Abstract: Partial barrier-free vias and methods for forming such are disclosed herein. An exemplary interconnect structure of a multilayer interconnect feature includes a dielectric layer. A cobalt-comprising interconnect feature and a partial barrier-free via are disposed in the dielectric layer. The partial barrier-free via includes a first via plug portion disposed on and physically contacting the cobalt-comprising interconnect feature and the dielectric layer, a second via plug portion disposed over the first via plug portion, and a via barrier layer disposed between the second via plug portion and the first via plug portion. The via barrier layer is further disposed between the second via plug portion and the dielectric layer. The cobalt-comprising interconnect feature can be a device-level contact or a conductive line of the multilayer interconnect feature. The first via plug portion and the second via plug portion can include tungsten, cobalt, and/or ruthenium.

Abstract: Various embodiments of the present disclosure are directed towards an optoelectronic device. The device includes a substrate, and a germanium photodiode region extending into an upper surface of the substrate. The germanium photodiode region has a curved upper surface that extends past the upper surface of the substrate. A silicon cap overlies the curved upper surface of the germanium photodiode region. There is an absence of oxide between the curved upper surface of the germanium photodiode region and an upper surface of the silicon cap.

Abstract: A bridge device for bridging a host device and a data storage device includes a first controller and a second controller. The first controller includes a first transmission interface. The second controller is coupled to the first controller and includes a second transmission interface. The second transmission interface is coupled to the first transmission interface through a bus. The first transmission interface operates in a slave mode and the second transmission interface operates in a master mode. The first transmission interface and the second transmission interface generate multiple transfer data chunks in compliance with a common bridge transfer format to perform transfer operations in dual directions for respectively transferring a command and data between a host device and a data storage device.

Abstract: A package structure includes a package substrate, an organic interposer and an electronic unit. The package substrate includes a plurality of first pads. The organic interposer is disposed on the package substrate and includes a plurality of second pads. The second pads are directly connected to the first pads to electrically connected the organic interposer to the package substrate. At least one of each of the first pads and each of the second pads includes a pad portion and a plurality of contact portions connecting the pad portion. A first extension direction of the pad portion is different from a second extension direction of the contact portions. The electronic unit is disposed on the organic interposer, wherein the electronic unit is electrically connected to the package substrate through the organic interposer.

Abstract: An antenna structure is capable of transceiving signals for a head-mounted wireless transmission display device including a display screen assembly. The antenna structure includes at least two body portions. Each of the body portions has at least a signal transceiving end. The body portions are respectively arranged at left and right sides of the display screen assembly. The signal transceiving ends of the body portions are extended outward from the left and right sides of the display screen assembly respectively. A first distance between the two signal transceiving ends is greater than a width of the display screen assembly.

Abstract: A semiconductor device includes: a photodiode including a germanium material portion laterally extending along a first horizontal direction, a p-doped silicon portion, and an n-doped silicon portion; and a distributed Bragg reflector including multiple periodic repetitions of a unit layer stack including a first material layer and a second material layer, wherein interfaces between vertically-extending portions of material layers within the distributed Bragg reflector are perpendicular to the first horizontal direction, and wherein the distributed Bragg reflector is in contact with the germanium material portion.

Abstract: A bridge device includes a first controller and a second controller. The first controller includes a first transmission interface. The second controller includes a second transmission interface. The first transmission interface and the second transmission interface are flash memory interfaces. In a program mode, the first transmission interface receives a first command from the second transmission interface and obtains first transfer data from a bus in response to the first command. A value of the first command is optionally set to a first value or a second value. The first value indicates a memory command transfer operation in a first direction and the second value indicates a memory data transfer operation in the first direction. The first transmission interface processes the first transfer data according to the value of the first command to obtain a memory command or written data.

Abstract: A printer for connecting an operation module includes a machine body and a plug. The machine body has a carrying plane for carrying the operation module and a supporting plane for supporting the operation module. The supporting plane is upright disposed at a side of the carrying plane. The plug is used for connecting the operation module and disposed on the body corresponds to the carrying plane. A plugging direction of the plug is defined parallel to the supporting plane.

Abstract: An illuminated touch module includes a base sheet, a light-shielding sheet, a light guide plate, a light-emitting element, and a cover plate. The base sheet is disposed on a circuit board and has a light reflection area. The light-shielding sheet is disposed above the base sheet and has a side surface and a notch recessed from the side surface. An opening of the notch is aligned with an edge of the base sheet. The light guide plate is embedded in the notch and located above the light reflection area. The light guide plate has a light guide pattern formed by microstructures and has a light incident surface. The light-emitting element is disposed on the circuit board and has a light outputting surface facing the light incident surface and the light guide pattern. The cover plate covers above the light guide plate and the light-shielding sheet.

Abstract: A method disclosed herein includes forming a polishing pad configured for a chemical-mechanical polishing (CMP) process and polishing a workpiece using the polishing pad and a CMP slurry. Forming the polishing pad includes forming an interpenetrating polymer network having a first phase and a second phase embedded in the first phase, removing the second phase from the interpenetrating polymer network, thereby forming a porous top pad that includes a network of pores embedded in the first phase, and adhering the porous top pad to a sub pad, thereby forming the polishing pad. The second phase is different from the first phase in composition, and the interpenetrating polymer network has a substantially periodic pattern. Surface roughness of the porous top pad is consistent during the polishing of the workpiece.

