Patents by Inventor Chao-Wen (Kevin) Chen

Chao-Wen (Kevin) Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Choloesteric liquid crystal display and fabrication thereof
    Patent number: 8576345
    Abstract: A cholesteric liquid crystal display is provided, including a substrate, a first electrode layer disposed on the substrate, and a liquid crystal layer disposed on the first electrode layer, wherein the liquid crystal layer comprises at least two liquid crystals having different sensitivities to driving frequencies, mixed with each other, and liquid crystals having a greater initial state-transition temperature are more sensitive to driving frequency.
    Type: Grant
    Filed: July 26, 2011
    Date of Patent: November 5, 2013
    Assignee: Industrial Technology Research Institute
    Inventors: Kai-Wei Lan, Chao-Wen Chen, Wan-Wen Chiu
  • Thermal Management
    Publication number: 20130289792
    Abstract: An operation mode is determined based on user behavior data, an environmental data of the electronic device is determined and a system operating data of the electronic device is determined. A system control parameter can be adjusted based on the environmental data and the system operating data to regulate the heat generating element and/or the cooling element to achieve the operating mode.
    Type: Application
    Filed: April 27, 2012
    Publication date: October 31, 2013
    Inventors: Chao-Wen Cheng, Edwin L. Harmon, Lien-Chia Chiu
  • Carbon laminated enclosure
    Patent number: 8570747
    Abstract: An enclosure is provided. A housing (120) can have one or more walls (130). At least one of the one or more walls (130) can include a thermally conductive, carbonaceous member (100). The thermally conductive, carbonaceous member (100) can be partially or completely encapsulated within one or more electrically non-conductive materials.
    Type: Grant
    Filed: December 4, 2008
    Date of Patent: October 29, 2013
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chao-Wen Cheng, Mark H Ruch, Mark S Tracy
  • METHODS AND APPARATUS FOR HEAT SPREADER ON SILICON
    Publication number: 20130270686
    Abstract: Apparatus and methods for forming a heat spreader on a substrate to release heat for a semi-conductor package are disclosed. The apparatus comprises a substrate. A dielectric layer is formed next to the substrate and in contact with a surface of the substrate. A heat spreader is formed next to the substrate and in contact with another surface of the substrate. A passivation layer is formed next to the dielectric layer. A connection pad is placed on top of the passivation layer. The substrate may comprise additional through-silicon-vias. The contact surface between the substrate and the heat spreader may be a scraggy surface. The packaging method further proceeds to connect a chip to the connection pad by way of a connection device such as a solder ball or a bump.
    Type: Application
    Filed: April 11, 2012
    Publication date: October 17, 2013
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hsien-Wei Chen, Chung-Ying Yang, Chao-Wen Shih, Kai-Chiang Wu
  • 3D Semiconductor Package Interposer with Die Cavity
    Publication number: 20130252378
    Abstract: A 3D semiconductor package using an interposer is provided. In an embodiment, an interposer is provided having a first die electrically coupled to a first side of the interposer and a second die electrically coupled to a second side of the interposer. The interposer is electrically coupled to an underlying substrate, such as a packaging substrate, a high-density interconnect, a printed circuit board, or the like. The substrate has a cavity such that the second die is positioned within the cavity. The use of a cavity may allow smaller conductive bumps to be used, thereby allowing a higher number of conductive bumps to be used. A heat sink may be placed within the cavity to aid in the dissipation of the heat from the second die.
    Type: Application
    Filed: May 22, 2013
    Publication date: September 26, 2013
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Shin-Puu Jeng, Kim Hong Chen, Shang-Yun Hou, Chao-Wen Shih, Cheng-Chieh Hsieh, Chen-Hua Yu
  • Electrical connector
    Patent number: 8540524
    Abstract: An electrical connector for electrically connecting a mating element to a motherboard includes an insulating body having two side surfaces disposed symmetrically, at least one rotating shaft protruding from the side surface, a casing including at least one side portion corresponding to the side surface, and at least one protruding block. The side portion of the casing extends backward to form a rotating portion. The rotating portion is disposed with an elongated hole. A distance between an edge of the elongated hole and an edge of the rotating portion is substantially a fixed value. A distance between the protruding block and the rotating shaft is equal to or slightly larger than the fixed value. The rotating shaft urges against the edge of the elongated hole of the casing, and the protruding block urges against the edge of the rotating portion of the casing.
