Abstract: A tester for testing an electrical component. The tester includes a database of testing specifications for electrical components, a tester connector for physically and electrically connecting to different electrical components, and an output device. The tester identifies an electrical component connected to the tester connector and provide corresponding identification data, retrieves a testing specification from the database using the identification data, commands a test of the electrical component according to the testing specification, and outputs an indication of a result of the test through the output device.

Abstract: A tester for testing an electrical component. The tester includes a database of testing specifications for electrical components, a tester connector for physically and electrically connecting to different electrical components, and an output device. The tester identifies an electrical component connected to the tester connector and provide corresponding identification data, retrieves a testing specification from the database using the identification data, commands a test of the electrical component according to the testing specification, and outputs an indication of a result of the test through the output device.

Abstract: Integrated circuit (IC) devices include transistors with gate, source and drain contact metallization, some of which are jumpered together by a metallization that is recessed below a height of other metallization that is not jumpered. The jumper metallization may provide a local interconnect between terminals of one transistor or adjacent transistors, for example between a gate of one transistor and a source/drain of another transistor. The jumper metallization may not induce the same pitch constraints faced by interconnect line metallization levels employed for more general interconnection. In some examples, a static random-access memory (SRAM) bit-cell includes a jumper metallization joining two transistors of the cell to reduce cell height for a given feature patterning capability.

Abstract: Metal spacer-based approaches for fabricating conductive lines/interconnects are described. In an example, an integrated circuit structure includes a substrate. A first spacer pattern is on the substrate, the first spacer pattern comprising a first plurality of dielectric spacers and a first plurality of metal spacers formed along sidewalls of the first plurality of dielectric spacers, wherein the first plurality of dielectric spacers have a first width (W1). A second spacer pattern is on the substrate, where the second spacer pattern interleaved with the first spacer pattern, the second spacer pattern comprising a second plurality of dielectric spacers having a second width (W2) formed on exposed sidewalls of the first plurality of metal spacers, and a second plurality of metal spacers formed on exposed sidewalls of the second plurality of dielectric spacers.

Abstract: Back-side transistor contacts that wrap around a portion of source and/or drain semiconductor bodies, related transistor structures, integrated circuits, systems, and methods of fabrication are disclosed. Such back-side transistor contacts are coupled to a top and a side of the source and/or drain semiconductor and extend to back-side interconnects. Coupling to top and side surfaces of the source and/or drain semiconductor reduces contact resistance and extending the metallization along the side reduces transistor cell size for improve device density.

Abstract: Techniques for improved extreme ultraviolet (EUV) patterning using assist features, related transistor structures, integrated circuits, and systems, are disclosed. A number of semiconductor fins and assist features are patterned into a semiconductor substrate using EUV. The assist features increase coverage of absorber material in the EUV mask, thereby reducing bright field defects in the EUV patterning. The semiconductor fins and assist features are buried in fill material and a mask is patterned that exposes the assist features and covers the semiconductor fins. The exposed assist features are partially removed and the protected active fins are ultimately used in transistor devices.

Abstract: Disclosed is a system for drone-based recharging of a VR/AR wearable assembly. A system is disclosed comprising a wireless charging device; a wearable assembly; a light field capture VR/AR device comprising a first charging surface and a second connective surface, the first charging surface configured to be positioned on the wireless charging device, the second connective surface configured to be communicatively coupled to the wearable assembly; and a drone device including a network interface, the drone device configured to: receive notifications from the light field capture VR/AR device, the notification indicating that the light field capture VR/AR device is fully charged, remove the light field capture VR/AR device from the charging device, and attach the light field capture VR/AR device to the wearable assembly.

Abstract: An integrated circuit structure includes a first interconnect level including a first dielectric between a pair of interconnect structures, a second interconnect level above the first interconnect level. The second interconnect level includes a cap structure including a second dielectric on the first dielectric, the cap structure includes a top surface and a sidewall surface and a liner comprising a third dielectric on the top surface and on the sidewall surface.

Abstract: An integrated circuit interconnect structure includes a first metallization level including a first metal line having a first sidewall and a second sidewall extending a length in a first direction. A second metal line is adjacent to the first metal line and a dielectric is between the first metal line and the second metal line. A second metallization level is above the first metallization level where the second metallization level includes a third metal line extending a length in a second direction orthogonal to the first direction. The third metal line extends over the first metal line and the second metal line but not beyond the first sidewall. A conductive via is between the first metal line and the third metal line where the conductive via does not extend beyond the first sidewall or beyond the second sidewall.

Abstract: An integrated circuit interconnect structure includes a first metallization level including a first metal line having a first sidewall and a second sidewall extending a length in a first direction. A second metal line is adjacent to the first metal line and a dielectric is between the first metal line and the second metal line. A second metallization level is above the first metallization level where the second metallization level includes a third metal line extending a length in a second direction orthogonal to the first direction. The third metal line extends over the first metal line and the second metal line but not beyond the first sidewall. A conductive via is between the first metal line and the third metal line where the conductive via does not extend beyond the first sidewall or beyond the second sidewall.

