Patents by Inventor Chao Wen

Chao Wen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PACKAGE STRUCTURE, ELECTRONIC DEVICE AND METHOD OF FABRICATING PACKAGE STRUCTURE
    Publication number: 20200153083
    Abstract: In accordance with some embodiments, a package structure includes an RFIC chip. an insulating encapsulation, a redistribution circuit structure, an antenna and a microwave director. The insulating encapsulation encapsulates the RFIC chip. The redistribution circuit structure is disposed on the insulating encapsulation and electrically connected to the RFIC chip. The antenna is disposed on the insulating encapsulation and electrically connected to the RFIC chip through the redistribution circuit structure. The antenna is located between the microwave director and the RFIC chip. The microwave director has a microwave directivity enhancement surface located at a propagating path of a microwave received or generated by the antenna.
    Type: Application
    Filed: January 12, 2020
    Publication date: May 14, 2020
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Min-Chien Hsiao, Chen-Hua Yu, Chung-Shi Liu, Chao-Wen Shih, Shou-Zen Chang
  • TEMPERATURE PLATE DEVICE
    Publication number: 20200149821
    Abstract: A temperature plate device includes a plate body and a bent supporting structure. The plate body includes a first plate and a second plate. A chamber is defined by the first plate and the second plate. The first plate has a first step section. The second plate has a second step section corresponding to the first step section. The bent supporting structure is connected to and traverses the first step section between the first step section and the second step section.
    Type: Application
    Filed: January 14, 2020
    Publication date: May 14, 2020
    Inventors: LI-KUANG TAN, SHIH-KANG LIN, KUO-YING LEE, TING-YUAN WU, CHAO-WEN LU
  • Liquid cooling device and air collector thereof
    Patent number: 10646797
    Abstract: A liquid-cooling device and an air collector thereof are provided. The air collector includes a tank, an inlet channel, an outlet channel, and a barrier plate. The inlet channel is located at one end of the tank and extended into the tank. The outlet channel is located at the other end of the tank and extended into the tank. The barrier plate is located in the tank between the inlet channel and the outlet channel. The diameter of the tank is greater than those of the inlet channel and the outlet channel.
    Type: Grant
    Filed: March 30, 2018
    Date of Patent: May 12, 2020
    Assignee: DELTA ELECTRONICS, INC.
    Inventor: Chao-Wen Lu
  • Implantable medical device and method for managing advertising and scanning schedules
    Patent number: 10639482
    Abstract: A method and device for managing establishment of a communications link between an external instrument (EI) and an implantable medical device (IMD) are provided. The method stores, in a memory in at least one of the IMD or the EI, a base scanning schedule that defines a pattern for scanning windows over a scanning state. The method enters the scanning state during which a receiver scans for advertisement notices during the scanning windows. At least a portion of the scanning windows are grouped in a first segment of the scanning state. The method stores, in the memory, a scan reset pattern for restarting the scanning state. Further, the method automatically restarts the scanning state based on the scan reset pattern to form a pseudo-scanning schedule that differs from the base scanning schedule and establishes a communication session between the IMD and the EI.
    Type: Grant
    Filed: September 18, 2017
    Date of Patent: May 5, 2020
    Assignee: PACESETTER, INC.
    Inventors: Yongjian Wu, Jyoti Bhayana, Chao-Wen Young, Tejpal Singh, Samir Shah
  • TOP EMISSION MICROLED DISPLAY AND BOTTOM EMISSION MICROLED DISPLAY AND A METHOD OF FORMING THE SAME
    Publication number: 20200135801
    Abstract: A microLED display includes a first main substrate, microLEDs disposed above the first main substrate, a first light blocking layer disposed above the first main substrate to define emission areas, a light guiding layer disposed in the emission areas, and a plurality of connecting structures disposed in the emission areas respectively and electrically connected with the microLEDs.
