Abstract: A heat sink includes a heat conduction portion and a heat dissipation portion. The heat conduction portion contacts a heat source with a flat form. The heat dissipation portion is extended outward from at least one side of the thickness of the heat conduction portion and parallel to the heat conduction portion. The heat dissipation portion includes at least a first branch extended from the heat conduction portion and at least a second branch extended from the first branch.

Abstract: A support structure for a light-emitting diode utilizes the configuration of a sacrifice structure to achieve safe separation of a light-emitting diode from a carrier substrate. Specifically, when an external force is applied on the light-emitting diode or the carrier substrate, a breaking layer of the sacrifice structure is the first layer to be broken, so that the light-emitting diode and carrier substrate will become separated from each other.

Abstract: A semiconductor package structure including an encapsulation body, an RFIC chip, a first antenna structure, and a second antenna structure is provided. The RFIC chip may be embedded in the encapsulation body. The first antenna structure may be disposed at a lateral side of the RFIC chip, electrically connected to the RFIC chip, and include a first conductor layer and a plurality of first patches opposite to the first conductor layer. The second antenna structure may be stacked on the RFIC chip, electrically connected to the RFIC chip, and include a second conductor layer and a plurality of second patches opposite to the second conductor layer. The first patches and the second patches are located at a surface of the encapsulation body. A first distance between the first conductor layer and the first patches is different from a second distance between the second conductor layer and the second patches.

Abstract: A method of manufacturing a semiconductor device includes: receiving a first substrate with a surface; receiving a second substrate; determining a pad array on the surface of the first substrate, wherein the pad array includes a first type pad and a second type pad; forming a via pattern underlying the pad array in the first substrate according to the location of each via, wherein the first type pad in the pad array is directly contacting a via of the via pattern and the second type pad in the pad array is clear of any via of the via pattern; laterally connecting the second type pad with a conductive trace, wherein the conductive trace connects to another via that is same level with the via contacting the first type pad; and disposing a first conductive bump and a second conductive bump between the first substrate and the second substrate.

Abstract: A centrifugal blower is provided. The centrifugal blower includes a hub, a shaft, a motor, a plurality of blades, a rib, and a first fin. The shaft is connected to the hub. The motor rotates the shaft. Each blade includes a rib and a first fin. The rib is connected to the hub, wherein the rib extends from the hub to an end of the blade. The first fin is disposed on a first side of the rib and connected to the hub, wherein the first fin includes a first surface, the rib protrudes from the first surface, and the thickness of the first fin is less than the thickness of the rib.

Abstract: A cross flow fan includes a fan frame and a rotor having a hub, a shaft connected with the hub at its rotation center, a plurality of blades, and a disk structure connected with the blades and hub within the fan frame. The fan frame has a frame wall having a lateral flow inlet to the rotor and a lateral flow outlet from the rotor, a base carrying the rotor and frame wall, a cover on one side of the frame wall opposite to the base, and a partition structure disposed between the blades and an inner wall surface of the frame wall. A normal line of the lateral flow inlet and a normal line of the lateral flow outlet are not parallel to an extension direction of the shaft. The blades directly face the lateral flow inlet and the lateral flow outlet along radial directions of the shaft.

Abstract: A semiconductor package includes an integrated circuit (IC), a heat dissipation structure, a molding layer and an antenna. The IC is mounted on a first surface of a first redistribution layer (RDL). The heat dissipation structure is mounted on a second surface of the first RDL. The molding compound is disposed over the first surface of the first RDL. The antenna is disposed on the second surface of the first RDL, wherein the antenna is disposed side-by-side to the heat dissipation structure.

Abstract: A method of manufacturing an integrated fan-out (InFO) package includes at least the following steps. A package array is formed. A dielectric layer having a core layer formed thereon is provided. The core layer includes a plurality of cavities penetrating through the core layer. The dielectric layer and the core layer are attached onto the package array such that the core layer is located between the dielectric layer and the package array. A plurality of first conductive patches is formed on the dielectric layer above the cavities.

Abstract: A package structure including an insulating encapsulation, at least one semiconductor die, at least one first antenna and at least one second antenna is provided. The insulating encapsulation includes a first portion, a second portion and a third portion, wherein the second portion is located between the first portion and the third portion. The at least one semiconductor die is encapsulated in the first portion of the insulating encapsulation, and the second portion and the third portion are stacked on the at least one semiconductor die. The at least one first antenna is electrically connected to the at least one semiconductor die and encapsulated in the third portion of the insulating encapsulation. The at least one second antenna is electrically connected to the at least one semiconductor die and encapsulated in the second portion of the insulating encapsulation.

Abstract: A package structure includes at least one die, an antenna element, and at least one through interlayer via. The antenna element is located on the at least one die. The at least one through interlayer via is located between the antenna element and the at least one die, wherein the antenna element is electrically connected to the at least one die through the at least one through interlayer via.

