Abstract: The disclosure herein relates to rechargeable batteries and solid electrolytes therefore which include lithium-stuffed garnet oxides, for example, in a thin film, pellet, or monolith format wherein the density of defects at a surface or surfaces of the solid electrolyte is less than the density of defects in the bulk. In certain disclosed embodiments, the solid-state anolyte, electrolyte, and catholyte thin films, separators, and monoliths consist essentially of an oxide that conducts Li+ ions. In some examples, the disclosure herein presents new and useful solid electrolytes for solid-state or partially solid-state batteries. In some examples, the disclosure presents new lithium-stuffed garnet solid electrolytes and rechargeable batteries which include these electrolytes as separators between a cathode and a lithium metal anode.

Abstract: An injectable pharmaceutical composition for treating a bacterial infection in an animal comprising an effective amount of a compound of Formula (I) or salt thereof, and a pharmaceutically acceptable carrier, wherein the injectable pharmaceutical composition is both efficacious and safe.

Abstract: A drink pouch includes an outer bag and an inner bag. The inner bag is floatingly disposed in the outer bag. The inner bag contains at least one brewable substance. A porous structure is formed on a surface of the inner bag. Water is able to be filled in the outer bag and brew the at least one brewable substance in the inner bag through the porous structure to form a beverage.

Abstract: A method for generating stereoscopic light-field data is provided. The method includes the following steps: obtaining three-dimensional image data; performing a multi-view generation process to convert the three-dimensional image data into multi-view data; and performing a light-field conversion process to convert the multi-view data into a stereoscopic light-field pair.

Abstract: A semiconductor package structure is provided. The semiconductor package structure includes an electronic component, and an inductance component. The protection layer encapsulates the electronic component and has a top surface and a bottom surface. The top surface and the bottom surface collectively define a space to accommodate the electronic component. The inductance component outflanks the space from the top surface and the bottom surface of the protection layer.

Abstract: A display device is provided, and includes a substrate and a first light shielding layer disposed on the substrate and defining a plurality of first openings. The display device includes a first light filter layer disposed in one of the first openings and a plurality of light-emitting diodes disposed on the substrate. The display device includes a second light shielding layer disposed between the substrate and the first light shielding layer, and having a plurality of second openings. The at least part of the light-emitting diodes are disposed in the second openings respectively. The display device also includes a spacer element disposed between the first light shielding layer and the second light shielding layer, wherein from a cross-section view, a shape of the spacer element is arc-shaped, and a shape of the second light shielding layer is arc-shaped.

Abstract: A package structure and a testing method are provided. The package structure includes a wiring structure, a first electronic device and a second electronic device. The wiring structure includes at least one dielectric layer, at least one conductive circuit layer in contact with the dielectric layer, and at least one test circuit structure in contact with the dielectric layer. The test circuit structure is disposed adjacent to the interconnection portion of the conductive circuit layer. The first electronic device is electrically connected to the wiring structure. The second electronic device is electrically connected to the wiring structure. The second electronic device is electrically connected to the first electronic device through the interconnection portion of the conductive circuit layer.

Abstract: A structure for holding a battery on an automated guided vehicle (AGV) so as to allow easy and convenient battery replacement includes two fixed supports and a bracket. The bracket is connected between the two supports and each support defines a vertical groove and two horizontal grooves. Two sliders at the ends of the bracket are insertable into either horizontal groove. The two sliders can move down along the vertical groove together until the bracket makes contact with the battery and holds it in place. The two sliders can move up along the vertical groove and sideways into the horizontal grooves, thereby unlatching and releasing the battery for rapid replacement. An AGV using the structure is also disclosed.

Abstract: This document describes systems and techniques for simulating the touch of a human finger in manipulating an interface device, such as a touchscreen included in a mobile phone or other computing device. The systems and techniques include an artificial finger configured to be received and manipulated by a robotic actuator to simulate surface engagement, mechanical force, and electrical conductivity of a human finger engaging the touchscreen at varied touch angles and/or mechanical pressures. The systems and techniques thereby provide for rigorous and repeatable testing of an electrical and mechanical response of the touchscreen to simulated user inputs without involving a human test operator.

Abstract: An electronic device is disclosed. The electronic device includes a first electronic component and a power regulating structure configured to provide a first power to the first electronic component. The power regulating structure includes a first component and a second component at least partially overlapped with the first component from a top view.

Abstract: A robot includes a limit device and an energy storehouse, the limiting device may lock or loosen a battery opened in the energy storehouse, the limiting device includes a first connecting member, a transmission rod, and a second connecting member. The first connecting member includes a first main body portion and two first connecting elements arranged at intervals. The two first connecting elements are respectively connected to the first main body. The transmission rod includes a first end and a second end arranged at intervals. The first end penetrates through one of the two first connecting elements. The second end penetrates through the other one of the two first connecting element. The second connecting member includes two indexing buckles arranged at intervals, each of the indexing buckles includes a first limiting groove and a second limiting groove.