    Type: Application
    Filed: December 30, 2019
    Publication date: April 30, 2020
    Inventors: Biing-Seng Wu, Chao-Wen Wu
  • Bottom emission microLED display and a repair method thereof
    Patent number: 10636710
    Abstract: A bottom emission microLED display includes a microLED disposed above a transparent substrate; a light guiding layer surrounding the microLED to controllably guide light generated by the microLED towards the transparent substrate; and a reflecting layer formed over the light guiding layer to reflect the light generated by the microLED downwards and to confine the light generated by the microLED to prevent the light from leaking upwards or sidewards.
    Type: Grant
    Filed: May 7, 2019
    Date of Patent: April 28, 2020
    Assignee: Prilit Optronics, Inc.
    Inventors: Biing-Seng Wu, Chao-Wen Wu
  • Semiconductor packages and manufacturing methods thereof
    Patent number: 10636713
    Abstract: Sensor packages and manufacturing methods thereof are disclosed. One of the sensor packages includes a semiconductor chip and a redistribution layer structure. The semiconductor chip has a sensing surface. The redistribution layer structure is arranged to form an antenna transmitter structure aside the semiconductor chip and an antenna receiver structure over the sensing surface of the semiconductor chip.
    Type: Grant
    Filed: December 14, 2018
    Date of Patent: April 28, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yung-Ping Chiang, Chao-Wen Shih, Shou-Zen Chang, Albert Wan, Yu-Sheng Hsieh
  • SEMICONDUCTOR PACKAGE STRUCTURE
    Publication number: 20200118952
    Abstract: A semiconductor package structure including an encapsulation body, an RFIC chip, a first antenna structure, and a second antenna structure is provided. The RFIC chip may be embedded in the encapsulation body. The first antenna structure may be disposed at a lateral side of the RFIC chip, electrically connected to the RFIC chip, and include a first conductor layer and a plurality of first patches opposite to the first conductor layer. The second antenna structure may be stacked on the RFIC chip, electrically connected to the RFIC chip, and include a second conductor layer and a plurality of second patches opposite to the second conductor layer. The first patches and the second patches are located at a surface of the encapsulation body. A first distance between the first conductor layer and the first patches is different from a second distance between the second conductor layer and the second patches.
    Type: Application
    Filed: December 15, 2019
    Publication date: April 16, 2020
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Kai-Chiang Wu, Chun-Lin Lu, Chao-Wen Shih, Han-Ping Pu, Nan-Chin Chuang
  • SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
    Publication number: 20200118916
    Abstract: A semiconductor device includes a first substrate, a pad array, a conductive bump, a first via and a dielectric. The pad array, formed on a surface of the first substrate, includes a first type pad and a second type pad at a same level. The conductive bump connects one of the first type pad of the second type pad to a second substrate. The first via, connected to a conductive feature at a different level to the first type pad, is located within a projection area of the first type pad and directly contacts the first type pad. The second type pad is laterally connected with a conductive trace on the same level. The conductive trace is connected to a second via at a same level with the first via. The dielectric in the first substrate contacts the second type pad. The second type pad is floated on the dielectric.
    Type: Application
    Filed: December 17, 2019
    Publication date: April 16, 2020
    Inventors: TSUNG-YUAN YU, HAO-YI TSAI, CHAO-WEN SHIH, HUNG-YI KUO, PI-LAN CHANG
  • SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE AND METHOD FOR PACKAGING SEMICONDUCTOR DEVICE
    Publication number: 20200091031
    Abstract: A semiconductor package, a semiconductor device and a method for packaging the semiconductor device are provided. A semiconductor package includes a first conductive wire layer with a first mounting area and a second mounting area, an integrated circuit (IC), a radiation fin structure and an antenna. The first mounting area and the second mounting area do not overlap. The IC is disposed on a first surface of the first mounting area. The radiation fin structure is disposed on a second surface of the first mounting area. The antenna is disposed on the second mounting area.
