Patents by Inventor Che Lin
Che Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12371050Abstract: A method for early warning a blind area of a vehicle. In the method, the electronic device obtains at least one target image acquired by at least one camera of the vehicle. The electronic device further determines parameters of at least one target object in each of the at least one target image and a three-dimensional detection frame for each of the at least one target object based on the parameters. The electronic device further obtains a target detection frame of each of the at least one target object in a top view image of a plane where the vehicle is located by projecting the three-dimensional detection frame into the top view image and outputs alert information in response that an overlapped area exists between the target detection frame and a preset blind area of the top view image.Type: GrantFiled: November 13, 2023Date of Patent: July 29, 2025Assignee: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: Cheng-Feng Wang, Po-Chung Wang, Li-Che Lin, Yen-Yi Lin
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Patent number: 12374395Abstract: A resistive memory apparatus including a memory cell array, at least one dummy transistor and a control circuit is provided. The memory cell array includes a plurality of memory cells. Each of the memory cells includes a resistive switching element. The dummy transistor is electrically isolated from the resistive switching element. The control circuit is coupled to the memory cell array and the dummy transistor. The control circuit is configured to provide a first bit line voltage, a source line voltage and a word line voltage to the dummy transistor to drive the dummy transistor to output a saturation current. The control circuit is further configured to determine a value of a second bit line voltage for driving the memory cells according to the saturation current. In addition, an operating method and a memory cell array of the resistive memory apparatus are also provided.Type: GrantFiled: December 28, 2023Date of Patent: July 29, 2025Assignee: Winbond Electronics Corp.Inventors: Ming-Che Lin, Min-Chih Wei, Ping-Kun Wang, Yu-Ting Chen, Chih-Cheng Fu, Chang-Tsung Pai
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Publication number: 20250218036Abstract: An image processing method applied to a vehicle-mounted device is provided. The vehicle-mounted device obtains a first image of a front part of and a second image of a rear part of the external vehicle and obtains several spatial coordinates of several vertices of the target visual plane. The device projects each of the spatial coordinate into a first coordinate system of the first image and a second coordinate system of the second image and obtains a first projection coordinate and a second projection coordinate, generates a first transformation matrix or a second transformation matrix according to the first projection coordinate and the second projection coordinate, and obtains a first conversion image corresponding to the first image, or a second conversion image corresponding to the second image; and generates an image of a whole body of the external vehicle based on the first converted image and the second image.Type: ApplicationFiled: December 26, 2024Publication date: July 3, 2025Inventors: LI-CHE LIN, Cheng-Feng Wang
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Publication number: 20250189957Abstract: An electronic device manufacturing system configured to obtain, by a processor, sensor data associated with a substrate manufacturing process performed in a process chamber. The sensor data is provided, as input data, to a machine learning model. The machine learning trained uses a weighted feature that reflects a relationship between one or more variables related to an initial feature and a characteristic sequence that defines a relationship between two or more manufacturing parameters. An output value of the machine learning model is obtained, the output value being indicative of metrology data.Type: ApplicationFiled: February 13, 2025Publication date: June 12, 2025Inventors: Jui-Che Lin, Chao-Hsien Lee, Shauh-Teh Juang
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Publication number: 20250192125Abstract: A display panel includes an array substrate and light emitting elements. The array substrate includes a substrate, pad groups, and a retaining wall structure. The substrate has a surface. The surface has a corner, and the corner has two edges connected to each other. The pad groups are disposed on the surface and include a first pad groups located at the corner. The retaining wall structure is disposed on the surface and is located at the corner, and is located between the first pad groups and the two edges of the corner. The retaining wall structure and at least one film layer of the pad groups are formed by patterning the same film layer. The light emitting elements are disposed on the pad groups, respectively.Type: ApplicationFiled: October 11, 2024Publication date: June 12, 2025Inventors: Hui-Chen HSIAO, Shih-Che Lin, Yu-Hsun Chiu