Abstract: A coupling system includes a chip configured to receive an optical signal, wherein an angle between a propagation direction of the optical signal and a top surface of the chip ranges from about 92-degrees to about 88-degrees. The chip includes a grating configured to receive the optical signal; and a waveguide, wherein the grating is configured to receive the optical signal and redirect the optical signal along the waveguide, and the grating is on a light incident side of the waveguide.

Abstract: A light-emitting module includes a light guide member, a first reflective paint layer, a first light-absorbing paint layer, a circuit board, and a light-emitting unit. The light guide member includes a positioning surface, a first side surface, a second side surface, and a light emergence surface. The positioning surface includes a groove. The first reflective paint layer is arranged on the first side surface, and the first light-absorbing paint layer is arranged on the first reflective paint layer. The circuit board is located on the positioning surface. The light-emitting unit is arranged on the circuit board and is accommodated in the groove. In this way, the light-emitting unit on the circuit board may change a light path and project light to the light emergence surface, thereby reducing a required stack thickness of the light-emitting module.

Abstract: A display device has a display area and a peripheral area, and includes an array substrate. The array substrate includes M number of pixel unit columns disposed in the display area and a first dummy electrode disposed in the peripheral area, where M is a positive integer greater than or equal to 2. The M number of pixel unit columns include a first pixel unit column to an Mth pixel unit column arranged in sequence. Each of the M number of pixel unit columns includes a plurality of pixel units arranged in sequence. The first dummy electrode is located on one side of the first pixel unit column. During a frame period, the first pixel unit column receives the first pixel signal, and the first dummy electrode receives the first dummy signal. The polarity of the first pixel signal is different from that of the first dummy signal.

Abstract: The method includes receiving a semiconductor device having a first surface and a second surface. The first surface is a top surface including a conductive material exposed thereon; and the second surface is an embedded surface including the conductive material and a dielectric material. The method also includes selecting a first polishing slurry to achieve a first polishing rate of the conductive material in the first polishing slurry and a second polishing rate of the dielectric material in the first polishing slurry. The method further includes selecting a second polishing slurry to achieve a third polishing rate of the conductive material in the second polishing slurry and a fourth polishing rate of the dielectric material in the second polishing slurry. The method additionally includes polishing the first surface with the first polishing slurry until the second surface is exposed; and polishing the second surface with the second polishing slurry.

Abstract: A control interface (10) for controlling a system, comprising a module comprising: a carrier (32) having a top surface and an opposite bottom surface; an elongate window formed in, or adjacent, the carrier; an elongate array of light sources (36) on the bottom surface of the carrier; a reflector arrangement (40) for reflecting light from the array of light sources towards the window (38) to escape from the top surface, such that a light path is formed between each light source and the window (38), with a portion of the light paths being parallel to the carrier (32), wherein the light sources are adapted to be turned on in response to a control signal; wherein the module further comprises: a user interface surface (20), comprising a track area (22) for receiving touch input from a user, wherein the window is formed beneath the track area; and a touch sensor circuit (34) beneath the track area (22), wherein the touch sensitive circuit (34) comprises a touch sensor region on the top surface of the carrier (32);

Abstract: A photonic device includes a silicon layer, wherein the silicon layer includes a waveguide portion. The photonic device further includes a cladding layer over the waveguide portion, wherein the cladding layer partially exposes a surface of the waveguide portion. The photonic device further includes a low refractive index layer in direct contact with the cladding layer, wherein the low refractive index layer comprises silicon oxide, silicon carbide, silicon oxynitride, silicon carbon oxynitride, aluminum oxide or hafnium oxide. The photonic device further includes an interconnect structure over the low refractive index layer.

Abstract: An antenna structure capable of transmitting a WiGig band for a head-mounted wireless transmission display device including a display screen and an overhead device is disclosed. The antenna structure includes at least two body portions, each of the body portions having at least a signal transceiving end, the body portions are respectively arranged at left and right sides of the display screen, and signal transceiving ends of the body portions are extended outward from the left and right sides of the display screen respectively.

Abstract: A physiological signal monitoring device includes a base including a base body that has a bottom plate and an opening, a biosensor mounted to the base, and a transmitter removably mounted to the base body. The base further includes a first coupling structure disposed on a top surface of the bottom plate, and the transmitter includes a second coupling structure coupled to the first coupling structure when the transmitter is mounted to the base body. When the first and second coupling structures are coupled to each other, they are disposed to be distal from a periphery cooperatively defined by the base and the transmitter. They are uncoupled from each other when an external force is applied through the opening of the base body to separate the transmitter from the base.

Abstract: An integrated circuit (IC) chip with polish stop layers and a method of fabricating the IC chip are disclosed. The method includes forming a first IC chip having a device region and a peripheral region. Forming the first IC chip includes forming a device layer on a substrate, forming an interconnect structure on the device layer, depositing a first dielectric layer on a first portion of the interconnect structure in the peripheral region, depositing a second dielectric layer on the first dielectric layer and on a second portion of the interconnect structure in the device region, and performing a polishing process on the second dielectric layer to substantially coplanarize a top surface of the second dielectric layer with a top surface of the first dielectric layer. The method further includes performing a bonding process on the second dielectric layer to bond a second IC chip to the first IC chip.

Abstract: A display apparatus including a display panel, a first light source module, and a second light source module is disclosed. The display panel has a display surface and a back surface away from the display surface. The first light source module is disposed on a side of one of the display surface and the back surface of the display panel, and overlaps the display surface. The second light source module is disposed on a side of the other one of the display surface and the back surface of the display panel, and overlaps the display surface.