Patents by Inventor Chen Chao
Chen Chao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240130714Abstract: Disclosed are computer-implemented or computer-aided method for diagnosing or predicting the risk of obstructive sleep apnea in a subject. The methods comprise determining whether the subject has obstructive sleep apnea based on at least one quantitative ultrasound parameter and/or at least one morphometric parameter.Type: ApplicationFiled: May 16, 2023Publication date: April 25, 2024Applicant: AMCAD BIOMED CORPORATIONInventors: Argon CHEN, Yi-li LEE, Pei-Yu CHAO, Wei-Hao CHEN, Wei-Yu HSU
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Publication number: 20240124643Abstract: A method for producing a polyester polyol is provided, which includes: feeding a first antioxidant and a raw material reactant that includes a polyacid and a polyol into a reactor; subjecting the polyacid and the polyol to an esterification reaction to form an oligomer; and performing a prepolymerization reaction on the oligomer to obtain a prepolymerization reactant. During the prepolymerization reaction, the method includes sampling and monitoring an acid value of the prepolymerization reactant. When the acid value of the prepolymerization reactant reaches a first acid value, an esterification reaction catalyst is added to the prepolymerization reactant for carrying out a polycondensation reaction and generating a polycondensation reactant that contains the polyester polyol. During the polycondensation reaction, the method includes sampling and monitoring an acid value of the polycondensation reactant.Type: ApplicationFiled: November 30, 2022Publication date: April 18, 2024Inventors: TE-CHAO LIAO, HAN-CHING HSU, CHEN-WEI CHANG
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Patent number: 11942652Abstract: The disclosure provides a limit device and a robot using the same. The limit device comprises a first connecting member, a transmission rod and a second connecting member. The first connecting member comprising a first main body portion and two first connecting elements. The two first connecting elements are arranged at intervals. The two first connecting elements are respectively connected to the first main body. The transmission rod comprising a first end and a second end. The first end and the second end are arranged at intervals. The first end penetrates through one of the two first connecting elements. The second end penetrates through the other one of the two first connecting element. The second connecting member provided with two indexing buckles. The two indexing buckles are arranged at intervals, each of the indexing buckles comprises a first limiting groove and a second limiting groove.Type: GrantFiled: April 13, 2022Date of Patent: March 26, 2024Assignees: Futaijing Precision Electronics (Yantai) Co., Ltd., HON HAI PRECISION INDUSTRY CO., LTD.Inventors: Chen-Ting Kao, Chi-Cheng Wen, Yu-Sheng Chang, Chih-Cheng Lee, Chiung-Hsiang Wu, Sheng-Li Yen, Yu-Cheng Zhang, Chang-Ju Hsieh, Chen Chao
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Publication number: 20240087879Abstract: A method includes performing a plasma activation on a surface of a first package component, removing oxide regions from surfaces of metal pads of the first package component, and performing a pre-bonding to bond the first package component to a second package component.Type: ApplicationFiled: November 14, 2023Publication date: March 14, 2024Inventors: Xin-Hua Huang, Ping-Yin Liu, Hung-Hua Lin, Hsun-Chung Kuang, Yuan-Chih Hsieh, Lan-Lin Chao, Chia-Shiung Tsai, Xiaomeng Chen
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Patent number: 11930663Abstract: A display panel includes a first substrate, pixel structures, a first common pad, a second substrate, a second common electrode, a display medium and a conductive particle. The pixel structures are disposed on an active area of the first substrate. The first common pad is disposed on a peripheral area of the first substrate, and is electrically connected to first common electrodes of the pixel structures. The second common electrode is disposed on the second substrate. The conductive particle is disposed on the first common pad, and is electrically connected to the first common pad and the second common electrode. The conductive particle includes a core and a conductive film disposed on a surface of the core, where the conductive film has a main portion and raised portions, and a film thickness of each of the raised portions is greater than a film thickness of the main portion.Type: GrantFiled: April 9, 2021Date of Patent: March 12, 2024Assignee: Au Optronics CorporationInventors: Bo-Chen Chen, Yun-Ru Cheng, Ya-Ling Hsu, Chia-Hsuan Pai, Cheng-Wei Huang, Wei-Shan Chao