    Type: Application
    Filed: November 25, 2019
    Publication date: March 19, 2020
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Albert Wan, Chao-Wen Shih, Han-Ping Pu, Hsin-Yu Pan, Sen-Kuei Hsu
  • TOP EMISSION MICROLED DISPLAY AND BOTTOM EMISSION MICROLED DISPLAY AND A METHOD OF FORMING THE SAME
    Publication number: 20200083280
    Abstract: A microLED display includes a first main substrate, micrLEDs disposed above the first main substrate, a first light blocking layer disposed above the first main substrate to define emission areas, a light guiding layer disposed in the emission areas, and a plurality of connecting structures disposed in the emission areas respectively and electrically connected with the microLEDs.
    Type: Application
    Filed: September 11, 2018
    Publication date: March 12, 2020
    Inventors: Biing-Seng Wu, Chao-Wen Wu
  • TOP EMISSION MICROLED DISPLAY AND BOTTOM EMISSION MICROLED DISPLAY AND A METHOD OF FORMING THE SAME
    Publication number: 20200083281
    Abstract: A microLED display includes a first main substrate, microLEDs disposed above the first main substrate, a first light blocking layer disposed above the first main substrate to define emission areas, a light guiding layer disposed in the emission areas, and a plurality of connecting structures disposed in the emission areas respectively and electrically connected with the microLEDs.
    Type: Application
    Filed: October 5, 2018
    Publication date: March 12, 2020
    Inventors: Biing-Seng Wu, Chao-Wen Wu
  • PACKAGE STRUCTURE
    Publication number: 20200067173
    Abstract: A package structure including a first redistribution circuit structure, a semiconductor die, first antennas and second antennas is provided. The semiconductor die is located on and electrically connected to the first redistribution circuit structure. The first antennas and the second antennas are located over the first redistribution circuit structure and electrically connected to the semiconductor die through the first redistribution circuit structure. A first group of the first antennas are located at a first position, a first group of the second antennas are located at a second position, and the first position is different from the second position in a stacking direction of the first redistribution circuit structure and the semiconductor die.
    Type: Application
    Filed: November 1, 2019
    Publication date: February 27, 2020
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Nan-Chin Chuang, Chen-Hua Yu, Chung-Shi Liu, Chao-Wen Shih, Shou-Zen Chang
  • Managing dynamic connection intervals for implantable and external devices
    Patent number: 10575346
    Abstract: A method, system and external instrument are provided. The method initiates a communication link between an external instrument (EI) and an implantable medical device (MD), established a first connection interval for conveying data packets between the EI and IMD and monitors a connection criteria that includes at least one of a data throughput requirement. A battery indicator or link condition of the communications link is between the IMD and EI. The method further changes from the first connection interval to a second connection interval based on the connection criteria.
    Type: Grant
    Filed: February 11, 2019
    Date of Patent: February 25, 2020
    Assignee: PACESETTER, INC.
    Inventors: Yongjian Wu, Chao-Wen Young, Jun Yang, Xing Pei, Reza Shahandeh
  • PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
    Publication number: 20200058607
    Abstract: A package structure include a ground plate, a semiconductor die, a molding compound, and an antenna element. The semiconductor die is located over the ground plate. The molding compound is located over the semiconductor die. The antenna element is located in the molding compound and overlaps with the ground plate along a stacking direction of the ground plate, the semiconductor die and the molding compound. The antenna element has a first side levelled with a first surface of the molding compound, and the ground plate is located between the semiconductor die and the antenna element.
    Type: Application
    Filed: October 23, 2019
    Publication date: February 20, 2020
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Albert Wan, Chao-Wen Shih, Shou-Zen Chang, Nan-Chin Chuang
  • WAVELENGTH CONVERSION FILM
    Publication number: 20200041101
    Abstract: A wavelength conversion film including a phosphor layer and a light scattering layer is provided. The phosphor layer includes a first phosphor and a first substrate. The light scattering layer includes a plurality of titanium dioxide particles and a second substrate. The wavelength conversion film further includes a photoluminescence material and a plurality of nanoparticles. The photoluminescence material and the plurality of nanoparticles are located in at least one of the phosphor layer and the light scattering layer or respectively located in the phosphor layer and the light scattering layer. The wavelength conversion film of the invention may prevent the occurrence of photocatalytic effect and increase the light conversion efficiency.
