Patents by Inventor Chen Chao
Chen Chao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250149655Abstract: The disclosure herein relates to rechargeable batteries and solid electrolytes therefore which include lithium-stuffed garnet oxides, for example, in a thin film, pellet, or monolith format wherein the density of defects at a surface or surfaces of the solid electrolyte is less than the density of defects in the bulk. In certain disclosed embodiments, the solid-state anolyte, electrolyte, and catholyte thin films, separators, and monoliths consist essentially of an oxide that conducts Li+ ions. In some examples, the disclosure herein presents new and useful solid electrolytes for solid-state or partially solid-state batteries. In some examples, the disclosure presents new lithium-stuffed garnet solid electrolytes and rechargeable batteries which include these electrolytes as separators between a cathode and a lithium metal anode.Type: ApplicationFiled: January 8, 2025Publication date: May 8, 2025Inventors: David CAO, Cheng-Chieh CHAO, Zhebo CHEN, Lei CHENG, Niall DONNELLY, Wes HERMANN, Timothy HOLME, Tommy HUANG, Kian KERMAN, Yang LI, Harsh MAHESHWARI
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Publication number: 20250142881Abstract: A semiconductor structure includes: a first fin portion and a second fin portion; a first device and a second device which are respectively disposed on front surfaces of the first and second fin portions, each of the first and second devices including a source/drain portion; an isolation portion disposed to separate the first fin portion from the second fin portion and to separate the first device from the second device; and a hard mask portion disposed beneath a back surface of the isolation portion, and including a main region and two sidewall regions that are respectively located at two opposite sides of the main region so as to separate the main region from the first and second fin portions. The sidewall regions are made of a material different from that of the isolation portion. The main region is made of a material different from the material of the sidewall regions.Type: ApplicationFiled: October 31, 2023Publication date: May 1, 2025Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Yu-Ho CHIANG, Wei-Chen CHANG, Jiun-Jie CHAO, Jyh-Huei CHEN, Jye-Yen CHENG
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Publication number: 20250125411Abstract: Provided herein are defect-free solid-state separators which are useful as Li+ ion-conducting electrolytes in electrochemical cells and devices, such as, but not limited to, rechargeable batteries. In some examples, the separators have a Li+ ion-conductivity greater than 1*10?3 S/cm at room temperature.Type: ApplicationFiled: October 3, 2024Publication date: April 17, 2025Inventors: Cheng-Chieh CHAO, Zhebo CHEN, Lei CHENG, Niall DONNELLY, Timothy HOLME, Tommy HUANG, Sriram IYER, Kian KERMAN, Harsh MAHESHWARI, Jagdeep SINGH, Gengfu XU
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Publication number: 20250096189Abstract: An integrated circuit (IC) solder ball mounting apparatus comprises a ball storage unit for storing solder balls, a ball buffer unit configured to receive the solder balls from the ball storage unit in response to one or more pressure-actuated actions, and a gate valve configured to allow the solder balls to transfer to a ball mounting brush configured to place the solder balls onto area array contact structures formed on a wafer containing the integrated circuit.Type: ApplicationFiled: October 31, 2023Publication date: March 20, 2025Inventors: Chen Chao, Bo Jiang, Wei Li, Jie Chen, Ruijie Huang, Liang Zheng, Qi Ming Bao, Bin Liu
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Patent number: 12255062Abstract: A method includes performing a plasma activation on a surface of a first package component, removing oxide regions from surfaces of metal pads of the first package component, and performing a pre-bonding to bond the first package component to a second package component.Type: GrantFiled: November 14, 2023Date of Patent: March 18, 2025Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Xin-Hua Huang, Ping-Yin Liu, Hung-Hua Lin, Hsun-Chung Kuang, Yuan-Chih Hsieh, Lan-Lin Chao, Chia-Shiung Tsai, Xiaomeng Chen
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Patent number: 12237475Abstract: The disclosure herein relates to rechargeable batteries and solid electrolytes therefore which include lithium-stuffed garnet oxides, for example, in a thin film, pellet, or monolith format wherein the density of defects at a surface or surfaces of the solid electrolyte is less than the density of defects in the bulk. In certain disclosed embodiments, the solid-state anolyte, electrolyte, and catholyte thin films, separators, and monoliths consist essentially of an oxide that conducts Li+ ions. In some examples, the disclosure herein presents new and useful solid electrolytes for solid-state or partially solid-state batteries. In some examples, the disclosure presents new lithium-stuffed garnet solid electrolytes and rechargeable batteries which include these electrolytes as separators between a cathode and a lithium metal anode.Type: GrantFiled: July 7, 2023Date of Patent: February 25, 2025Assignee: QuantumScape Battery, Inc.Inventors: David Cao, Cheng-Chieh Chao, Zhebo Chen, Lei Cheng, Niall Donnelly, Wes Hermann, Timothy Holme, Tommy Huang, Kian Kerman, Yang Li, Harsh Maheshwari
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Publication number: 20250057790Abstract: An injectable pharmaceutical composition for treating a bacterial infection in an animal comprising an effective amount of a compound of Formula (I) or salt thereof, and a pharmaceutically acceptable carrier, wherein the injectable pharmaceutical composition is both efficacious and safe.Type: ApplicationFiled: December 23, 2022Publication date: February 20, 2025Applicant: Intervet Inc.Inventors: Chen-Chao Wang, Thorsten Meyer, Ralf Warrass, Joachim Ullrich
