Patents by Inventor Che Liu

Che Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240127988
    Abstract: An over-current protection device includes a first metal layer, a second metal layer and a heat-sensitive layer laminated therebetween. The heat-sensitive layer exhibits a positive temperature coefficient (PTC) characteristic and includes a first polymer and a conductive filler. The first polymer consists of polyvinylidene difluoride (PVDF), and PVDF exists in different phases such as ?-PVDF, ?-PVDF and ?-PVDF. The total amount of ?-PVDF, ?-PVDF and ?-PVDF is calculated as 100%, and the amount of ?-PVDF accounts for 48% to 55%. The conductive filler has a metal-ceramic compound.
    Type: Application
    Filed: March 2, 2023
    Publication date: April 18, 2024
    Inventors: HSIU-CHE YEN, YUNG-HSIEN CHANG, CHENG-YU TUNG, Chia-Yuan Lee, CHEN-NAN LIU, Yao-Te Chang, FU-HUA CHU
  • Publication number: 20240126017
    Abstract: A photonic integrated circuit structure includes a substrate, a waveguide structure and a spot size converter. The waveguide structure is disposed over a surface of the substrate and has a receiving end. The spot size converter includes a concave mirror and a curved mirror. The concave mirror and the curved mirror are opposite to each other and have a common focus. The concave mirror is arranged to reflect a parallel beam from a transmitting end such that a first reflected beam is able to converge at the common focus, and the curved mirror is arranged to reflect the first reflected beam such that a second reflected beam is directed parallel to the receiving end of the waveguide structure.
    Type: Application
    Filed: October 14, 2022
    Publication date: April 18, 2024
    Inventors: Ping Ming Liu, Hsiao Che Wu
  • Publication number: 20240127989
    Abstract: An over-current protection device includes a first metal layer, a second metal layer and a heat-sensitive layer laminated therebetween. The heat-sensitive layer exhibits a positive temperature coefficient (PTC) characteristic and includes a first polymer and a conductive filler. The first polymer consists of polyvinylidene difluoride (PVDF), and PVDF exists in different phases such as ?-PVDF, ?-PVDF and ?-PVDF. The total amount of ?-PVDF, ?-PVDF and ?-PVDF is calculated as 100%, and the amount of ?-PVDF accounts for 33% to 42%.
    Type: Application
    Filed: January 25, 2023
    Publication date: April 18, 2024
    Inventors: CHIA-YUAN LEE, CHENG-YU TUNG, HSIU-CHE YEN, CHEN-NAN LIU, YUNG-HSIEN CHANG, YAO-TE CHANG, FU-HUA CHU
  • Publication number: 20240124707
    Abstract: The disclosure provides a polyester composite board structure and a manufacturing method thereof. The manufacturing method includes extruding a polyester layer into a board using a multi-layer extrusion equipment, and laminating a polyester film by heat using a wheel during an extrusion process.
    Type: Application
    Filed: November 24, 2022
    Publication date: April 18, 2024
    Applicant: NAN YA PLASTICS CORPORATION
    Inventors: Te-Chao Liao, Chun-Che Tsao, Wen-Jui Cheng, Yueh-Shin Liu
  • Patent number: 11935753
    Abstract: A method for forming a packaged integrated circuit device includes providing a semiconductor wafer having a plurality of integrated circuit devices, each integrated circuit device extending into the semiconductor wafer to a first depth, and grinding a backside of the silicon wafer to no more than the first depth. The method further includes forming a backside cut between the integrated circuit devices. The backside cut extends to within the first depth, but the backside cut does not extend completely through the semiconductor wafer. The backside cut exposes a plurality of edges of each of the integrated circuit devices. The method further includes depositing, on the backside of the wafer, a metallization layer on a bottom surface of the integrated circuit devices and on the edges.
