Abstract: Provided herein are detect-free solid-state separators which are useful as Li| ion-conducting electrolytes in electro-chemical cells and devices, such as, but not limited to, rechargeable batteries. In some examples, the separators have a Li+ ion-conductivity greater than 1*10?3 S/cm at room temperature.

Abstract: A semiconductor package structure is provided. The semiconductor package structure includes an electronic component, and an inductance component. The protection layer encapsulates the electronic component and has a top surface and a bottom surface. The top surface and the bottom surface collectively define a space to accommodate the electronic component. The inductance component outflanks the space from the top surface and the bottom surface of the protection layer.

Abstract: A data processing method, an apparatus, a device, and a medium in a blockchain fund settlement system are provided. A data processing method in a blockchain fund settlement system, performed by at least one processor of a settlement institution terminal, includes: querying, on a blockchain, a settlement request that is to be processed by the settlement institution terminal between a fund settlement initiator and a fund settlement recipient, the settlement request being generated by an initiator terminal of the fund settlement initiator and recorded on the blockchain; receiving the settlement request based on the querying; and generating a settlement result of a settlement performed according to the settlement request, and recording the settlement result on the blockchain.

Abstract: The present invention provides a novel pan-RAF kinase inhibitor, comprising a compound of formula (I) or a pharmaceutically acceptable salt, solvate, ester, acid, metabolite or prodrug thereof. The present invention also provides a use or method of the compound of formula (I) in the treatment or prevention of a disorder related to the activity of RAF and/or RAS kinase.

Abstract: The laser device includes a substrate, a laser element disposed on the substrate for emitting a laser light ray, a light guide member disposed on the substrate, and a wavelength conversion layer. The light guide member is light-transmissible and thermally conductive, and has at least one reflection surface for reflecting the laser light ray from the laser element so as to change travelling direction of the laser light ray. The wavelength conversion layer converts wavelength of the laser light ray from the light guide member to result in a laser beam, and contacts the light guide member so that heat from the wavelength conversion layer is transferred to the substrate through the light guide member.

Abstract: A light-emitting device includes: a substrate having a top surface, wherein the top surface comprises a first portion and a second portion; a first semiconductor stack on the first portion, comprising a first upper surface and a first side wall; and a second semiconductor stack on the first upper surface, comprising a second upper surface and a second side wall, and wherein the second side wall connects the first upper surface; wherein the first semiconductor stack comprises a dislocation stop layer; wherein the dislocation stop layer comprises AlGaN; and wherein the first side wall and the second portion of the top surface form an acute angle ? between thereof.

Abstract: A communication configuration apparatus for constructing a communication topology structure based on a plurality of processing nodes may be included in a combined processing apparatus. The combined processing apparatus further includes an interconnection interface and other processing apparatus. The communication configuration apparatus interacts with other processing apparatus to jointly complete a computing operation specified by a user. The combined processing apparatus further includes a storage apparatus. The storage apparatus is connected to the communication configuration apparatus and other processing apparatuses, respectively. The storage apparatus is used for storing data of the communication configuration apparatus and other processing apparatus. A technical solution of the present disclosure may improve efficiency of inter-chip communication.

Abstract: A measurement device and a method of measuring a radiation pattern by using the same are provided. The measurement device includes at least one positioner configured to move a first antenna for measuring a main lobe and a back lobe of an electromagnetic wave radiated from the first antenna.

Abstract: A robot includes a limit device and an energy storehouse, the limiting device may lock or loosen a battery opened in the energy storehouse, the limiting device includes a first connecting member, a transmission rod, and a second connecting member. The first connecting member includes a first main body portion and two first connecting elements arranged at intervals. The two first connecting elements are respectively connected to the first main body. The transmission rod includes a first end and a second end arranged at intervals. The first end penetrates through one of the two first connecting elements. The second end penetrates through the other one of the two first connecting element. The second connecting member includes two indexing buckles arranged at intervals, each of the indexing buckles includes a first limiting groove and a second limiting groove.

Abstract: A semiconductor package structure and a method for manufacturing the same are provided. The method includes: providing a package body includes a first semiconductor device, wherein the first semiconductor device includes a plurality of first electrical contacts disposed adjacent to an active surface of the first semiconductor device; measuring the actual positions of the first electrical contacts of the first semiconductor device; providing a plurality of second electrical contacts outside the first semiconductor device; and forming an interconnection structure based on the actual positions of the first electrical contacts of the first semiconductor device and the positions of the second electrical contacts satisfying a predetermined electrical performance criterion by a mask-less process, so as to connect the first electrical contacts and the second electrical contacts and maintain signal integrity during transmission.