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Publication number: 20250183955Abstract: The control method includes determining a target operating mode in response to a target instruction in a target scenario, controlling a target antenna in the target operating mode to receive a first radiated signal at a first frequency, and transmitting a second radiated signal at a second frequency. The first frequency and the second frequency belong to a same frequency band. The target operating mode includes a plurality of different antenna operating modes. Under at least two of the antenna operating modes of the plurality of different antenna operating modes, the second radiated signal at the second frequency is transmitted at different target powers to cause transmission powers of the plurality of different operating modes to be equal to or approach a power limit of the target scenario. The target power represents a power of a radio frequency path between an antenna port of the target antenna and a transceiver.Type: ApplicationFiled: November 20, 2024Publication date: June 5, 2025Inventors: Zhaobin LIN, Yu-Che LIN
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Patent number: 12324202Abstract: A semiconductor device structure includes nanostructures formed over a substrate. The structure also includes a gate structure formed over and around the nanostructures. The structure also includes a spacer layer formed over a sidewall of the gate structure over the nanostructures. The structure also includes a source/drain epitaxial structure formed adjacent to the spacer layer. The structure also includes a contact structure formed over the source/drain epitaxial structure with an air spacer formed between the spacer layer and the contact structure.Type: GrantFiled: November 19, 2021Date of Patent: June 3, 2025Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Kai-Hsuan Lee, Shih-Che Lin, Po-Yu Huang, Shih-Chieh Wu, I-Wen Wu, Chen-Ming Lee, Fu-Kai Yang, Mei-Yun Wang
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Publication number: 20250156058Abstract: An electronic device manufacturing system configured to adjust a virtual knob associated with a trained machine learning model. The virtual knob is configured to adjust a representative value of the trained machine learning model to control a performance of the trained machine learning model. Sensor data is provided as input to the trained machine learning model, the sensor data being associated with a substrate manufacturing process performed on a substate. An output value of the modified machine learning model is obtained, the output value being indicative of metrology data.Type: ApplicationFiled: January 16, 2025Publication date: May 15, 2025Inventors: Jui-Che Lin, Yan-Jhu Chen, Chao-Hsien Lee, Shauh-Teh Juang, Pengyu Han, Wallace Wang
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Patent number: 12297366Abstract: A quantum dot oil-based ink is provided. The quantum dot oil-based ink includes a quantum dot material, a dispersing solvent, a viscosity modifier, and a surface tension modifying solution. The dispersing solvent includes a linear alkane having 6 to 14 carbon atoms. The viscosity modifier includes an aromatic hydrocarbon having 10 to 18 carbon atoms or a linear olefin having 16 to 20 carbon atoms. The surface tension modifying solution includes a hydrophobic polymer material and a nonpolar solvent.Type: GrantFiled: November 29, 2022Date of Patent: May 13, 2025Assignee: LEXTAR ELECTRONICS CORPORATIONInventors: Chun Che Lin, Chong-Ci Hu, Yi-Ting Tsai, Ching-Yi Chen, Yu-Chun Lee
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Patent number: 12291610Abstract: An aquatic plant biomass-based decomposable and antibacterial plastic masterbatch composition contains: environmental biodegradable polymer materials, aquatic plant fiber materials, natural decomposable polymer, antibacterial materials, mineral fillers, Bis (2-ethylhexyl) adipate (DOA), 1,1,1-Tris Methylolpropane 1,1,1-Trimethylolpropane (TMP), and silane coupling agent. Thereby, low cost, excellent mechanical properties, release of far infrared rays and antibacterial effect are achieved.Type: GrantFiled: May 23, 2022Date of Patent: May 6, 2025Inventor: Sun-Che Lin