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Publication number: 20250058962Abstract: A drink pouch includes an outer bag and an inner bag. The inner bag is floatingly disposed in the outer bag. The inner bag contains at least one brewable substance. A porous structure is formed on a surface of the inner bag. Water is able to be filled in the outer bag and brew the at least one brewable substance in the inner bag through the porous structure to form a beverage.Type: ApplicationFiled: September 26, 2023Publication date: February 20, 2025Applicant: LEAD TREND GLOBAL CO., LTD.Inventors: Yan-An Chen, Hsien-Ta Chao
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Patent number: 12228744Abstract: A method for generating stereoscopic light-field data is provided. The method includes the following steps: obtaining three-dimensional image data; performing a multi-view generation process to convert the three-dimensional image data into multi-view data; and performing a light-field conversion process to convert the multi-view data into a stereoscopic light-field pair.Type: GrantFiled: November 29, 2022Date of Patent: February 18, 2025Assignee: PETARAY INC.Inventors: Chun-Hao Chao, Homer Chen
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Publication number: 20250054877Abstract: A semiconductor package structure is provided. The semiconductor package structure includes an electronic component, and an inductance component. The protection layer encapsulates the electronic component and has a top surface and a bottom surface. The top surface and the bottom surface collectively define a space to accommodate the electronic component. The inductance component outflanks the space from the top surface and the bottom surface of the protection layer.Type: ApplicationFiled: October 29, 2024Publication date: February 13, 2025Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Pao-Nan LEE, Chen-Chao WANG, Chang Chi LEE
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Publication number: 20250044643Abstract: A display device is provided, and includes a substrate and a first light shielding layer disposed on the substrate and defining a plurality of first openings. The display device includes a first light filter layer disposed in one of the first openings and a plurality of light-emitting diodes disposed on the substrate. The display device includes a second light shielding layer disposed between the substrate and the first light shielding layer, and having a plurality of second openings. The at least part of the light-emitting diodes are disposed in the second openings respectively. The display device also includes a spacer element disposed between the first light shielding layer and the second light shielding layer, wherein from a cross-section view, a shape of the spacer element is arc-shaped, and a shape of the second light shielding layer is arc-shaped.Type: ApplicationFiled: October 21, 2024Publication date: February 6, 2025Inventors: Yi-An CHEN, Kuan-Hung KUO, Tsau-Hua HSIEH, Ming-I CHAO, Shu-Ming KUO, Chin-Lung TING, Chih-Yung HSIEH
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Patent number: 12216157Abstract: A package structure and a testing method are provided. The package structure includes a wiring structure, a first electronic device and a second electronic device. The wiring structure includes at least one dielectric layer, at least one conductive circuit layer in contact with the dielectric layer, and at least one test circuit structure in contact with the dielectric layer. The test circuit structure is disposed adjacent to the interconnection portion of the conductive circuit layer. The first electronic device is electrically connected to the wiring structure. The second electronic device is electrically connected to the wiring structure. The second electronic device is electrically connected to the first electronic device through the interconnection portion of the conductive circuit layer.Type: GrantFiled: August 22, 2023Date of Patent: February 4, 2025Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Chen-Chao Wang, Tsung-Tang Tsai, Chih-Yi Huang
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Patent number: 12179626Abstract: A structure for holding a battery on an automated guided vehicle (AGV) so as to allow easy and convenient battery replacement includes two fixed supports and a bracket. The bracket is connected between the two supports and each support defines a vertical groove and two horizontal grooves. Two sliders at the ends of the bracket are insertable into either horizontal groove. The two sliders can move down along the vertical groove together until the bracket makes contact with the battery and holds it in place. The two sliders can move up along the vertical groove and sideways into the horizontal grooves, thereby unlatching and releasing the battery for rapid replacement. An AGV using the structure is also disclosed.Type: GrantFiled: September 21, 2022Date of Patent: December 31, 2024Assignees: Futaijing Precision Electronics (Yantai) Co., Ltd., HON HAI PRECISION INDUSTRY CO., LTD.Inventors: Hun-Yi Chou, Chih-Cheng Lee, Yu-Sheng Chang, Yu-Cheng Zhang, Hsiu-Fu Li, Chang-Ju Hsieh, Tsung-Hsin Wu, Chiung-Hsiang Wu, Chen Chao, Chen-Ting Kao, Chi-Cheng Wen, Sheng-Li Yen
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Patent number: 12179341Abstract: This document describes systems and techniques for simulating the touch of a human finger in manipulating an interface device, such as a touchscreen included in a mobile phone or other computing device. The systems and techniques include an artificial finger configured to be received and manipulated by a robotic actuator to simulate surface engagement, mechanical force, and electrical conductivity of a human finger engaging the touchscreen at varied touch angles and/or mechanical pressures. The systems and techniques thereby provide for rigorous and repeatable testing of an electrical and mechanical response of the touchscreen to simulated user inputs without involving a human test operator.Type: GrantFiled: July 31, 2023Date of Patent: December 31, 2024Assignee: Google LLCInventors: Chihhao Lee, Hsu Chung, Yenming Liu, Lin Chi Lin, Hung-Ren Yu, Chen Chao Huang