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Patent number: 11916200Abstract: The disclosure herein relates to rechargeable batteries and solid electrolytes therefore which include lithium-stuffed garnet oxides, for example, in a thin film, pellet, or monolith format wherein the density of defects at a surface or surfaces of the solid electrolyte is less than the density of defects in the bulk. In certain disclosed embodiments, the solid-state anolyte, electrolyte, and catholyte thin films, separators, and monoliths consist essentially of an oxide that conducts Li+ ions. In some examples, the disclosure herein presents new and useful solid electrolytes for solid-state or partially solid-state batteries. In some examples, the disclosure presents new lithium-stuffed garnet solid electrolytes and rechargeable batteries which include these electrolytes as separators between a cathode and a lithium metal anode.Type: GrantFiled: October 19, 2017Date of Patent: February 27, 2024Inventors: David Cao, Cheng-Chieh Chao, Zhebo Chen, Lei Cheng, Niall Donnelly, Wes Hermann, Tim Holme, Tommy Huang, Kian Kerman, Yang Li, Harsh Maheshwari
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Patent number: 11901245Abstract: A semiconductor package structure and a method for manufacturing the same are provided. The method includes: providing a package body includes a first semiconductor device, wherein the first semiconductor device includes a plurality of first electrical contacts disposed adjacent to an active surface of the first semiconductor device; measuring the actual positions of the first electrical contacts of the first semiconductor device; providing a plurality of second electrical contacts outside the first semiconductor device; and forming an interconnection structure based on the actual positions of the first electrical contacts of the first semiconductor device and the positions of the second electrical contacts satisfying a predetermined electrical performance criterion by a mask-less process, so as to connect the first electrical contacts and the second electrical contacts and maintain signal integrity during transmission.Type: GrantFiled: August 22, 2022Date of Patent: February 13, 2024Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Chen-Chao Wang, Chih-Yi Huang, Keng-Tuan Chang
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Patent number: 11865890Abstract: A rocking arm structure includes an arm body, a first wheel assembly connected to the arm body, a second wheel assembly connected to the arm body, and a shaft assembly disposed between the first wheel assembly and the second wheel assembly. The arm body can rotate relative to the main body around the shaft assembly, and drive the first wheel assembly and the second wheel assembly to revolve in a same direction around the shaft assembly. The first wheel assembly and the second wheel assembly are both steering wheel assemblies or both directional wheel assemblies.Type: GrantFiled: December 19, 2022Date of Patent: January 9, 2024Assignees: Futaijing Precision Electronics (Yantai) Co., Ltd., HON HAI PRECISION INDUSTRY CO., LTD.Inventors: Sheng-Li Yen, Chih-Cheng Lee, Chen-Ting Kao, Yu-Cheng Zhang, Chiung-Hsiang Wu, Chang-Ju Hsieh, Chen Chao, Yu-Sheng Chang, Chi-Cheng Wen
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Patent number: 11844199Abstract: An electronic device is disclosed. The electronic device includes a first electronic component, a first power regulator disposed above the first electronic component. The first power regulator is configured to receive a first power along a lateral surface of the first electronic component without passing the first electronic component and to provide a second power to the first electronic component. The electronic device also includes a passive component disposed in an electrical path between the first electronic component and the first power regulator.Type: GrantFiled: January 26, 2022Date of Patent: December 12, 2023Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Li-Chieh Hung, Chen-Chao Wang
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Publication number: 20230393194Abstract: A package structure and a testing method are provided. The package structure includes a wiring structure, a first electronic device and a second electronic device. The wiring structure includes at least one dielectric layer, at least one conductive circuit layer in contact with the dielectric layer, and at least one test circuit structure in contact with the dielectric layer. The test circuit structure is disposed adjacent to the interconnection portion of the conductive circuit layer. The first electronic device is electrically connected to the wiring structure. The second electronic device is electrically connected to the wiring structure. The second electronic device is electrically connected to the first electronic device through the interconnection portion of the conductive circuit layer.Type: ApplicationFiled: August 22, 2023Publication date: December 7, 2023Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Chen-Chao WANG, Tsung-Tang TSAI, Chih-Yi HUANG