    Type: Grant
    Filed: April 11, 2012
    Date of Patent: September 24, 2013
    Assignee: Lotes Co., Ltd.
    Inventors: Chao Wen Cai, Yong Quan Wu
  • 3D semiconductor package interposer with die cavity
    Patent number: 8519537
    Abstract: A 3D semiconductor package using an interposer is provided. In an embodiment, an interposer is provided having a first die electrically coupled to a first side of the interposer and a second die electrically coupled to a second side of the interposer. The interposer is electrically coupled to an underlying substrate, such as a packaging substrate, a high-density interconnect, a printed circuit board, or the like. The substrate has a cavity such that the second die is positioned within the cavity. The use of a cavity may allow smaller conductive bumps to be used, thereby allowing a higher number of conductive bumps to be used. A heat sink may be placed within the cavity to aid in the dissipation of the heat from the second die.
    Type: Grant
    Filed: June 10, 2010
    Date of Patent: August 27, 2013
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Shin-Puu Jeng, Kim Hong Chen, Shang-Yun Hou, Chao-Wen Shih, Cheng-Chieh Hsieh, Chen-Hua Yu
  • ELECTRICAL CONNECTOR
    Publication number: 20130210263
    Abstract: An electrical connector for electrically connecting a mating element to a motherboard includes an insulating body having two side surfaces disposed symmetrically, at least one rotating shaft protruding from the side surface, a casing including at least one side portion corresponding to the side surface, and at least one protruding block. The side portion of the casing extends backward to form a rotating portion. The rotating portion is disposed with an elongated hole. A distance between an edge of the elongated hole and an edge of the rotating portion is substantially a fixed value. A distance between the protruding block and the rotating shaft is equal to or slightly larger than the fixed value. The rotating shaft urges against the edge of the elongated hole of the casing, and the protruding block urges against the edge of the rotating portion of the casing.
    Type: Application
    Filed: April 11, 2012
    Publication date: August 15, 2013
    Applicant: LOTES CO., LTD.
    Inventors: Chao Wen Cai, Yong Quan Wu
  • Apparatus and method for wet processing substrate
    Patent number: 8500949
    Abstract: An exemplary wet processing apparatus includes a tank, a conveyor configured for conveying a substrate, and a spraying system. The tank receives a wet processing liquid. The conveyor includes a first conveying portion, a second conveying portion, and a third conveying portion. The first conveying portion is in the tank and conveys the substrate in the wet processing liquid. The second conveying portion is obliquely interconnected between the first and third conveying portions. The third conveying portion conveys the substrate above the wet processing liquid in the tank. The spraying system is above the third conveying portion, sprays the wet processing liquid onto the substrate on the third conveying portion.
    Type: Grant
    Filed: June 16, 2011
    Date of Patent: August 6, 2013
    Assignee: Zhen Ding Technology Co., Ltd.
    Inventor: Chao-Wen Lin
  • Controlling method for ultra-sound sensor
    Patent number: 8483012
    Abstract: A controlling method for ultra-sound sensor is provided. The method includes the steps of measuring a distance of an obstacle, determining whether the distance is smaller than a distance threshold, and adjusting a driving voltage if the distance is smaller than the distance threshold.