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Patent number: 12278188Abstract: Vias, along with methods for fabricating vias, are disclosed that exhibit reduced capacitance and resistance. An exemplary interconnect structure includes a first source/drain contact and a second source/drain contact disposed in a dielectric layer. The first source/drain contact physically contacts a first source/drain feature and the second source/drain contact physically contacts a second source/drain feature. A first via having a first via layer configuration, a second via having a second via layer configuration, and a third via having a third via layer configuration are disposed in the dielectric layer. The first via and the second via extend into and physically contact the first source/drain contact and the second source/drain contact, respectively. A first thickness of the first via and a second thickness of the second via are the same. The third via physically contacts a gate structure, which is disposed between the first source/drain contact and the second source/drain contact.Type: GrantFiled: June 30, 2023Date of Patent: April 15, 2025Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Shih-Che Lin, Po-Yu Huang, Chao-Hsun Wang, Kuo-Yi Chao, Mei-Yun Wang, Feng-Yu Chang, Rueijer Lin, Wei-Jung Lin, Chen-Yuan Kao
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Patent number: 12272708Abstract: An image sensor device includes a semiconductor device, a plurality of photo sensitive regions, a dielectric layer, a grid structure, and a plurality of convex dielectric lenses. The photo sensitive regions are in the semiconductor substrate. The dielectric layer is over a backside surface of the semiconductor substrate. The grid structure is over a backside surface of the dielectric layer. The grid structure includes a plurality of grid lines. Each of the grid lines comprises a lower portion and an upper portion forming an interface with the lower portion. The convex dielectric lenses are alternately arranged with the grid lines over the backside surface of the dielectric layer. Apexes of the plurality of convex dielectric lenses are higher than an interface between the upper portion and the lower portion of each of the grid lines.Type: GrantFiled: December 5, 2022Date of Patent: April 8, 2025Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Shiu-Ko Jangjian, Chih-Nan Wu, Chun-Che Lin, Yu-Ku Lin
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Patent number: 12266703Abstract: An interconnect fabrication method is disclosed herein that utilizes a disposable etch stop hard mask over a gate structure during source/drain contact formation and replaces the disposable etch stop hard mask with a dielectric feature (in some embodiments, dielectric layers having a lower dielectric constant than a dielectric constant of dielectric layers of the disposable etch stop hard mask) before gate contact formation. An exemplary device includes a contact etch stop layer (CESL) having a first sidewall CESL portion and a second sidewall CESL portion separated by a spacing and a dielectric feature disposed over a gate structure, where the dielectric feature and the gate structure fill the spacing between the first sidewall CESL portion and the second sidewall CESL portion. The dielectric feature includes a bulk dielectric over a dielectric liner. The dielectric liner separates the bulk dielectric from the gate structure and the CESL.Type: GrantFiled: December 9, 2021Date of Patent: April 1, 2025Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Shih-Che Lin, Po-Yu Huang, I-Wen Wu, Chen-Ming Lee, Chia-Hsien Yao, Chao-Hsun Wang, Fu-Kai Yang, Mei-Yun Wang
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Patent number: 12259719Abstract: An electronic device manufacturing system configured to receive, by a processor, input data reflecting a feature related to a manufacturing process of a substrate. The manufacturing system is further configured to generate a characteristic sequence defining a relationship between at least two manufacturing parameters, and determine a relationship between one or more variables related to the feature and the characteristic sequence. The manufacturing system is further configured to determine a weight based on the determined relationship and apply the weight to the feature. The manufacturing system is further configured to train a machine-learning model in view of the weighted feature.Type: GrantFiled: May 25, 2022Date of Patent: March 25, 2025Assignee: Applied Materials, Inc.Inventors: Jui-Che Lin, Chao-Hsien Lee, Shauh-Teh Juang
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Publication number: 20250087466Abstract: The present disclosure relates to a processing apparatus and a processing method, and the processing apparatus includes a chamber, a wafer carrier, at least one air inlet and at least one electrode, wherein the wafer carrier is extended into the chamber, the gas inlet is arranged around the chamber, and the electrode is disposed on the chamber.Type: ApplicationFiled: October 19, 2023Publication date: March 13, 2025Applicant: United Semiconductor (Xiamen) Co., Ltd.Inventors: Ching-Shu Lo, Yan Cai, Tsung Che Lin, Wen Yi Tan