    Type: Application
    Filed: October 1, 2018
    Publication date: February 6, 2020
    Applicant: Chunghwa Picture Tubes, LTD.
    Inventors: Wen-Jiunn Hsieh, Chao-Wen Yeh
  • Utilizing signed credentials for secure communication with an implantable medical device
    Patent number: 10541977
    Abstract: Methods and devices for establishing secure communications with an implantable medical device (IMD) are provided. The method and devices receive a credential from an external instrument (EI). The credential is signed utilizing a private key, and the credential includes at least two of a credential time to live (TTL) indicator, an IMD Identifier (ID), and an EI ID. The method and device authenticate the credential using a public key and verify the at least two of the TTL indicator, the IMD ID, and the EI ID. The method and device establish a secure communications session with the EI based on the verification and authentication.
    Type: Grant
    Filed: July 25, 2017
    Date of Patent: January 21, 2020
    Assignee: PACESETTER, INC.
    Inventors: Yongjian Wu, Mostafa Sadeghi, Chao-Wen Young, Jun Yang, Samir Shah, Simon Skup
  • Package structure, electronic device and method of fabricating package structure
    Patent number: 10535913
    Abstract: In accordance with some embodiments, a package structure includes an RFIC chip. an insulating encapsulation, a redistribution circuit structure, an antenna and a microwave director. The insulating encapsulation encapsulates the RFIC chip. The redistribution circuit structure is disposed on the insulating encapsulation and electrically connected to the RFIC chip. The antenna is disposed on the insulating encapsulation and electrically connected to the RFIC chip through the redistribution circuit structure. The antenna is located between the microwave director and the RFIC chip. The microwave director has a microwave directivity enhancement surface located at a propagating path of a microwave received or generated by the antenna.
    Type: Grant
    Filed: April 29, 2019
    Date of Patent: January 14, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Min-Chien Hsiao, Chen-Hua Yu, Chung-Shi Liu, Chao-Wen Shih, Shou-Zen Chang
  • LIGHT EMITTING ELEMENT
    Publication number: 20190387616
    Abstract: The present invention discloses a light emitting element comprising a printed circuit board and a light emitting diode. The printed circuit board comprises a photosensitive solder resist layer. Materials of the photosensitive solder resist layer comprise a reflective material and at least one of a conductive nanoparticle and a photoluminescent material. The light emitting diode is disposed on the photosensitive solder resist layer of the circuit board, and is electrically connected to the printed circuit board. By adding at least one of the conductive nanoparticle and the photoluminescent material, the light emitting element of the present invention reduces the photodegradation of the solder resist layer, and improves the reflectivity of the photosensitive solder resist layer.
    Type: Application
    Filed: August 23, 2018
    Publication date: December 19, 2019
    Applicant: Chunghwa Picture Tubes, LTD.
    Inventors: Wen-Jiunn Hsieh, Chao-Wen Yeh
  • BONDING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE THEREOF
    Publication number: 20190386191
    Abstract: A bonding method of a semiconductor device is disclosed. The method includes steps of forming a plurality of holes on two bonding parts of a main substrate, respectively; disposing a semiconductor device on the main substrate, and aligning the two bonding parts with two conduction parts of the semiconductor device; aligning a laser to the conduction parts and operating the laser to emit a laser beam from a lower part of the main substrate, wherein the laser beam passes through the holes of the bonding part to strike on the conduction part, so as to melt each conduction part to bond with the bonding part. With configuration of the holes, the conduction parts and the bonding part can be smoothly bonded by using laser, so as to achieve the purpose of transferring the semiconductor device.
    Type: Application
    Filed: February 5, 2019
    Publication date: December 19, 2019
    Inventors: Biing-Seng WU, Chao-Wen WU, Hsing-Ying LEE