Abstract: A semiconductor package includes a first die stack structure and a second die stack structure, an insulating encapsulation, a redistribution structure, at least one prism structure and at least one reflector. The first die stack structure and the second die stack structure are laterally spaced apart from each other along a first direction, and each of the first die stack structure and the second die stack structure comprises an electronic die; and a photonic die electronically communicating with the electronic die. The insulating encapsulation laterally encapsulates the first die stack structure and the second die stack structure. The redistribution structure is disposed on the first die stack structure, the second die stack structure and the insulating encapsulation, and electrically connected to the first die stack structure and the second die stack structure. The at least one prism structure is disposed within the redistribution structure and optically coupled to the photonic die.

Abstract: A memory device includes a main array comprising main memory cells; a redundancy array comprising redundancy memory cells; and write circuitry configured to perform a first programming operation on a main memory cell, to detect whether a current of the main memory cell exceeds a predefined current threshold during the first programming operation, and to disable a second programming operation for a redundancy memory cell if the current of the main memory cell exceeds the predefined current threshold during the first programming operation.

Abstract: A membrane touch panel device includes a circuit board unit, a light-blocking frame plate, a plurality of light-blocking tabs, and an operation panel unit that are stacked along a front-rear direction. The circuit board unit includes a circuit board having a plurality of keypad circuits, and a plurality of LEDs being electrically connected to the circuit board. A light transmission rate of the circuit board ranges from 0% to 20%. The light-blocking frame plate is stacked on the circuit board, and defines a hollow section provided for the LEDs to protrude thereinto. The light-blocking tabs are connected to the light-blocking frame plate such that the light-blocking tabs respectively cover the LEDs. The operation panel unit is stacked on the light-blocking frame plate, and has a plurality of key segments being respectively aligned with the keypad circuits, and being adapted to permit light generated by the LEDs to pass therethrough.

Abstract: The present disclosure, in some embodiments, relates to an integrated chip. The integrated chip includes a first gate structure over a substrate and laterally surrounded by a first sidewall spacer. The first gate structure protrudes outward from a top of the first sidewall spacer. A second gate structure is over the substrate and is laterally surrounded by a second sidewall spacer. The first gate structure has a first height that is larger than a second height of the second gate structure. The first sidewall spacer has a first cross-sectional profile that is a different shape and a different size than a second cross-sectional profile of the second sidewall spacer.

Abstract: An application of a cloud-based controller forwards a message to a message broker of the cloud-based controller. The message is then transmitted to a network device of a wireless communications network over a persistent hypertext transfer protocol (“HTTP”) connection. Thereafter, an acknowledgment is received in response to transmitting the message at a gRPC proxy for the message broker.

Abstract: Epitaxial source/drain structures for enhancing performance of multigate devices, such as fin-like field-effect transistors (FETs) or gate-all-around (GAA) FETs, and methods of fabricating the epitaxial source/drain structures, are disclosed herein. An exemplary device includes a dielectric substrate. The device further includes a channel layer, a gate disposed over the channel layer, and an epitaxial source/drain structure disposed adjacent to the channel layer. The channel layer, the gate, and the epitaxial source/drain structure are disposed over the dielectric substrate. The epitaxial source/drain structure includes an inner portion having a first dopant concentration and an outer portion having a second dopant concentration that is less than the first dopant concentration. The inner portion physically contacts the dielectric substrate, and the outer portion is disposed between the inner portion and the channel layer. In some embodiments, the outer portion physically contacts the dielectric substrate.

Abstract: A bandgap circuit with adaptive start-up design is shown, which includes a bandgap core and a start-up circuit. The bandgap core uses paired bipolar transistors (BJTs) to eliminate temperature-sensitive factors and thereby generate a bandgap voltage that is independent of temperature variations. The start-up circuit couples an emitter terminal of a first BJT of the paired BJTs to a power line to start up the bandgap core. The start-up circuit includes a reference BJT that provides a threshold voltage as a reference for disconnecting the power line from the emitter terminal of the first BJT.

Abstract: A motor drive unit for driving a motor of a motorized window treatment may comprise software-based and hardware-based implementations of a process for detecting and resolving a stall condition in the motor, where the hardware-based implementation is configured to reduce power delivered to the motor if the software-based implementation has not first reduced the power to the motor. A control circuit may detect a stall condition of the motor, and reduce the power delivered to the motor after a first period of time from first detecting the stall condition. The motor drive unit may comprise a stall prevention circuit configured to reduce the power delivered to the motor after a second period of time (e.g., longer than the first period of time) from determining that a rotational sensing circuit is not generating a sensor signal while the control circuit is generating a drive signal to rotate the motor.

Abstract: Methods and devices including an air gap adjacent a contact element extending to a source/drain feature of a device are described. Some embodiments of the method include depositing a dummy layer, which is subsequently removed to form the air gap. The dummy layer and subsequent air gap may be formed after a SAC dielectric layer such as silicon nitride is formed over an adjacent metal gate structure.

Abstract: A memory device and method of making the same are disclosed. The memory device includes transistor devices located in both a memory region and a logic region of the device. Transistor devices in the memory region include sidewall spacers having a first oxide layer over a side surface of a gate structure, a first nitride layer over the first oxide layer, a second oxide layer over the first nitride layer, and a second nitride layer over the second oxide layer. Transistor devices in the logic region include sidewall spacers having a first oxide layer over a side surface of a gate structure, a first nitride layer over the first oxide layer, and a second nitride layer over the first nitride layer.