    Type: Grant
    Filed: December 9, 2021
    Date of Patent: March 19, 2024
    Assignee: NXP B.V
    Inventors: Kuan-Hsiang Mao, Wen Hung Huang, Che Ming Fang, Yufu Liu
  • Patent number: 11935804
    Abstract: In an embodiment, a device includes: an integrated circuit die; an encapsulant at least partially surrounding the integrated circuit die, the encapsulant including fillers having an average diameter; a through via extending through the encapsulant, the through via having a lower portion of a constant width and an upper portion of a continuously decreasing width, a thickness of the upper portion being greater than the average diameter of the fillers; and a redistribution structure including: a dielectric layer on the through via, the encapsulant, and the integrated circuit die; and a metallization pattern having a via portion extending through the dielectric layer and a line portion extending along the dielectric layer, the metallization pattern being electrically coupled to the through via and the integrated circuit die.
    Type: Grant
    Filed: April 10, 2023
    Date of Patent: March 19, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tzu-Sung Huang, Ming Hung Tseng, Yen-Liang Lin, Hao-Yi Tsai, Chi-Ming Tsai, Chung-Shi Liu, Chih-Wei Lin, Ming-Che Ho
  • Publication number: 20240083555
    Abstract: A waste collection apparatus for collecting waste in water is provided. The waste collection apparatus includes a floating device and a waste collection device coupled to the floating device. The waste collection device includes a fluid ejection element, and the flow out of the fluid ejection element flows toward a space where waste is collected.
    Type: Application
    Filed: May 12, 2023
    Publication date: March 14, 2024
    Inventors: Wei-Chun LIU, Ching-Fu WANG, Cheng-Che HO, Huan-Fu LIN
  • Publication number: 20240084536
    Abstract: A waste collection apparatus for collecting waste in water is provided. The waste collection apparatus includes a floating device and a waste collection device coupled to the floating device. The floating device includes a plurality of floating units. The waste collection device is coupled to the floating device. Each of the floating units includes a base and a pillar connected to the base, and the density of the base is greater than the density of the pillar.
    Type: Application
    Filed: January 10, 2023
    Publication date: March 14, 2024
    Inventors: Wei-Chun LIU, Ching-Fu WANG, Cheng-Che HO
  • Publication number: 20240081077
    Abstract: A transistor includes a first semiconductor layer, a second semiconductor layer, a semiconductor nanosheet, a gate electrode and source and drain electrodes. The semiconductor nanosheet is physically connected to the first semiconductor layer and the second semiconductor layer. The gate electrode wraps around the semiconductor nanosheet. The source and drain electrodes are disposed at opposite sides of the gate electrode. The first semiconductor layer surrounds the source electrode, the second semiconductor layer surrounds the drain electrode, and the semiconductor nanosheet is disposed between the source and drain electrodes.
    Type: Application
    Filed: September 1, 2022
    Publication date: March 7, 2024
    Applicants: Taiwan Semiconductor Manufacturing Company, Ltd., National Yang Ming Chiao Tung University
    Inventors: Po-Tsun Liu, Meng-Han Lin, Zhen-Hao Li, Tsung-Che Chiang, Bo-Feng Young, Hsin-Yi Huang, Sai-Hooi Yeong, Yu-Ming Lin
  • Patent number: 11925017
    Abstract: A semiconductor device is provided. The semiconductor device includes a substrate, a stacked gate structure, and a wall structure. The stacked gate structure is on the substrate and extending along a first direction. The wall structure is on the substrate and laterally aside the stacked gate structure. The wall structure extends along the first direction and a second direction perpendicular to the first direction. The stacked gate structure is overlapped with the wall structure in the first direction and the second direction.
    Type: Grant
    Filed: January 13, 2020
    Date of Patent: March 5, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chien-Hsuan Liu, Chiang-Ming Chuang, Chih-Ming Lee, Kun-Tsang Chuang, Hung-Che Liao, Chia-Ming Pan, Hsin-Chi Chen
  • Publication number: 20240069416
    Abstract: A light path folding element includes a first surface, a second surface, a first reflecting surface and a second reflecting surface. A light travels from the first surface into the light path folding element. The second surface is disposed relative to the first surface along a first direction and is parallel to the first surface, and the first direction is perpendicular to the first surface. The first reflecting surface connects the first surface and the second surface, an acute angle is formed between the first reflecting surface and the first surface, and the light forms an internal reflection via the first reflecting surface. The light forms another internal reflection via the second reflecting surface. The light path folding element further includes a light blocking structure, which extends from at least one of the first surface and the second surface into the light path folding element.