Abstract: Disclosed is a system for drone-based recharging of a VR/AR wearable assembly. A system is disclosed comprising a wireless charging device; a wearable assembly; a light field capture VR/AR device comprising a first charging surface and a second connective surface, the first charging surface configured to be positioned on the wireless charging device, the second connective surface configured to be communicatively coupled to the wearable assembly; and a drone device including a network interface, the drone device configured to: receive notifications from the light field capture VR/AR device, the notification indicating that the light field capture VR/AR device is fully charged, remove the light field capture VR/AR device from the charging device, and attach the light field capture VR/AR device to the wearable assembly.

Abstract: An integrated circuit interconnect structure includes a first metallization level including a first metal line having a first sidewall and a second sidewall extending a length in a first direction. A second metal line is adjacent to the first metal line and a dielectric is between the first metal line and the second metal line. A second metallization level is above the first metallization level where the second metallization level includes a third metal line extending a length in a second direction orthogonal to the first direction. The third metal line extends over the first metal line and the second metal line but not beyond the first sidewall. A conductive via is between the first metal line and the third metal line where the conductive via does not extend beyond the first sidewall or beyond the second sidewall.

Abstract: Disclosed is a system for drone-based recharging of a VR/AR wearable assembly. A system is disclosed comprising a wireless charging device; a wearable assembly; a light field capture VR/AR device comprising a first charging surface and a second connective surface, the first charging surface configured to be positioned on the wireless charging device, the second connective surface configured to be communicatively coupled to the wearable assembly; and a drone device including a network interface, the drone device configured to: receive notifications from the light field capture VR/AR device, the notification indicating that the light field capture VR/AR device is fully charged, remove the light field capture VR/AR device from the charging device, and attach the light field capture VR/AR device to the wearable assembly.

Abstract: Disclosed is a device comprising a headband portion configured to fit atop a user's head; an ear piece portion physically and communicatively coupled to one end of the headband portion; a modular processing device communicatively coupled to the ear piece portion wherein the modular processing device is configured to be physically detached and attached from ear piece portion; an arm portion connected to the ear piece portion and configured to facilitate data communications between the modular processing device and a virtual reality or augmented reality display portion.

Abstract: Disclosed is a VR/AR device. In one embodiment, a device is disclosed comprising a housing comprising a processor disposed within the housing; a telescopic member connected to the housing via a rotatable connector at a first end of the telescopic member; and a display device connected to a second end of the telescopic member, the display device communicatively coupled to the processor and configured to rotate about an axis of the telescopic member while displaying virtual or augment reality content.

Abstract: Metal spacer-based approaches for fabricating conductive lines/interconnects are described. In an example, an integrated circuit structure includes a substrate. A first spacer pattern is on the substrate, the first spacer pattern comprising a first plurality of dielectric spacers and a first plurality of metal spacers formed along sidewalls of the first plurality of dielectric spacers, wherein the first plurality of dielectric spacers have a first width (W1). A second spacer pattern is on the substrate, where the second spacer pattern interleaved with the first spacer pattern, the second spacer pattern comprising a second plurality of dielectric spacers having a second width (W2) formed on exposed sidewalls of the first plurality of metal spacers, and a second plurality of metal spacers formed on exposed sidewalls of the second plurality of dielectric spacers.

Abstract: Disclosed is a VR/AR projection device. A device is disclosed comprising a housing comprising a processor disposed within the housing; a vapor projection component disposed within the center of the housing and communicatively coupled to the processor, the vapor projection component comprising: a water tank situated on the interior side of the vapor projection component, a set of tubes position on the exterior side of the vapor projection component, a transducer configured to nebulize water in the water tank, a movable belt comprising a plurality of apertures movable respective to the set of tubes, a variable speed fan configured to exert positive pressure on the nebulized water while the transducer nebulizes the water in the water tank and force the nebulized water through the apertures and the set of tubes, generating a set of nebulized vapor jets extending outward from the surface of the vapor projection component; and a projection device configured to display an image on the nebulized vapor jets.

Abstract: Disclosed is a VR/AR device. In one embodiment, a device is disclosed comprising a housing comprising a processor disposed within the housing; a telescopic member connected to the housing via a rotatable connector at a first end of the telescopic member; and a display device connected to a second end of the telescopic member, the display device communicatively coupled to the processor and configured to rotate about an axis of the telescopic member while displaying virtual or augment reality content.

Abstract: Disclosed is a device comprising a headband portion configured to fit atop a user's head; an ear piece portion physically and communicatively coupled to one end of the headband portion; a modular processing device communicatively coupled to the ear piece portion wherein the modular processing device is configured to be physically detached and attached from ear piece portion; an arm portion connected to the ear piece portion and configured to facilitate data communications between the modular processing device and a virtual reality or augmented reality display portion.

Abstract: Disclosed is a VR/AR projection device. A device is disclosed comprising a housing comprising a processor disposed within the housing; a vapor projection component disposed within the center of the housing and communicatively coupled to the processor, the vapor projection component comprising: a water tank situated on the interior side of the vapor projection component, a set of tubes position on the exterior side of the vapor projection component, a transducer configured to nebulize water in the water tank, a movable belt comprising a plurality of apertures movable respective to the set of tubes, a variable speed fan configured to exert positive pressure on the nebulized water while the transducer nebulizes the water in the water tank and force the nebulized water through the apertures and the set of tubes, generating a set of nebulized vapor jets extending outward from the surface of the vapor projection component; and a projection device configured to display an image on the nebulized vapor jets.