming a photosensitive conductive layer on the peripheral region of the substrate, such that the photosensitive conductive layer at least partially overlies the transparent conductive layer; (b) exposing the photosensitive conductive layer by using a photomask; and (c) developing the exposed photosensitive conductive layer to form a peripheral wiring unit on the peripheral region of the substrate.

Abstract: A pill grasping method comprises rotating a grasping arm with a nozzle to a predetermined initial position driven by a driving mechanism, rotating a number of pill storage cases to position one of the pill storage cases with a set number of pills to a predetermined grasping pill position driven by an actuating mechanism, rotating the grasping arm to enter into the corresponding pill storage case, starting a pump to generate a vacuum in the nozzle for sucking a pill, and determining if an actual pressure value in a pipe connecting the nozzle to the pump is less than a predetermined pressure value. The grasping arm is rotated to the predetermined initial position when the actual pressure value is less than the predetermined pressure value.

Abstract: The present disclosure provides a semiconductor structure. The semiconductor structure includes a circuit region, a seal ring region and an assembly isolation region. The circuit region includes a first conductive layer. The seal ring region includes a second conductive layer. The assembly isolation region is between the circuit region and the seal ring region. The first conductive layer and the second conductive layer respectively include a portion extending into the assembly isolation region thereby forming an electric component in the assembly isolation region.

Abstract: An image sensor mechanism for use in a digital image capture device. The mechanism generally includes a photo sensor array, a liquid crystal light valve array, and a control module. The liquid crystal light valve array is operatively disposed in front of the photo sensor array and includes a plurality of light valves, each of which is independently controllable and corresponds to at least one pixel sensor of the photo sensor array so as to selectively prevent light from reaching the photo sensor array. The control module is electrically coupled to the liquid crystal light valve array and the photo sensor array for applying a variable electric field across each of the light valves and for selectively adjusting the light valves with different transmittances based on a preliminary image previously captured by the photo sensor array in order to transform the preliminary image into a resultant image to be re-captured by the photo sensor array.