    Type: Application
    Filed: August 24, 2023
    Publication date: February 29, 2024
    Inventors: Ssu-Hsin LIU, Wei-Che TUNG, Lin-An CHANG, Ming-Ta CHOU
  • Patent number: 11842306
    Abstract: The present disclosure provides a method and system for predicting building energy consumption based on a Holt-Winters and an extreme learning machine, the method including: constructing a building simulation model based on actual operation parameters of a building to obtain an original energy consumption data set of the building; decomposing the original energy consumption data set to obtain a linear energy consumption data set and a nonlinear energy consumption data set; performing prediction on the linear energy consumption data set by using a trained Holt-Winters model to obtain a linear energy consumption prediction result; and inputting the nonlinear energy consumption data set, the original energy consumption data set, and the linear energy consumption prediction result into a trained extreme learning machine model to output a building energy consumption prediction value of the building simulation model.
    Type: Grant
    Filed: June 17, 2021
    Date of Patent: December 12, 2023
    Assignee: Shandong University
    Inventors: Chenghui Zhang, Che Liu, Bo Sun
  • Publication number: 20230394247
    Abstract: A system for human-machine collaborative conversation interaction includes one or more processors configured to execute instructions to cause the system to perform operations including: outputting, according to conversation data to be processed, structural information of the conversation data, wherein the conversation data comprises multiple turns of conversation; obtaining, according to the structural information, a semantic representation vector carrying phrase-dimensional semantic information, sentence-dimensional semantic information and topic-dimensional semantic information corresponding to the conversation data; obtaining semantic transfer relationships between each turn of conversation according to the semantic representation vector; and determining, according to the semantic representation vector and the semantic transfer relationships, conversation data matching service requirements so as to perform preset service processing through the determined conversation data.
    Type: Application
    Filed: May 25, 2023
    Publication date: December 7, 2023
    Inventors: Yongbin LI, Che LIU, Rui WANG, Jian SUN
  • Publication number: 20230375419
    Abstract: There is provided a force sensor including a substrate and a polymer material layer. The substrate has a circuit layout that includes a first electrode and a second electrode configured to form a capacitor therebetween. The polymer material layer covers at least on a space between the first electrode and the second electrode, and is used to change capacitance of the capacitor while being pressed. The force sensor is arranged inside a stem of an earphone for detecting the user input.
    Type: Application
    Filed: August 4, 2023
    Publication date: November 23, 2023
    Inventors: YEN-PO CHEN, HAO-CHE LIU, YEN-CHANG CHU, CHIH-MING SUN
  • Patent number: 11761830
    Abstract: There is provided a force sensor including a substrate and a polymer material layer. The substrate has a circuit layout that includes a first electrode and a second electrode configured to form a capacitor therebetween. The polymer material layer covers at least on a space between the first electrode and the second electrode, and is used to change capacitance of the capacitor while being pressed. The force sensor is arranged inside a stem of an earphone for detecting the user input.
    Type: Grant
    Filed: April 20, 2021
    Date of Patent: September 19, 2023
    Assignee: PIXART IMAGING INC.
    Inventors: Yen-Po Chen, Hao-Che Liu, Yen-Chang Chu, Chih-Ming Sun
  • Publication number: 20230143463
    Abstract: A sensor device for high speed rotating machine includes a rotating body and a sensor assembly. The rotating body includes a magnetic permeable ring and at least one positioning structure. The magnetic permeable ring includes a radial displacement sensing area and a rotational speed sensing area, and the positioning feature is arranged in the rotational speed sensing area. The sensor assembly includes four radial displacement sensors and two rotational speed sensors. The radial displacement sensor is a double-probe type sensor, and the speed sensor is a double-probe or four-probe type sensor. Through different types of the rotational speed sensors and the radial displacement sensors, the rotation speed and turning direction of the rotating body can be calculated.