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Publication number: 20230373243Abstract: A driving assembly and a transfer device to allow an adjustable length of wheelbase for varying sizes of loads comprises a driving device, a driving wheel connected to the driving device rotatable by the driving device, a cantilever assembly comprising a cantilever configured for mounting to the bearing platform, and a driven wheel rotatably connected to one end of the cantilever. The other end of the cantilever is detachably connected to a fixed part of the driving device. The transfer device comprises a bearing platform and two driving assemblies.Type: ApplicationFiled: August 10, 2022Publication date: November 23, 2023Inventors: SHENG-LI YEN, YU-SHENG CHANG, CHI-CHENG WEN, CHIUNG-HSIANG WU, CHIH-CHENG LEE, YU-CHENG ZHANG, CHEN-TING KAO, CHANG-JU HSIEH, CHEN CHAO
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Publication number: 20230373106Abstract: This document describes systems and techniques for simulating the touch of a human finger in manipulating an interface device, such as a touchscreen included in a mobile phone or other computing device. The systems and techniques include an artificial finger configured to be received and manipulated by a robotic actuator to simulate surface engagement, mechanical force, and electrical conductivity of a human finger engaging the touchscreen at varied touch angles and/or mechanical pressures. The systems and techniques thereby provide for rigorous and repeatable testing of an electrical and mechanical response of the touchscreen to simulated user inputs without involving a human test operator.Type: ApplicationFiled: July 31, 2023Publication date: November 23, 2023Applicant: Google LLCInventors: Chihhao Lee, Hsu Chung, Yenming Liu, Lin Chi Lin, Hung-Ren Yu, Chen Chao Huang
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Publication number: 20230331526Abstract: A locking mechanism comprises a main body, an ejector rod, a guide rod assembly, a carrier plate and a fixing assembly. The carrier plate comprises a center hole and a plurality of annular strip holes. The fixing assembly comprises a rotary disc. The center hole and the annular strip holes can lock the rotary disc in different rotation angles. The guide rod assembly limits the rotation tolerance of the carrier plate, and makes the carrier plate move up and down in the vertical direction. The rotary disc with limited rotational freedom is fixedly connected with the ejector rod, so that the locking mechanism can not only realize the linear lifting motion of the ejector rod, but also reduce the rotation angle error between the carrier plate and the ejector rod. A rotating lifting platform is also provided.Type: ApplicationFiled: February 24, 2023Publication date: October 19, 2023Inventors: CHI-CHENG WEN, YU-SHENG CHANG, CHIH-CHENG LEE, CHIUNG-HSIANG WU, CHANG-JU HSIEH, YU-CHENG ZHANG, SHENG-LI YEN, CHEN CHAO, CHEN-TING KAO
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Publication number: 20230268293Abstract: An electronic device is disclosed. The electronic device includes a first electronic component and a power regulating structure configured to provide a first power to the first electronic component. The power regulating structure includes a first component and a second component at least partially overlapped with the first component from a top view.Type: ApplicationFiled: February 18, 2022Publication date: August 24, 2023Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Pao-Nan LEE, Chen-Chao WANG, Chang Chi LEE
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Patent number: 11733294Abstract: A package structure and a testing method are provided. The package structure includes a wiring structure, a first electronic device and a second electronic device. The wiring structure includes at least one dielectric layer, at least one conductive circuit layer in contact with the dielectric layer, and at least one test circuit structure in contact with the dielectric layer. The test circuit structure is disposed adjacent to the interconnection portion of the conductive circuit layer. The first electronic device is electrically connected to the wiring structure. The second electronic device is electrically connected to the wiring structure. The second electronic device is electrically connected to the first electronic device through the interconnection portion of the conductive circuit layer.Type: GrantFiled: March 6, 2020Date of Patent: August 22, 2023Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Chen-Chao Wang, Tsung-Tang Tsai, Chih-Yi Huang