    Type: Grant
    Filed: March 15, 2010
    Date of Patent: July 9, 2013
    Assignee: Lite-On It Corporation
    Inventors: Chao-Wen Hu, Yi-Chung Lee
  • CAPACITOR ARRAY AND METHOD OF FABRICATING THE SAME
    Publication number: 20130161786
    Abstract: A capacitor array includes a plurality of capacitors and a support frame. Each capacitor includes an electrode. The support frame supports the plurality of electrodes and includes a plurality of support structures corresponding to the plurality of electrodes. Each support structure may surround the respective electrode. The support frame may include oxide of a doped oxidizable material.
    Type: Application
    Filed: December 21, 2011
    Publication date: June 27, 2013
    Applicant: Nan Ya Technology Corporation
    Inventors: Jen Jui Huang, Che Chi Lee, Shih Shu Tsai, Cheng Shun Chen, Shao Ta Hsu, Chao Wen Lay, Chun I. Hsieh, Ching Kai Lin
  • METHOD FOR DIAGNOSING KIDNEY DISEASE COMPRISING DETECTING THE LEVEL OF ANNEXIN A2 OR S100A6
    Publication number: 20130101998
    Abstract: The present invention provides biomarkers for detecting kidney disease, selected from the oligonucleotide sequence, complementary sequence or derivatives, amino acid sequence or derivatives, fragment, variants, antibody of annexin A2 or S100A6 or combinations thereof. Moreover, the present invention also provides an assay kit and a method for kidney disease detecting, practically for the kidney disease resulting from acute tubular necrosis.
    Type: Application
    Filed: September 14, 2012
    Publication date: April 25, 2013
    Applicant: National Defense Medical Center
    Inventors: Ann Chen, Shuk-Man Ka, Chao-Wen Cheng, Jenn-Han Chen, Chen-Wen Yao
  • METHOD FOR FORMING ELECTRICAL CONNECTOR
    Publication number: 20130098976
    Abstract: A method for forming an electrical connector. In one embodiment, the method includes: providing a body, where a plurality of terminals are fixed in the body, each terminal has an extending portion exposed downwardly out of the body, and a soldering portion disposed at one end of the extending portion; providing a flat working surface and a plurality of solder materials, and placing the body above the flat working surface, so that the solder material is connected upwardly to the soldering portion, and connected downwardly to the flat working surface; heating the solder material, and then cooling and solidifying the solder material, so that the solder material is fixed to the soldering portion; and removing the flat working surface.
    Type: Application
    Filed: February 17, 2012
    Publication date: April 25, 2013
    Applicant: LOTES CO., LTD.
    Inventors: Chao Wen Cai, Yong Quan Wu
  • Operating method for an ultra-sound sensor
    Patent number: 8422336
    Abstract: An operating method adapted in an ultra-sound sensor is provided. The method includes the steps of emitting an ultra-sound wave, receiving a crosstalk signal within a crosstalk measuring window, determining whether the crosstalk signal is larger than a crosstalk threshold and triggering a crosstalk application if the crosstalk signal is smaller than the crosstalk threshold.
    Type: Grant
    Filed: April 7, 2010
    Date of Patent: April 16, 2013
    Assignee: Lite-On It Corporation
    Inventors: Yuan-Hung Liao, Chao-Wen Hu, Tzu-Nan Chen
  • Multi-Phase Clock Generation System and Clock Calibration Method Thereof
    Publication number: 20130088268
    Abstract: A multi-phase clock generation system and a clock calibration method thereof. The multi-phase clock generation system comprises an input module, a frequency division module and a control module. The input module inputs a reference clock signal with a clock period. The frequency division module according to the reference clock signal produces a phase clock signal with a frequency magnification relationship. The control module divides the phase clock signal into a plurality of clock intervals. There is a clock interval between two adjacent phase clock signals, and each of the plurality of clock intervals has a phase time delay. The control module controls a first phase clock signal of the plurality of phase clock signals to align with a last phase clock signal. The control module sequentially arranges each of the plurality of phase clock signals according to the phase time delay.
    Type: Application
    Filed: January 3, 2012
    Publication date: April 11, 2013
    Applicant: TINNOTEK INC.