Abstract: An embodiment package comprises an integrated circuit die encapsulated in an encapsulant, a patch antenna over the integrated circuit die, and a dielectric feature disposed between the integrated circuit die and the patch antenna. The patch antenna overlaps the integrated circuit die in a top-down view. The thickness of the dielectric feature is in accordance with an operating bandwidth of the patch antenna.

Abstract: A semiconductor device including a chip package, a dielectric structure and a first antenna pattern is provided. The dielectric structure disposed on the chip package and includes a cavity and a vent in communication with the cavity. The first antenna pattern disposed on the dielectric structure, wherein the chip package is electrically coupled to the first antenna pattern, and the cavity of the dielectric structure is disposed between the chip package and the first antenna pattern. A manufacturing method of a semiconductor device is also provided.

Abstract: Methods and devices for managing establishment of a communications link between an external instrument (EI) and an implantable medical device (IMD) are provided. The methods and devices comprise storing, in memory in at least one of the IMD or the EI an advertising schedule defining a pattern for advertisement notices. The advertisement notices are distributed un-evenly and separated by unequal advertisement intervals. The method transmits, from a transmitter in at least one of the IMD or the EI the advertisement notices. The advertisement notices are distributed as defined by the advertising schedule. The method establishes a communication session between the IMD and the EI.

Abstract: Methods and devices for managing establishment of a communications link between an external instrument (EI) and an implantable medical device (IMD) are provided. The methods and devices comprise storing, in memory in at least one of the IMD or the EI an advertising schedule defining a pattern for advertisement notices. The advertisement notices are distributed un-evenly and separated by unequal advertisement intervals. The method transmits, from a transmitter in at least one of the IMD or the EI the advertisement notices. The advertisement notices are distributed as defined by the advertising schedule. The method establishes a communication session between the IMD and the EI.

Abstract: A fan includes a fan frame and a rotor having a hub, a shaft connected with the hub at its rotation center, blades, and a disk structure connected with the blades and hub within the fan frame. The fan frame has a frame wall having inlet and outlet surfaces, a base carrying the rotor and frame wall, a cover on one side of the frame wall opposite to the base, and a tongue structure between the base and cover. The normal lines of the inlet and outlet surfaces are not parallel to the extension direction of the shaft. The distance between the virtual line segment of the outlet surface and shaft is the shortest distance between the shaft and outlet surface. The extended line from the center of the groove opening of the tongue structure intersects the imaginary plane where the virtual line segment and shaft are located.

Abstract: A micro fan is provided. The micro fan includes a rotor and a stator. The stator includes a plurality of axial induced coil units and a circuit board. The axial induced coil units are respectively preformed as a plurality of stator magnetic pole units, and are coupled to the circuit board. At least one of the coil units includes a coil and insulation material. The insulation material is block-shaped and covers at least a portion of the coil, and the central axis of the coil is parallel to the shaft of the rotor.

Abstract: Structures and formation methods of a chip package are provided. The chip package includes a semiconductor die having a conductive element and a first protective layer surrounding the semiconductor die. The chip package also includes a second protective layer over the semiconductor die and the first protective layer. The chip package further includes an antenna element over the second protective layer. The antenna element is electrically connected to the conductive element of the semiconductor die.

Abstract: The present invention discloses an electromagnetic shielding assembly including an electromagnetic interference shielding component including a plate body and a bending portion. An included angle is formed between the plate body and the bending portion, and the plate body and the bending portion cover an input socket of a power supply. The electromagnetic interference shielding component includes at least one grounding pin disposed on the plate body or/and the bending portion and configured to ground with and screw to a housing of the power supply, and a welding pin disposed on a side of the bending portion away from the plate body and electrically connected to an auxiliary circuit board. The electromagnetic interference shielding component provides functions of EMI shielding, lightning (current) discharging and fixture, which can simplify the structure, increase the discharging speed and time, and reduce the amount of disturbance of the large current instantaneous to the ground.

Abstract: A laser radar device comprises a laser projecting system and a laser radar detecting system. The laser projecting system comprises a laser diode; and a light source orientation adjustment unit comprising a collimating lens and a Powell lens to modulate the angle at which the first incident laser beam is projected onto an object. The laser radar detecting system comprises at least two laser radar detection units disposed in the horizontal direction and vertical direction of the object, respectively. The laser radar detection units each comprise a wedge-shaped lens, an aspherical lens system and an optical detector. By designing optical parameters of the wedge-shaped lens and stacking the laser radar detection units in the horizontal direction and vertical direction, it is feasible to facilitate overall device manufacturing and processing, meet R&D needs, and adjust an optical system in its entirety easily.

Abstract: A bottom emission microLED display includes a microLED disposed above a transparent substrate; a light guiding layer surrounding the microLED to controllably guide light generated by the microLED towards the transparent substrate; and a reflecting layer formed over the light guiding layer to reflect the light generated by the microLED downwards and to confine the light generated by the microLED to prevent the light from leaking upwards or sidewards.