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Publication number: 20230257482Abstract: Preparation method of modified starch-lipid binary complexes is provided. The preparation method includes: subjecting native starch to chemical modification utilizing octenyl succinic anhydride; and preparing a starch suspension with a concentration of 7-20% by taking starch octenyl succinate and lipid as raw materials at a mass ratio of (10-200):1. The modified starch-lipid binary complexes can be efficiently prepared through an aqueous phase system. According to the preparation method, not only the complexing of starch with fatty acid or monoglyceride but also the complexing of starch with diglyceride can be effectively promoted during food processing. Compared with the traditional technologies, the starch-lipid complexes prepared based on the present disclosure are more efficient, better structured, and more potentially useful for enhancing food quality to improve human nutritional health.Type: ApplicationFiled: April 20, 2023Publication date: August 17, 2023Inventors: Shujun Wang, Jinwei Wang, Fei Ren, Chen Chao, Jinglin Yu
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Publication number: 20230253302Abstract: An electronic package is disclosed. The electronic package includes an electronic component and a plurality of power regulating components. The plurality of power regulating components includes a first power regulating component and a second power regulating component. A first power path is established from the first power regulating component to a backside surface of the electronic component. A second power path is established from the second power regulating component to the backside surface of the electronic component.Type: ApplicationFiled: February 10, 2022Publication date: August 10, 2023Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Pao-Nan LEE, Chen-Chao WANG, Chang Chi LEE
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Publication number: 20230240057Abstract: An electronic device is disclosed. The electronic device includes a first electronic component, a first power regulator disposed above the first electronic component. The first power regulator is configured to receive a first power along a lateral surface of the first electronic component without passing the first electronic component and to provide a second power to the first electronic component. The electronic device also includes a passive component disposed in an electrical path between the first electronic component and the first power regulator.Type: ApplicationFiled: January 26, 2022Publication date: July 27, 2023Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Li-Chieh HUNG, Chen-Chao WANG
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Patent number: 11705725Abstract: An integrated circuit includes a signal pad, receiving an input signal during a normal mode, and receive an ESD signal during an ESD mode; an internal circuit, processing the input signal during the normal mode; a variable impedance circuit, comprising a first end coupled to the signal pad, a second end coupled to the internal circuit, wherein the variable impedance circuit provides a low or high impedance path between the signal pad and the internal circuit during the normal or ESD mode; and a switch circuit, comprising a first end coupled to a control end of the variable impedance circuit, a second end coupled to a reference voltage terminal, and a control end receiving a node voltage, wherein the switch circuit switches the control end of the variable impedance circuit to have a first specific voltage or be electrically floating during the normal or ESD mode.Type: GrantFiled: October 29, 2020Date of Patent: July 18, 2023Assignee: RichWave Technology Corp.Inventors: Chuan-Chen Chao, Ching-Yao Pai
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Publication number: 20230215810Abstract: A semiconductor package structure is provided. The semiconductor package structure includes an electronic component, and an inductance component. The protection layer encapsulates the electronic component and has a top surface and a bottom surface. The top surface and the bottom surface collectively define a space to accommodate the electronic component. The inductance component outflanks the space from the top surface and the bottom surface of the protection layer.Type: ApplicationFiled: December 30, 2021Publication date: July 6, 2023Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Pao-Nan LEE, Chen-Chao WANG, Chang Chi LEE