Abstract: A device includes a gate stack; a gate spacer on a sidewall of the gate stack; a source/drain region adjacent the gate stack; a silicide; and a source/drain contact electrically connected to the source/drain region through the silicide. The silicide includes a conformal first portion in the source/drain region, the conformal first portion comprising a metal and silicon; and a conformal second portion over the conformal first portion, the conformal second portion further disposed on a sidewall of the gate spacer, the conformal second portion comprising the metal, silicon, and nitrogen.

Abstract: A gripper device includes a base and two gripping assemblies, each including a gripping member, a stand, and an elastic member. The gripping member includes a gripping portion and a supporting portion. The stand is movably disposed to the base and includes a connecter and a supporter. The supporting portion is pivotally connected to the supporter at a position between the gripping portion and the connecter so that the gripping member is pivotable relative to the stand. Two opposite ends of the elastic member are respectively connected to the supporting portion and the connecter. When one of the gripping portions touches an object, the gripping member pivots relative to the corresponding stand. Therefore, gripping a target may not be interrupted by interference objects around the target.

Abstract: The present disclosure provides semiconductor devices and methods of forming the same. A semiconductor device according to one embodiment of the present disclosure includes a first fin-shaped structure extending lengthwise along a first direction over a substrate, a first epitaxial feature over a source/drain region of the first fin-shaped structure, a gate structure disposed over a channel region of the first fin-shaped structure and extending along a second direction perpendicular to the first direction, and a source/drain contact over the first epitaxial feature. The bottom surface of the gate structure is closer to the substrate than a bottom surface of the source/drain contact.

Abstract: Semiconductor devices and methods of fabricating semiconductor devices are provided. The present disclosure provides a semiconductor device that includes a first fin structure and a second fin structure each extending from a substrate; a first gate segment over the first fin structure and a second gate segment over the second fin structure; a first isolation feature separating the first and second gate segments; a first source/drain (S/D) feature over the first fin structure and adjacent to the first gate segment; a second S/D feature over the second fin structure and adjacent to the second gate segment; and a second isolation feature also disposed in the trench. The first and second S/D features are separated by the second isolation feature, and a composition of the second isolation feature is different from a composition of the first isolation feature.

Abstract: Semiconductor devices and methods are provided. An exemplary method according to the present disclosure includes providing a workpiece having a channel region, a gate structure over the channel region, gate spacers extending along sidewalls of the gate structure, and an etch stop layer extending along sidewalls of the gate spacers. The method also includes performing an etching process to recess the gate spacers and the gate structure, thereby forming a funnel-shaped trench, depositing a dielectric layer over the workpiece to partially fill the funnel-shaped trench, etching back the dielectric layer to form dielectric spacers on the recessed gate spacers, forming a metal cap on the gate structure without forming the metal cap on the recessed gate spacers, and forming a dielectric cap on the metal cap.

Abstract: A semiconductor structure and a method of forming the same are provided. In an embodiment, an exemplary semiconductor structure includes a gate structure disposed over a channel region of an active region, a drain feature disposed over a drain region of the active region; a source feature disposed over a source region of the active region, a backside source contact disposed under the source feature, an isolation feature disposed on and in contact with the source feature, a drain contact disposed over and electrically coupled to the drain feature, and a gate contact via disposed over and electrically coupled to the gate structure. A distance between the gate contact via and the drain contact is greater than a distance between the gate contact via and the isolation feature. The exemplary semiconductor structure would have a reduced parasitic capacitance and an enlarged leakage window.

Abstract: A memory circuit includes a bank of non-volatile memory (NVM) devices, a high-voltage (HV) driver, a global HV power switch configured to generate a HV power signal, and a HV power switch coupled between the global HV switch and the HV driver. The HV power switch is configured to, responsive to the HV power signal, output power and ground signals, each of the power signal and the ground signal having first and second voltage levels, and the HV driver is configured to output a HV activation signal to a column of the bank of NVM devices responsive to the power signal and the ground signal.

Abstract: A semiconductor arrangement includes a photodiode extending to a first depth from a first side in a substrate. An isolation structure laterally surrounds the photodiode and includes a first well that extends into a first side of the substrate. A deep trench isolation extends into a second side of the substrate and at least a portion of the deep trench isolation underlies the first well.

Abstract: An anti-fuse array includes first through fourth adjacent anti-fuse bit columns, the anti-fuse bits of the first and second anti-fuse bit columns including portions of active areas of a first active area column, and the anti-fuse bits of the third and fourth anti-fuse bit columns including portions of active areas of a second active area column. Each row of a first set of conductive segment rows includes first and second conductive segments positioned between adjacent active areas of the first active area column and a third conductive segment positioned between adjacent active areas of the second active area column. Each row of a second set of conductive segments alternating with the first set of conductive segment rows includes a fourth conductive segment positioned between adjacent active areas of the first active area column and fifth and sixth conductive segments positioned between adjacent active areas of the second active area column.

Abstract: A projection system and a projection image adjustment method thereof are provided. The projection image adjustment method is applicable to a processing device connected to multiple projectors, a display, and an input device, and includes the following steps. Arrangement information between the multiple projectors is obtained. Multiple adjustable areas corresponding to a projection image of each projector are simultaneously displayed on the display and the multiple adjustable areas are simultaneously displayed on projection images of the multiple projectors according to the arrangement information. A parameter setting interface corresponding to a first adjustable area among the multiple adjustable areas is displayed on the display. The first adjustable area corresponds to a first projector among the multiple projectors.