Abstract: A power controller is provided. The power controller has a peak current setting unit utilized for deciding a peak current value according to a divided input voltage and a current limit turn-on time value. The comparator sends a first trigger signal once a current value of a power switch of the power system reaches the peak current value. The turn-on time calculation module defines the number of current limit operations by using the count of first trigger signals received in a calculation time period and then processes a recursive calculation to calculate a turn-on time value according to the current limit turn-on time value, the number of current limit operations, and a target number of current limit operations. The timer transmits a second trigger signal when the set turn-on time value is counted. The switch control module turns off the power switch when receiving one of the first and the second trigger signal.

Abstract: A semiconductor package is provided, which includes: a dielectric layer made of a material used for fabricating built-up layer structures; a conductive trace layer formed on the dielectric layer; a semiconductor chip is mounted on and electrically connected to the conductive trace layer; and an encapsulant formed over the dielectric layer to encapsulate the semiconductor chip and the conductive trace layer. Since a strong bonding is formed between the dielectric layer and the conductive trace layer, the present invention can prevent delamination between the dielectric layer and the conductive trace layer from occurrence, thereby improving reliability and facilitating the package miniaturization by current fabrication methods.

Abstract: A power controller is provided. The power controller has a peak current setting unit utilized for deciding a peak current value according to a divided input voltage and a current limit turn-on time value. The comparator sends a first trigger signal once a current value of a power switch of the power system reaches the peak current value. The turn-on time calculation module defines the number of current limit operations by using the count of first trigger signals received in a calculation time period and then processes a recursive calculation to calculate a turn-on time value according to the current limit turn-on time value, the number of current limit operations, and a target number of current limit operations. The timer transmits a second trigger signal when the set turn-on time value is counted. The switch control module turns off the power switch when receiving one of the first and the second trigger signal.

Abstract: A semiconductor device includes a semiconductor substrate, a conductive pad on the semiconductor substrate, and a conductor over the conductive pad. The semiconductor device further has a molding compound surrounding the semiconductor substrate, the conductive pad and the conductor. In the semiconductor device, the conductor has a stud shape.

Abstract: Packages structure and methods of forming them are discussed. A structure includes a first die, a first encapsulant at least laterally encapsulating the first die, and a redistribution structure on the first die and the first encapsulant. The second die is attached by an external electrical connector to the redistribution structure. The second die is on an opposite side of the redistribution structure from the first die. A second encapsulant is on the redistribution structure and at least laterally encapsulates the second die. The second encapsulant has a surface distal from the redistribution structure. A conductive feature extends from the redistribution structure through the second encapsulant to the surface of the second encapsulant. A conductive pillar is on the conductive feature, and the conductive pillar protrudes from the surface of the second encapsulant.

Abstract: A surgical instrument with pressure sensing and vision feedback functions has an instrument body and a piezochromic device. The instrument body includes a work piece with a visible surface. The piezochromic device is disposed on the visible surface of the work piece of the instrument body and performs color change when the piezochromic device senses pressure. Therefore, when a doctor performs surgery using the surgical instrument, the doctor can directly see the piezochromic device. When the piezochromic device contacts other surgical instruments or presses organs or tissues within a patient's body, the piezochromic device will change color when the piezochromic device senses the pressure enabling the doctor to adjust the surgical instrument accordingly.

Abstract: An adjustable light source device for a stereoscopic surgical microscope has a circuit board and multiple light sources. The circuit board is mounted in an outer casing of the stereoscopic surgical microscope and is electrically connected to a host computer of the stereoscopic surgical microscope. The light sources are electrically mounted on the circuit board at spaced intervals around two objective lenses of the stereoscopic surgical microscope and extend out of the outer casing. Each one of the light sources has a wavelength different from wavelengths of the other light sources and is controlled to emit light by an operating set of the stereoscopic surgical microscope via a program processing interface of the host computer sending signals to the circuit board. The adjustable light source device can emit lights with different wavelengths to enable the stereoscopic surgical microscope to capture clearer images for various surgical divisions.