    Type: Application
    Filed: June 22, 2022
    Publication date: May 11, 2023
    Inventors: XIN-QI CHEN, CHAO-YUN CHEN, CHUNG-CHE LIU
  • Publication number: 20220359436
    Abstract: Methods of forming connectors and packaged semiconductor devices are disclosed. In some embodiments, a connector is formed by forming a first photoresist layer over an interconnect structure, and patterning the first photoresist layer. The patterned first photoresist layer is used to form a first opening in an interconnect structure. The patterned first photoresist is removed, and a second photoresist layer is formed over the interconnect structure and in the first opening. The second photoresist layer is patterned to form a second opening over the interconnect structure in the first opening. The second opening is narrower than the first opening. At least one metal layer is plated through the patterned second photoresist layer to form the connector.
    Type: Application
    Filed: July 20, 2022
    Publication date: November 10, 2022
    Inventors: Jung Wei Cheng, Hai-Ming Chen, Chien-Hsun Lee, Hao-Cheng Hou, Hung-Jen Lin, Chun-Chih Chuang, Ming-Che Liu, Tsung-Ding Wang
  • Patent number: 11463676
    Abstract: A stereoscopic visualization system using shape from shading algorithm is an image conversion device connected between a monoscopic endoscope and a 3D monitor. The system applies the algorithm which generates a depth map for a 2D image of video frames. The algorithm first calculates a direction of a light source for the 2D image. Based upon the information of light distribution and shading for the 2D image, the depth map is generated. The depth map is used to calculate another view of the original 2D image by depth image based rendering algorithm in generation of stereoscopic images. After the new view is rendered, the stereoscopic visualization system also needs to convert the display format of the stereoscopic images for different kinds of 3D displays. Based on this method, it can replace the whole monoscopic endoscope with a stereo-endoscope system and no modification is required for the monoscopic endoscope.
    Type: Grant
    Filed: March 18, 2020
    Date of Patent: October 4, 2022
    Assignee: MEDICALTEK CO. LTD.
    Inventors: Yen-Yu Wang, Kai-Che Liu, Atul Kumar, Min-Liang Wang
  • Publication number: 20220304662
    Abstract: A collection and test device for a rapid test is provided. The device comprises a test fluid accommodation part having a test fluid accommodation space, a test paper accommodation part having a test paper accommodation space, and a collection probe having a channel for the test fluid to flow out from the collection probe. The two ends of the test paper accommodation part are respectively connected to the test fluid accommodation part and the collection probe, and the test paper accommodation space communicates with the channel of the collection probe. The test fluid accommodation space and the test paper accommodation space are separated from each other by a temporary barrier. The temporary barrier can be manually removed or broken to make the test fluid accommodation space communicate with the test paper accommodation space. The device of the present invention can provide the test results conveniently and rapidly.
    Type: Application
    Filed: March 23, 2022
    Publication date: September 29, 2022
    Inventors: Jia-En CHEN, Juin-Hong CHERNG, Yuan-Hao CHEN, Cheng-Che LIU, Cheng-Cheung CHEN, Yu-Min TSAI, Chin-Hsieh YI
  • Publication number: 20220298588
    Abstract: A nucleic acid probe set is disclosed. The nucleic acid probe set comprises a detection probe and a capture probe, and the detection probe and the capture probe both include a nucleotide sequence that is extracted from a conserved region of a genome sequence belong to a BK virus. A nucleic acid lateral flow immunoassay for using in detection of BK virus is also disclosed. The nucleic acid lateral flow immunoassay comprises: the forgoing nucleic acid probe set, a test strip, and a streptavidin (SA) solution. Experimental data have proved that, the nucleic acid lateral flow immunoassay can be adopted for conducting a BK virus detection on a sample that is collected from environmental water, sewage water, drinking water, urine, or serum.
    Type: Application
    Filed: June 23, 2021
    Publication date: September 22, 2022
    Inventors: Cheng-Che Liu, Po-Da Hong, Yi-Huei Huang, Kuan-Yi Yu, Shou-Ping Huang, Shou-Hung Tang, Juin-Hong Cherng