    Inventors: Ruo-Ting Ding, Shi-Yu Huang, Chao-Wen Tzeng
  • ELECTRICAL CONNECTOR
    Publication number: 20130084737
    Abstract: An electrical connector includes an electrical connecting base, a press cover, a fastening member and at least one thrust member. The press cover covers on the electrical connecting base, and substantially horizontally placed. A fastening portion and a pivoting portion are respectively formed on two opposite ends of the press cover. The press cover is opened or closed relative to the electrical connecting base around the pivoting portion. The fastening member correspondingly presses against the fastening portion of the press cover when the press cover is horizontally placed. The at least one thrust member urges against the press cover upwards. When the fastening member is released from pressing against the fastening portion, the press cover is urged to pop up, so that an operating space is formed below the press cover, which is sufficient for an operator to open the press cover manually.
    Type: Application
    Filed: February 15, 2012
    Publication date: April 4, 2013
    Applicant: LOTES CO., LTD.
    Inventors: Chao Wen Cai, Yong Quan Wu
  • Throttle control module
    Patent number: 8408181
    Abstract: A throttle control module for controlling a throttle, comprises: a BLDC motor; a gear train connecting the motor to the throttle; and a throttle position sensor. A PWM module is connected to the throttle position sensor and generates a pulse-width modulation sequence according to the signal from the throttle position sensor and a desired throttle position signal. A decoder module generates commutation logic for the motor based on the signal from the throttle position sensor. A motor controller controls commutation of the motor according to the pulse-width modulation sequence and the commutation logic.
    Type: Grant
    Filed: February 19, 2010
    Date of Patent: April 2, 2013
    Assignee: Johnson Electric S.A.
    Inventors: Yong Bin Li, Rui Feng Qin, Ning Sun, Chao Wen, Yuk Wai Elton Yeung
  • ELECTRONIC DEVICE AND HEAT DISSIPATION MODULE AND CENTRIFUGAL FAN THEREOF
    Publication number: 20130068425
    Abstract: A centrifugal fan is provided. The centrifugal fan includes an impeller and a housing. The housing includes an upper plate, a lower plate and a side wall, wherein the upper plate axially corresponds to the lower plate, a side wall is formed between the upper plate and the lower plate, an axial inlet is formed on the upper plate, a lateral outlet is formed on the side wall, the impeller is disposed in the housing and corresponds to the inlet, and a flow path communicates the inlet to the outlet, wherein the housing further includes a guiding groove, and at least one auxiliary inlet is formed in the guiding groove.
    Type: Application
    Filed: September 13, 2012
    Publication date: March 21, 2013
    Inventor: Chao-Wen LU
  • CENTRIFUGAL FAN
    Publication number: 20130071238
    Abstract: A centrifugal fan is provided. The centrifugal fan includes an impeller and a housing. The impeller has an impeller diameter. The housing includes an upper plate, a lower plate and a side wall, wherein the upper plate axially corresponds to the lower plate, a side wall is formed between the upper plate and the lower plate, an axial inlet is formed on the upper plate, a lateral outlet is formed on the side wall, the impeller is disposed in the housing and corresponds to the inlet, and a flow path communicates the inlet to the outlet, wherein a greatest width of the inlet is greater than or equal to the impeller diameter.
    Type: Application
    Filed: September 13, 2012
    Publication date: March 21, 2013
    Inventor: Chao-Wen LU
  • MOTOR AND MANUFACTURING METHOD THEREOF AND FAN
    Publication number: 20130056902
    Abstract: A method for manufacturing a motor includes the following steps of: providing a substrate with an opening and a bushing; disposing the bushing within the opening of the substrate; providing a cushioning material disposed between the substrate and the bushing by injection molding.
    Type: Application
    Filed: August 29, 2012
    Publication date: March 7, 2013
    Inventors: Chao-Wen LU, Chih-Wei Chan