Abstract: The disclosure provides a limit device and a robot using the same. The limit device comprises a first connecting member, a transmission rod and a second connecting member. The first connecting member comprising a first main body portion and two first connecting elements. The two first connecting elements are arranged at intervals. The two first connecting elements are respectively connected to the first main body. The transmission rod comprising a first end and a second end. The first end and the second end are arranged at intervals. The first end penetrates through one of the two first connecting elements. The second end penetrates through the other one of the two first connecting element. The second connecting member provided with two indexing buckles. The two indexing buckles are arranged at intervals, each of the indexing buckles comprises a first limiting groove and a second limiting groove.

Abstract: A semiconductor package structure and a method for manufacturing the same are provided. The method includes: providing a package body includes a first semiconductor device, wherein the first semiconductor device includes a plurality of first electrical contacts disposed adjacent to an active surface of the first semiconductor device; measuring the actual positions of the first electrical contacts of the first semiconductor device; providing a plurality of second electrical contacts outside the first semiconductor device; and forming an interconnection structure based on the actual positions of the first electrical contacts of the first semiconductor device and the positions of the second electrical contacts satisfying a predetermined electrical performance criterion by a mask-less process, so as to connect the first electrical contacts and the second electrical contacts and maintain signal integrity during transmission.

Abstract: A rocking arm structure includes an arm body, a first wheel assembly connected to the arm body, a second wheel assembly connected to the arm body, and a shaft assembly disposed between the first wheel assembly and the second wheel assembly. The arm body can rotate relative to the main body around the shaft assembly, and drive the first wheel assembly and the second wheel assembly to revolve in a same direction around the shaft assembly. The first wheel assembly and the second wheel assembly are both steering wheel assemblies or both directional wheel assemblies.

Abstract: An electronic device is disclosed. The electronic device includes a first electronic component, a first power regulator disposed above the first electronic component. The first power regulator is configured to receive a first power along a lateral surface of the first electronic component without passing the first electronic component and to provide a second power to the first electronic component. The electronic device also includes a passive component disposed in an electrical path between the first electronic component and the first power regulator.

Abstract: A package structure and a testing method are provided. The package structure includes a wiring structure, a first electronic device and a second electronic device. The wiring structure includes at least one dielectric layer, at least one conductive circuit layer in contact with the dielectric layer, and at least one test circuit structure in contact with the dielectric layer. The test circuit structure is disposed adjacent to the interconnection portion of the conductive circuit layer. The first electronic device is electrically connected to the wiring structure. The second electronic device is electrically connected to the wiring structure. The second electronic device is electrically connected to the first electronic device through the interconnection portion of the conductive circuit layer.

Abstract: This document describes systems and techniques for simulating the touch of a human finger in manipulating an interface device, such as a touchscreen included in a mobile phone or other computing device. The systems and techniques include an artificial finger configured to be received and manipulated by a robotic actuator to simulate surface engagement, mechanical force, and electrical conductivity of a human finger engaging the touchscreen at varied touch angles and/or mechanical pressures. The systems and techniques thereby provide for rigorous and repeatable testing of an electrical and mechanical response of the touchscreen to simulated user inputs without involving a human test operator.

Abstract: A driving assembly and a transfer device to allow an adjustable length of wheelbase for varying sizes of loads comprises a driving device, a driving wheel connected to the driving device rotatable by the driving device, a cantilever assembly comprising a cantilever configured for mounting to the bearing platform, and a driven wheel rotatably connected to one end of the cantilever. The other end of the cantilever is detachably connected to a fixed part of the driving device. The transfer device comprises a bearing platform and two driving assemblies.

Abstract: A locking mechanism comprises a main body, an ejector rod, a guide rod assembly, a carrier plate and a fixing assembly. The carrier plate comprises a center hole and a plurality of annular strip holes. The fixing assembly comprises a rotary disc. The center hole and the annular strip holes can lock the rotary disc in different rotation angles. The guide rod assembly limits the rotation tolerance of the carrier plate, and makes the carrier plate move up and down in the vertical direction. The rotary disc with limited rotational freedom is fixedly connected with the ejector rod, so that the locking mechanism can not only realize the linear lifting motion of the ejector rod, but also reduce the rotation angle error between the carrier plate and the ejector rod. A rotating lifting platform is also provided.

Abstract: An electronic device is disclosed. The electronic device includes a first electronic component and a power regulating structure configured to provide a first power to the first electronic component. The power regulating structure includes a first component and a second component at least partially overlapped with the first component from a top view.

Abstract: A package structure and a testing method are provided. The package structure includes a wiring structure, a first electronic device and a second electronic device. The wiring structure includes at least one dielectric layer, at least one conductive circuit layer in contact with the dielectric layer, and at least one test circuit structure in contact with the dielectric layer. The test circuit structure is disposed adjacent to the interconnection portion of the conductive circuit layer. The first electronic device is electrically connected to the wiring structure. The second electronic device is electrically connected to the wiring structure. The second electronic device is electrically connected to the first electronic device through the interconnection portion of the conductive circuit layer.