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Patent number: 12249599Abstract: Multiple chip module (MCM) structures are described. In an embodiment, a module includes a first and second components on the top side of a module substrate, a stiffener structure mounted on the top side of the module substrate, and a lid mounted on the stiffener structure and covering the first component and the second component. The stiffener is joined to the lid within a trench formed in a roof of the lid.Type: GrantFiled: March 31, 2023Date of Patent: March 11, 2025Assignee: Apple Inc.Inventors: Wei Chen, Jie-Hua Zhao, Jun Zhai, Po-Hao Chang, Hsien-Che Lin, Ying-Chieh Ke, Kunzhong Hu
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Publication number: 20250074444Abstract: A method for early warning a blind area of a vehicle. In the method, the electronic device obtains at least one target image acquired by at least one camera of the vehicle. The electronic device further determines parameters of at least one target object in each of the at least one target image and a three-dimensional detection frame for each of the at least one target object based on the parameters. The electronic device further obtains a target detection frame of each of the at least one target object in a top view image of a plane where the vehicle is located by projecting the three-dimensional detection frame into the top view image and outputs alert information in response that an overlapped area exists between the target detection frame and a preset blind area of the top view image.Type: ApplicationFiled: November 13, 2023Publication date: March 6, 2025Inventors: CHENG-FENG WANG, PO-CHUNG WANG, LI-CHE LIN, YEN-YI LIN
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Publication number: 20250072008Abstract: Provided is a semiconductor device including: a substrate, a plurality of isolation structures, a plurality of channel layers, and a gate structure. The substrate includes a plurality of fins thereon. The plurality of isolation structures are respectively disposed between the plurality of fins. A top surface of the plurality of isolation structures is higher than a top surface of the plurality of fins to form a plurality of openings. The plurality of channel layers are respectively disposed in the plurality of openings. Each channel layer is in contact with a corresponding fin and extends to cover a lower sidewall of a corresponding isolation structure, thereby forming a U-shaped structure. The gate structure is filled in the plurality of openings and extends to cover the top surface of the plurality of isolation structures.Type: ApplicationFiled: November 7, 2024Publication date: February 27, 2025Applicant: Winbond Electronics Corp.Inventors: Chi-Ching Liu, Chih-Chao Huang, Ming-Che Lin, Frederick Chen, Han-Huei Hsu
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Publication number: 20250070085Abstract: A method includes: forming first bond pads along a wafer; bonding a first die to a first set of the first bond pads, the first die being electrically connected to the wafer; depositing a gap-fill dielectric over the wafer and around the first die; forming openings in the gap-fill dielectric; forming first active through vias in physical contact with the second set of the first bond pads and first dummy through vias in physical contact with the third set of the first bond pads, the first active through vias being electrically connected to the wafer, the first dummy through vias being electrically isolated from the wafer; forming second bond pads along the first die, the first active through vias, and the first dummy through vias; and bonding a second die to the first die and to a first active via of the first active through vias.Type: ApplicationFiled: January 2, 2024Publication date: February 27, 2025Inventors: Tsang-Jiuh Wu, Shih-Che Lin, Cheng-Chun Tsai, Ping-Jung Wu, Hao-Wen Ko
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Patent number: 12236697Abstract: A method of identifying characters in images extracts features of a detection image including characters. Enhancement processing is performed on the detection image according to the features to obtain an enhanced image. Closed edges of the characters are detected in the enhanced image. First rectangular outlines of the characters are determined according to the closed edges. The first rectangular outlines are corrected to obtain second rectangular outlines. The characters are cropped from the detection image according to the second rectangular outlines. The method identifies characters in images accurately and rapidly.Type: GrantFiled: May 18, 2022Date of Patent: February 25, 2025Assignee: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: Cheng-Feng Wang, Li-Che Lin, Hui-Xian Yang