Abstract: An adjustable dual-lens device for 3D stereoscopic surgical microscopes has an outer casing, an image set, and an adjusting set. The image set is mounted in the outer casing and has two lenses. The lenses are pivotally mounted in the outer casing at a spaced interval. The adjusting set is mounted in the outer casing and has two adjusting units. Each adjusting unit has a driving motor, a cam, and a limiting element. The driving motor is mounted in the outer casing adjacent to one of the lenses and has a driving shaft. The cam is eccentrically mounted around the driving shaft and is pressed against the lens that is adjacent to the driving motor. The limiting element is connected to the outer casing and the corresponding lens to enable the corresponding lens to press against the cam.

Abstract: Methods of forming connectors and packaged semiconductor devices are disclosed. In some embodiments, a connector is formed by forming a first photoresist layer over an interconnect structure, and patterning the first photoresist layer. The patterned first photoresist layer is used to form a first opening in an interconnect structure. The patterned first photoresist is removed, and a second photoresist layer is formed over the interconnect structure and in the first opening. The second photoresist layer is patterned to form a second opening over the interconnect structure in the first opening. The second opening is narrower than the first opening. At least one metal layer is plated through the patterned second photoresist layer to form the connector.

Abstract: A lightweight 3D stereoscopic surgical microscope has a body, a robot set, an image set, and an operating set. The body has a wheel seat, a housing mounted on the wheel seat, and a host computer mounted in the housing. The robot set is connected to the body and has a base mounted on the housing, a transversal lever mounted on the base, a lifting arm connected to the transversal lever, and a rotating arm connected to the lifting arm. The image set is connected to the robot set and has an outer casing connected to the rotating arm, at least one objective lens mounted in the outer casing, a main display screen mounted on the outer casing, an auxiliary display screen mounted beside the body. The operating set is connected to the robot set, is connected to the body and the image set and has two operating bars.

Abstract: A transformation mechanism assembly is adapted to a transformable toy car that includes a head, a main body, a right front door, a left front door, a rear left door, a rear right door and a right tail and a left tail, separable from each other. The two sides of the main body are respectively provided with the transformation mechanism assembly corresponding to the left front door, left rear door, right front door and right rear door, and the main body is adapted to pivotally rotate in relative to the head. The transformation mechanism includes a first driving unit, a driving rod, a linkage mechanism and a support rod. In addition, a transformable toy car, a driving module assembly adapted to drive the transformable toy car and the transformation mechanism assembly, and a robot are also mentioned.

Abstract: A semiconductor package is provided, which includes: a dielectric layer made of a material used for fabricating built-up layer structures; a conductive trace layer formed on the dielectric layer; a semiconductor chip is mounted on and electrically connected to the conductive trace layer; and an encapsulant formed over the dielectric layer to encapsulate the semiconductor chip and the conductive trace layer. Since a strong bonding is formed between the dielectric layer and the conductive trace layer, the present invention can prevent delamination between the dielectric layer and the conductive trace layer from occurrence, thereby improving reliability and facilitating the package miniaturization by current fabrication methods.

Abstract: A semiconductor device includes a semiconductor substrate, a conductive pad on the semiconductor substrate, and a conductor over the conductive pad. The semiconductor device further has a molding compound surrounding the semiconductor substrate, the conductive pad and the conductor. In the semiconductor device, the conductor has a stud shape.

Abstract: Methods of forming connectors and packaged semiconductor devices are disclosed. In some embodiments, a connector is formed by forming a first photoresist layer over an interconnect structure, and patterning the first photoresist layer with a pattern for a first portion of a connector. A first metal layer is plated through the patterned first photoresist layer to form the first portion of the connector which has a first width. A second photoresist layer is formed over the interconnect structure and the first portion of the connector. The second photoresist layer is patterned with a pattern for a second portion of the connector. A second metal layer is plated through the patterned second photoresist layer to form the second portion of the connector over the first portion of the connector. The second portion of the connector has a second width, the second width being less than the first width.