Abstract: A semiconductor package structure is provided. The semiconductor package structure includes an electronic component, and an inductance component. The protection layer encapsulates the electronic component and has a top surface and a bottom surface. The top surface and the bottom surface collectively define a space to accommodate the electronic component. The inductance component outflanks the space from the top surface and the bottom surface of the protection layer.

Abstract: A measurement device and a method of measuring a radiation pattern by using the same are provided. The measurement device includes at least one positioner configured to move a first antenna for measuring a main lobe and a back lobe of an electromagnetic wave radiated from the first antenna.

Abstract: A robot includes a limit device and an energy storehouse, the limiting device may lock or loosen a battery opened in the energy storehouse, the limiting device includes a first connecting member, a transmission rod, and a second connecting member. The first connecting member includes a first main body portion and two first connecting elements arranged at intervals. The two first connecting elements are respectively connected to the first main body. The transmission rod includes a first end and a second end arranged at intervals. The first end penetrates through one of the two first connecting elements. The second end penetrates through the other one of the two first connecting element. The second connecting member includes two indexing buckles arranged at intervals, each of the indexing buckles includes a first limiting groove and a second limiting groove.

Abstract: A semiconductor package structure and a method for manufacturing the same are provided. The method includes: providing a package body includes a first semiconductor device, wherein the first semiconductor device includes a plurality of first electrical contacts disposed adjacent to an active surface of the first semiconductor device; measuring the actual positions of the first electrical contacts of the first semiconductor device; providing a plurality of second electrical contacts outside the first semiconductor device; and forming an interconnection structure based on the actual positions of the first electrical contacts of the first semiconductor device and the positions of the second electrical contacts satisfying a predetermined electrical performance criterion by a mask-less process, so as to connect the first electrical contacts and the second electrical contacts and maintain signal integrity during transmission.

Abstract: The disclosure provides a limit device and a robot using the same. The limit device comprises a first connecting member, a transmission rod and a second connecting member. The first connecting member comprising a first main body portion and two first connecting elements. The two first connecting elements are arranged at intervals. The two first connecting elements are respectively connected to the first main body. The transmission rod comprising a first end and a second end. The first end and the second end are arranged at intervals. The first end penetrates through one of the two first connecting elements. The second end penetrates through the other one of the two first connecting element. The second connecting member provided with two indexing buckles. The two indexing buckles are arranged at intervals, each of the indexing buckles comprises a first limiting groove and a second limiting groove.

Abstract: A semiconductor package structure and a method for manufacturing the same are provided. The method includes: providing a package body includes a first semiconductor device, wherein the first semiconductor device includes a plurality of first electrical contacts disposed adjacent to an active surface of the first semiconductor device; measuring the actual positions of the first electrical contacts of the first semiconductor device; providing a plurality of second electrical contacts outside the first semiconductor device; and forming an interconnection structure based on the actual positions of the first electrical contacts of the first semiconductor device and the positions of the second electrical contacts satisfying a predetermined electrical performance criterion by a mask-less process, so as to connect the first electrical contacts and the second electrical contacts and maintain signal integrity during transmission.

Abstract: A rocking arm structure includes an arm body, a first wheel assembly connected to the arm body, a second wheel assembly connected to the arm body, and a shaft assembly disposed between the first wheel assembly and the second wheel assembly. The arm body can rotate relative to the main body around the shaft assembly, and drive the first wheel assembly and the second wheel assembly to revolve in a same direction around the shaft assembly. The first wheel assembly and the second wheel assembly are both steering wheel assemblies or both directional wheel assemblies.

Abstract: An electronic device is disclosed. The electronic device includes a first electronic component, a first power regulator disposed above the first electronic component. The first power regulator is configured to receive a first power along a lateral surface of the first electronic component without passing the first electronic component and to provide a second power to the first electronic component. The electronic device also includes a passive component disposed in an electrical path between the first electronic component and the first power regulator.

Abstract: A package structure and a testing method are provided. The package structure includes a wiring structure, a first electronic device and a second electronic device. The wiring structure includes at least one dielectric layer, at least one conductive circuit layer in contact with the dielectric layer, and at least one test circuit structure in contact with the dielectric layer. The test circuit structure is disposed adjacent to the interconnection portion of the conductive circuit layer. The first electronic device is electrically connected to the wiring structure. The second electronic device is electrically connected to the wiring structure. The second electronic device is electrically connected to the first electronic device through the interconnection portion of the conductive circuit layer.