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Patent number: 12176305Abstract: An electronic device is disclosed. The electronic device includes a first electronic component and a power regulating structure configured to provide a first power to the first electronic component. The power regulating structure includes a first component and a second component at least partially overlapped with the first component from a top view.Type: GrantFiled: February 18, 2022Date of Patent: December 24, 2024Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Pao-Nan Lee, Chen-Chao Wang, Chang Chi Lee
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Patent number: 12160013Abstract: A robot includes a limit device and an energy storehouse, the limiting device may lock or loosen a battery opened in the energy storehouse, the limiting device includes a first connecting member, a transmission rod, and a second connecting member. The first connecting member includes a first main body portion and two first connecting elements arranged at intervals. The two first connecting elements are respectively connected to the first main body. The transmission rod includes a first end and a second end arranged at intervals. The first end penetrates through one of the two first connecting elements. The second end penetrates through the other one of the two first connecting element. The second connecting member includes two indexing buckles arranged at intervals, each of the indexing buckles includes a first limiting groove and a second limiting groove.Type: GrantFiled: February 21, 2024Date of Patent: December 3, 2024Assignees: Futaijing Precision Electronics (Yantai) Co., Ltd., HON HAI PRECISION INDUSTRY CO., LTD.Inventors: Chen-Ting Kao, Chi-Cheng Wen, Yu-Sheng Chang, Chih-Cheng Lee, Chiung-Hsiang Wu, Sheng-Li Yen, Yu-Cheng Zhang, Chang-Ju Hsieh, Chen Chao
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Patent number: 12132006Abstract: A semiconductor package structure is provided. The semiconductor package structure includes an electronic component, and an inductance component. The protection layer encapsulates the electronic component and has a top surface and a bottom surface. The top surface and the bottom surface collectively define a space to accommodate the electronic component. The inductance component outflanks the space from the top surface and the bottom surface of the protection layer.Type: GrantFiled: December 30, 2021Date of Patent: October 29, 2024Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Pao-Nan Lee, Chen-Chao Wang, Chang Chi Lee
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Publication number: 20240230739Abstract: A measurement device and a method of measuring a radiation pattern by using the same are provided. The measurement device includes at least one positioner configured to move a first antenna for measuring a main lobe and a back lobe of an electromagnetic wave radiated from the first antenna.Type: ApplicationFiled: January 6, 2023Publication date: July 11, 2024Applicants: Advanced Semiconductor Engineering, Inc., National Chung Cheng UniversityInventors: Sheng-Chi HSIEH, Chen-Chao WANG, Sheng-Fuh CHANG, Chia-Chan CHANG, Shih-Cheng LIN, Yuan-Chun LIN, Wei-Lun HSU, Kuo-Hung CHENG
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Publication number: 20240194999Abstract: A robot includes a limit device and an energy storehouse, the limiting device may lock or loosen a battery opened in the energy storehouse, the limiting device includes a first connecting member, a transmission rod, and a second connecting member. The first connecting member includes a first main body portion and two first connecting elements arranged at intervals. The two first connecting elements are respectively connected to the first main body. The transmission rod includes a first end and a second end arranged at intervals. The first end penetrates through one of the two first connecting elements. The second end penetrates through the other one of the two first connecting element. The second connecting member includes two indexing buckles arranged at intervals, each of the indexing buckles includes a first limiting groove and a second limiting groove.Type: ApplicationFiled: February 21, 2024Publication date: June 13, 2024Inventors: CHEN-TING KAO, CHI-CHENG WEN, YU-SHENG CHANG, CHIH-CHENG LEE, CHIUNG-HSIANG WU, SHENG-LI YEN, YU-CHENG ZHANG, CHANG-JU HSIEH, CHEN CHAO
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Publication number: 20240186193Abstract: A semiconductor package structure and a method for manufacturing the same are provided. The method includes: providing a package body includes a first semiconductor device, wherein the first semiconductor device includes a plurality of first electrical contacts disposed adjacent to an active surface of the first semiconductor device; measuring the actual positions of the first electrical contacts of the first semiconductor device; providing a plurality of second electrical contacts outside the first semiconductor device; and forming an interconnection structure based on the actual positions of the first electrical contacts of the first semiconductor device and the positions of the second electrical contacts satisfying a predetermined electrical performance criterion by a mask-less process, so as to connect the first electrical contacts and the second electrical contacts and maintain signal integrity during transmission.Type: ApplicationFiled: February 12, 2024Publication date: June 6, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Chen-Chao WANG, Chih-Yi HUANG, Keng-Tuan CHANG