Abstract: Packages structure and methods of forming them are discussed. A structure includes a first die, a first encapsulant at least laterally encapsulating the first die, and a redistribution structure on the first die and the first encapsulant. The second die is attached by an external electrical connector to the redistribution structure. The second die is on an opposite side of the redistribution structure from the first die. A second encapsulant is on the redistribution structure and at least laterally encapsulates the second die. The second encapsulant has a surface distal from the redistribution structure. A conductive feature extends from the redistribution structure through the second encapsulant to the surface of the second encapsulant. A conductive pillar is on the conductive feature, and the conductive pillar protrudes from the surface of the second encapsulant.

Abstract: An internal hot gas bypass device coupled with inlet guide vane for centrifugal compressor includes an inlet guide vane assembly, a driving motor assembly and a gas bypass valve assembly. The inlet guide vane assembly further includes a master vane, a plurality of slave vanes, a vane-front fixing ring, a vane-rear fixing ring, a vane-driving ring, a connecting pipe and a vane-opening indicating disk. The driving motor assembly further includes a motor, a driving unit and a motor fixing base. The gas bypass valve assembly further includes a valve, an external fixing-and-guiding ring, an internal fixing-and-guiding ring, a driven element, a spring, a sealing ring, a valve stud and a valve base. The driving motor assembly is connected with the driving unit and the master vane of the inlet guide vane assembly via a connecting rod, and is further connected with the slave vanes of the gas bypass valve assembly.

Abstract: Methods of forming connectors and packaged semiconductor devices are disclosed. In some embodiments, a connector is formed by forming a first photoresist layer over an interconnect structure, and patterning the first photoresist layer with a pattern for a first portion of a connector. A first metal layer is plated through the patterned first photoresist layer to form the first portion of the connector which has a first width. A second photoresist layer is formed over the interconnect structure and the first portion of the connector. The second photoresist layer is patterned with a pattern for a second portion of the connector. A second metal layer is plated through the patterned second photoresist layer to form the second portion of the connector over the first portion of the connector. The second portion of the connector has a second width, the second width being less than the first width.

Abstract: A stereo display system using shape from shading algorithm is an image conversion device connected between a monoscopic endoscope and a 3D monitor. The system applies the algorithm which generates a depth map for a 2D image of video frames. The algorithm first calculates a direction of a light source for the 2D image and based upon the information of light distribution and shading for the 2D image to generate the depth map. The depth map is used to calculate another view of the original 2D image by depth image based rendering algorithm in generation of stereoscopic images. After the new view is rendered, the stereo display system also needs to convert the display format of the stereoscopic images for different kinds of 3D displays. Base on this method, it is necessary to replace the whole monoscopic endoscope with a stereo-endoscope system and no modification is required for the monoscopic endoscope.

Abstract: Packages structure and methods of forming them are discussed. A structure includes a first die, a first encapsulant at least laterally encapsulating the first die, and a redistribution structure on the first die and the first encapsulant. The second die is attached by an external electrical connector to the redistribution structure. The second die is on an opposite side of the redistribution structure from the first die. A second encapsulant is on the redistribution structure and at least laterally encapsulates the second die. The second encapsulant has a surface distal from the redistribution structure. A conductive feature extends from the redistribution structure through the second encapsulant to the surface of the second encapsulant. A conductive pillar is on the conductive feature, and the conductive pillar protrudes from the surface of the second encapsulant.

Abstract: An inlet guide vane assembly is disclosed, which comprises: a housing, configured with a first penetration part and a plurality of first grooves; at least one fixing ring, each configured with a second penetration part and a plurality of second grooves; at least one rotary ring, each configured with a third penetration part and a plurality of sliding chutes, wherein the first, the second and the third penetration parts are arranged in communication with one another; a plurality of vane units, each vane unit is composed of a vane, a linkage and a sliding block; and at least one driving unit, for driving one vane of the plural vanes to swing, thus driving the rotary ring to rotate simultaneously, bringing along the other vanes to swing, enabling the sliding blocks to slide inside corresponding sliding chutes, and consequently flipping the vane from a first state to a second state.